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AM5729BABCXEAR

Texas Instruments

AM5729BABCXEAR by Texas Instruments

The Texas Instruments AM5729BABCXEAR microprocessor features 32-bit external data bus width, 16-bit address bus width, and a max clock frequency of 32 MHz. Ideal for industrial applications requiring high-speed processing with low power consumption.

Median Price

$85.529

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,065 parts In-Stock

1+ parts

$79.749

100+ parts

$77.351

1k+ parts

$59.962

10k+ parts

-

2,065

$79.749

$77.351

$59.962

-

DigiKey

USA . 455 parts In-Stock

1+ parts

$125.640

100+ parts

$95.505

1k+ parts

$92.921

10k+ parts

-

455

$125.640

$95.505

$92.921

-

Avnet

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$85.529

10k+ parts

$81.305

250

-

-

$85.529

$81.305

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$68.043

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$68.043

-

-

-

Digiode

USA . 2,615 parts In-Stock

1+ parts

$75.762

100+ parts

-

1k+ parts

-

10k+ parts

-

2,615

$75.762

-

-

-

VNN

France . 34,058 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

34,058

-

-

-

-

Vyrian

USA . 7,871 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,871

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,265 parts In-Stock

1+ parts

$43.622

100+ parts

-

1k+ parts

-

10k+ parts

-

2,265

$43.622

-

-

-

DigiPath Technology Company

USA . 1,661 parts In-Stock

1+ parts

$48.033

100+ parts

-

1k+ parts

-

10k+ parts

-

1,661

$48.033

-

-

-

ChromeModa Solutions

Germany . 4,315 parts In-Stock

1+ parts

$49.013

100+ parts

$40.191

1k+ parts

-

10k+ parts

-

4,315

$49.013

$40.191

-

-

IDEA Electronic Components Group

UK . 1,300 parts In-Stock

1+ parts

$49.013

100+ parts

$46.562

1k+ parts

$44.112

10k+ parts

-

1,300

$49.013

$46.562

$44.112

-

Ampacity Inc.

Singapore . 899 parts In-Stock

1+ parts

$67.790

100+ parts

-

1k+ parts

-

10k+ parts

-

899

$67.790

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$68.043

100+ parts

-

1k+ parts

$64.641

10k+ parts

$63.280

100

$68.043

-

$64.641

$63.280

Corphita

USA . 3,493 parts In-Stock

1+ parts

$71.774

100+ parts

-

1k+ parts

-

10k+ parts

-

3,493

$71.774

-

-

-

Corohmni

South Africa . 22 parts In-Stock

1+ parts

$74.637

100+ parts

-

1k+ parts

-

10k+ parts

-

22

$74.637

-

-

-

Argo Parts USA

USA . 4,477 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,477

-

-

-

-

Continental Prestige Electronics

USA . 4,272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,272

-

-

-

-

GreenTree Electronics

Israel . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

750

-

-

-

-

Overview

Experience unparalleled performance and reliability with the Texas Instruments AM5729BABCXEAR Microprocessor. Boasting top-quality manufacturing by Texas Instruments, this cutting-edge device offers a wide range of applications in various industries. From industrial automation to consumer electronics, this microprocessor delivers exceptional value, efficiency, and versatility. Trust in Texas Instruments for superior technology that meets your needs and exceeds your expectations. Elevate your projects with the AM5729BABCXEAR Microprocessor today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight, durable, and cost-effective, making it an ideal choice for packaging microprocessors.

Surface Mount: YES

Surface mount technology allows for easy installation and replacement of the microprocessor on the circuit board, saving time and effort.

Maximum Supply Voltage: 1.2 V

Operating at a maximum supply voltage of 1.2 V ensures efficient power consumption and reliability for the microprocessor.

Address Bus Width: 16

A wider address bus allows the microprocessor to access and communicate with a larger range of memory locations, enhancing its performance.

Package Shape: SQUARE

The square package shape provides a compact design, optimizing space utilization on the circuit board.

No. of Terminals: 760

Having a high number of terminals allows for more connections and functionalities, increasing the versatility of the microprocessor.

Package Style: GRID ARRAY, FINE PITCH

The grid array with fine pitch style ensures a secure and precise connection between the microprocessor and the circuit board, minimizing errors and signal interference.

Minimum Supply Voltage: 1.11 V

Operating at a minimum supply voltage of 1.11 V ensures stable performance even under low power conditions, enhancing the reliability of the microprocessor.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105 °C, the microprocessor can withstand intense heat conditions without compromising its performance.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40 °C ensures that the microprocessor can function effectively even in extreme cold environments.

Technical Specifications

Microprocessors AM5729BABCXEAR attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA760,28X28,31

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.96 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM5729BABCXEAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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