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AM5749ABZXEA

Texas Instruments

AM5749ABZXEA by Texas Instruments

The Texas Instruments AM5749ABZXEA microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 105 °C with a max clock frequency of 38.4 MHz.

Median Price

$109.715

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 261 parts In-Stock

1+ parts

$84.130

100+ parts

$81.600

1k+ parts

$63.256

10k+ parts

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261

$84.130

$81.600

$63.256

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Mouser Electronics

USA . 2 parts In-Stock

1+ parts

$135.300

100+ parts

$102.460

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-

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2

$135.300

$102.460

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,791 parts In-Stock

1+ parts

$79.924

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-

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1,791

$79.924

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Nova Conductors

Japan . 450 parts In-Stock

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$87.790

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450

$87.790

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Vyrian

USA . 7,230 parts In-Stock

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7,230

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VNN

France . 2,791 parts In-Stock

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2,791

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 466 parts In-Stock

1+ parts

$11.657

100+ parts

-

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466

$11.657

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Corohmni

South Africa . 348 parts In-Stock

1+ parts

$41.508

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348

$41.508

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Parana Technologies

USA . 322 parts In-Stock

1+ parts

$66.417

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-

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322

$66.417

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Ampacity Inc.

Singapore . 132 parts In-Stock

1+ parts

$71.510

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132

$71.510

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Semicontronic

India . 17 parts In-Stock

1+ parts

$71.510

100+ parts

$69.722

1k+ parts

$69.365

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17

$71.510

$69.722

$69.365

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ChromeModa Solutions

Germany . 1,604 parts In-Stock

1+ parts

$74.626

100+ parts

$61.193

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-

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1,604

$74.626

$61.193

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IDEA Electronic Components Group

UK . 643 parts In-Stock

1+ parts

$74.626

100+ parts

$70.895

1k+ parts

$67.163

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643

$74.626

$70.895

$67.163

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Corphita

USA . 2,135 parts In-Stock

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$75.717

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2,135

$75.717

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Continental Prestige Electronics

USA . 4,462 parts In-Stock

1+ parts

$87.790

100+ parts

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10k+ parts

$86.034

4,462

$87.790

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-

$86.034

Microchip USA

USA . 1,357 parts In-Stock

1+ parts

$132.970

100+ parts

$130.660

1k+ parts

$129.500

10k+ parts

$128.350

1,357

$132.970

$130.660

$129.500

$128.350

QUARKTWIN TECHNOLOGY LTD

USA . 13,377 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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DigiPath Technology Company

USA . 912 parts In-Stock

1+ parts

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$67.283

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912

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$67.283

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Argo Parts USA

USA . 455 parts In-Stock

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455

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Netroflash

USA . 50 parts In-Stock

1+ parts

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100+ parts

$86.034

1k+ parts

$83.400

10k+ parts

$81.644

50

-

$86.034

$83.400

$81.644

Overview

Experience unparalleled performance and reliability with the Texas Instruments AM5749ABZXEA microprocessor. Crafted by a trusted industry leader, this cutting-edge technology offers seamless integration and optimized efficiency for a wide range of applications. Elevate your projects with the superior quality and advanced features of this microprocessor, designed to deliver value and innovation to customers seeking top-of-the-line performance. Trust in Texas Instruments to provide you with the tools you need to succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the product lightweight and durable.

Integrated Cache: YES

Having integrated cache helps improve the processing speed and efficiency of the microprocessor.

Surface Mount: YES

The surface mount feature makes it easy to install and replace the microprocessor on a circuit board.

Maximum Supply Voltage: 1.2 V

The low maximum supply voltage helps in keeping power consumption low and improving energy efficiency.

Address Bus Width: 16

A wider address bus width allows for faster data transfer within the microprocessor, enhancing performance.

Package Shape: SQUARE

The square package shape makes it easy to fit the microprocessor into various device designs.

No. of Terminals: 760

Having a large number of terminals provides various connection options for different functions.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design with efficient signal routing capabilities.

Minimum Supply Voltage: 1.11 V

The low minimum supply voltage ensures stable performance without overheating or power issues.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows the microprocessor to handle demanding tasks without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the microprocessor can function in various environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides good conductivity and corrosion resistance, ensuring reliability.

Terminal Position: BOTTOM

The bottom terminal position makes it convenient for soldering and connecting the microprocessor to a circuit board.

Maximum Seated Height: 1.63 mm

The low maximum seated height allows for a compact overall design when integrating the microprocessor into devices.

Width: 23 mm

The standard width of 23 mm allows for easy integration into various device designs.

Boundary Scan: YES

The boundary scan feature helps in testing and debugging the microprocessor during the manufacturing process.

External Data Bus Width: 32

A wider external data bus width allows for faster data transfer between the microprocessor and peripherals.

Maximum Clock Frequency: 38.4 MHz

The high maximum clock frequency enables quick processing of instructions and tasks.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature helps in preventing damage to the microprocessor during soldering.

Peak Reflow Temperature °C: 250

The high peak reflow temperature tolerance ensures the microprocessor can withstand the soldering process without issues.

Length: 23 mm

The standard length of 23 mm allows for easy integration into various device designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the microprocessor can operate reliably in harsh environmental conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor, it offers efficient and streamlined processing of instructions for improved performance.

Technology: CMOS

The CMOS technology used in the microprocessor provides low power consumption and high speed performance.

Terminal Form: BALL

The ball terminal form allows for reliable connections and easy installation on a circuit board.

Nominal Supply Voltage: 1.15 V

The nominal supply voltage provides a stable power source for consistent performance.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8 mm allows for compact packaging and efficient signal routing.

Format: FIXED POINT

The fixed point format offers precise and accurate calculations in numerical processing.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates a moderate sensitivity to moisture, ensuring proper storage and handling procedures are followed.

Speed: 1500 rpm

The high speed of 1500 rpm allows for quick data processing and response times.

Low Power Mode: YES

The low power mode feature helps conserve energy and extend the battery life of devices using the microprocessor.

Technical Specifications

Microprocessors AM5749ABZXEA attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

1.63 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM5749ABZXEA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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