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AM5708BCBDJA

Texas Instruments

AM5708BCBDJA by Texas Instruments

AM5708BCBDJA by Texas Instruments is a microprocessor with integrated cache and surface mount capability. It has a max supply voltage of 1.2V and an address bus width of 16. This processor is commonly used in industrial applications requiring high performance and low power consumption.

Median Price

$58.284

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 824 parts In-Stock

1+ parts

$43.547

100+ parts

$38.708

1k+ parts

$28.462

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824

$43.547

$38.708

$28.462

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DigiKey

USA . 143 parts In-Stock

1+ parts

$73.020

100+ parts

$59.276

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143

$73.020

$59.276

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Distributors (In-Stock)

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Digiode

USA . 2,063 parts In-Stock

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$41.370

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2,063

$41.370

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Nova Conductors

Japan . 100 parts In-Stock

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$43.510

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100

$43.510

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Chip Stock

USA . 5,413 parts In-Stock

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5,413

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Vyrian

USA . 3,582 parts In-Stock

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VNN

France . 1,429 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 890 parts In-Stock

1+ parts

$7.642

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890

$7.642

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Parana Technologies

USA . 275 parts In-Stock

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$36.446

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275

$36.446

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Ampacity Inc.

Singapore . 11 parts In-Stock

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$37.010

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$37.010

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Corphita

USA . 2,182 parts In-Stock

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$39.192

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$39.192

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DigiPath Technology Company

USA . 1,884 parts In-Stock

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$40.131

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$36.921

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1,884

$40.131

$36.921

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ChromeModa Solutions

Germany . 6,610 parts In-Stock

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$40.950

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$33.579

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6,610

$40.950

$33.579

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IDEA Electronic Components Group

UK . 2,195 parts In-Stock

1+ parts

$40.950

100+ parts

$38.902

1k+ parts

$36.855

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2,195

$40.950

$38.902

$36.855

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Continental Prestige Electronics

USA . 5,781 parts In-Stock

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$43.510

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$42.640

5,781

$43.510

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$42.640

Netroflash

USA . 1,000 parts In-Stock

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$43.510

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$43.510

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Corohmni

South Africa . 340 parts In-Stock

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$45.989

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340

$45.989

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Microchip USA

USA . 2,499 parts In-Stock

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$87.580

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$86.060

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$85.290

10k+ parts

$84.530

2,499

$87.580

$86.060

$85.290

$84.530

Lixinc

USA . 9,304 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Argo Parts USA

USA . 338 parts In-Stock

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Perfect Parts

USA . 202 parts In-Stock

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Overview

Experience the power of the AM5708BCBDJA microprocessor by Texas Instruments. As a leader in the industry, Texas Instruments guarantees the highest quality and reliability in their products. The AM5708BCBDJA offers unmatched performance and efficiency, making it perfect for a wide range of applications. With its integrated cache and low power mode, this microprocessor delivers exceptional speed and energy savings. Whether you're working on IoT devices, industrial automation, or consumer electronics, the AM5708BCBDJA is your go-to solution. Trust in Texas Instruments to provide you with the cutting-edge technology you need to stay ahead in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

− The plastic/epoxy package body material provides durability and enhances the product's resistance to external factors, making it a reliable choice for various applications.

Integrated Cache: YES

− The inclusion of integrated cache improves the microprocessor's performance by reducing memory access times, resulting in faster data retrieval and improved overall efficiency.

Surface Mount: YES

− With surface mount capability, the microprocessor can be easily mounted on printed circuit boards (PCBs), enabling seamless integration and compact design in electronic systems.

Maximum Supply Voltage: 1.2 V

− The microprocessor's ability to operate at a maximum supply voltage of 1.2 V allows for efficient power consumption, contributing to energy-saving and longer battery life in portable devices.

Address Bus Width: 16

− The 16-bit address bus width enables the microprocessor to access a larger memory space, facilitating complex calculations and enhancing the overall performance of the product.

Package Shape: SQUARE

− The square package shape provides easy handling and efficient space utilization, making it suitable for compact electronic designs where space is limited.

No. of Terminals: 538

− The 538 terminals offer a wide range of connection options, allowing for versatile integration and compatibility with various external components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

− The grid array package style with low profile and fine pitch leads ensures high-density packaging, enabling miniaturization and improved thermal management in tight spaces.

Minimum Supply Voltage: 1.11 V

− Operating at a minimum supply voltage of 1.11 V allows for even lower power consumption, making the microprocessor suitable for applications where energy efficiency is a priority.

Maximum Operating Temperature: 105 °C

− The microprocessor's ability to operate at a maximum temperature of 105°C ensures reliable performance and stability even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

− With a minimum operating temperature of -40°C, the microprocessor can withstand extremely cold conditions, making it suitable for use in a wide range of climates and environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

− The use of tin/silver/copper terminal finish enhances the microprocessor's solderability and improves its resistance to corrosion, ensuring long-term reliability and durability.

Terminal Position: BOTTOM

− The microprocessor's bottom terminal position simplifies PCB layout and assembly, allowing for easier and more convenient installation in electronic systems.

Maximum Seated Height: 1.298 mm

− The microprocessor's low seated height aids in achieving compact product designs, particularly in applications with height restrictions, without sacrificing performance.

Width: 17 mm

− The narrow width of 17 mm facilitates space-saving integration in compact electronic devices and systems, making it ideal for applications where size is a crucial factor.

Boundary Scan: YES

− The inclusion of boundary scan capability allows for efficient testing and debugging of the microprocessor during production, ensuring higher manufacturing yields and overall product reliability.

External Data Bus Width: 32

− The 32-bit external data bus width enables faster data transfer between the microprocessor and external devices, enhancing overall system performance and responsiveness.

Maximum Clock Frequency: 38.4 MHz

− Operating at a maximum clock frequency of 38.4 MHz ensures high-speed computation and data processing, making the microprocessor suitable for tasks requiring real-time responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

− With the ability to withstand peak reflow temperature for a maximum duration of 30 seconds, the microprocessor offers robust solder joint reliability during the manufacturing process.

Peak Reflow Temperature °C: 260

− The microprocessor's peak reflow temperature of 260°C ensures proper solder reflow during assembly, resulting in improved solder joint quality and long-term reliability.

Length: 17 mm

− The compact length of 17 mm contributes to space-efficient designs, particularly in applications with limited available space, without compromising the microprocessor's functionality.

Temperature Grade: INDUSTRIAL

− Designed for industrial-grade applications, the microprocessor can operate reliably in harsh and demanding environments, making it a durable choice for rugged applications.

Peripheral IC Type: MICROPROCESSOR, RISC

− As a microprocessor with Reduced Instruction Set Computing (RISC) architecture, this product offers high-performance execution of instructions, enabling efficient processing of complex tasks.

Technology: CMOS

− The CMOS (Complementary Metal-Oxide-Semiconductor) technology used in the microprocessor enables low power consumption, ensuring energy efficiency and longer battery life in portable devices.

Terminal Form: BALL

− The microprocessor's ball terminal form simplifies the assembly process and improves the reliability of solder joints, contributing to overall product durability.

Nominal Supply Voltage: 1.15 V

− Operating at a nominal supply voltage of 1.15 V ensures consistent and stable power delivery, enabling reliable operation and stable performance of the microprocessor.

Terminal Pitch: 0.65 mm

− The 0.65 mm terminal pitch offers precise connectivity options and compatibility with mating connectors, facilitating reliable and easy integration into electronic systems.

Format: FIXED POINT

− With a fixed-point format, the microprocessor provides efficient and accurate arithmetic calculations, making it suitable for applications requiring precise numerical computations.

Moisture Sensitivity Level (MSL): 3

− The moisture sensitivity level of 3 indicates that the microprocessor has a moderate sensitivity to moisture absorption, resulting in good moisture resistance during storage and assembly.

Speed: 1000 rpm

− Operating at a speed of 1000 revolutions per minute (rpm), the microprocessor enables fast data processing and execution, delivering high-performance computing capabilities.

Low Power Mode: YES

− The microprocessor's low power mode functionality allows it to operate in a power-efficient state, reducing energy consumption and extending battery life, making it ideal for battery-powered devices.

Technical Specifications

Microprocessors AM5708BCBDJA attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B538

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

538

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.298 mm

Speed:

1000 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM5708BCBDJA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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