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MC7448VU800ND

NXP Semiconductors

MC7448VU800ND by NXP Semiconductors

MC7448VU800ND by NXP Semiconductors is a 32-bit microprocessor with max clock freq of 800 MHz. Operating at 0-105°C, it has low power mode and requires supply voltage of 0.95-1.3 V. Ideal for applications needing high-speed processing in compact spaces.

Median Price

$206.448

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

MC7448VU800ND by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 2,477 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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$206.448

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Flip Electronics

USA . 9,156 parts In-Stock

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Vyrian

USA . 2,304 parts In-Stock

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Anansix

USA . 1,810 parts In-Stock

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Digiode

USA . 166 parts In-Stock

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One Stop Electronics

USA . 2,302 parts In-Stock

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$20.000

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Ampacity Inc.

Singapore . 2,297 parts In-Stock

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$33.000

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Continental Prestige Electronics

USA . 5,697 parts In-Stock

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$206.424

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$202.296

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Microchip USA

USA . 1,885 parts In-Stock

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$338.400

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UNI Independent Distributors

Spain . 5,619 parts In-Stock

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Bastille Electronics

Australia . 3,511 parts In-Stock

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Corphita

USA . 1,061 parts In-Stock

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Argo Parts USA

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Overview

Experience the power of innovation with the MC7448VU800ND microprocessor from NXP Semiconductors. Crafted with precision and advanced technology, this cutting-edge processor offers unparalleled performance and reliability for a wide range of applications. From high-speed computing to seamless multitasking, this versatile chip delivers exceptional value and efficiency. Take your projects to the next level with the MC7448VU800ND and unleash the full potential of your devices. Transform your ideas into reality with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability, ensuring a long lifespan for the product.

Surface Mount: YES

Ease of installation and space-saving design make this product convenient for various applications.

Maximum Supply Voltage: 1.05 V

Efficient power consumption and compatibility with low voltage systems.

Package Shape: SQUARE

Compact design allows for easy integration into tight spaces.

Bit Size: 32

Suitable for handling complex computations and tasks efficiently.

Power Supplies (V): 1.3,1.8/2.5

Versatile power supply options for different performance requirements.

No. of Terminals: 360

High number of terminals allow for versatile connectivity options.

Package Style (Meter): GRID ARRAY

Grid array package style provides better thermal performance and signal integrity.

Minimum Supply Voltage: 0.95 V

Allows for operation in low-power environments without sacrificing performance.

Maximum Operating Temperature: 105 °C

Can operate efficiently in high-temperature environments without overheating.

Minimum Operating Temperature: 0 °C

Can operate in a wide range of temperatures, suitable for various environments.

Terminal Position: BOTTOM

Bottom terminal position allows for easy PCB layout and design.

Maximum Seated Height: 2.8 mm

Low profile design minimizes space requirements in the system.

Width: 25 mm

Compact width allows for easy integration into different systems and designs.

Maximum Clock Frequency: 800 MHz

High clock frequency for fast processing and performance.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperatures for a sufficient amount of time during manufacturing.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during manufacturing processes.

Length: 25 mm

Compact length for easy integration and space-saving design.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture for efficient and optimized processing performance.

Technology: CMOS

CMOS technology for low power consumption and high speed operation.

Terminal Form: NO LEAD

Lead-free terminals for environmentally friendly and RoHS compliant design.

Nominal Supply Voltage: 1 V

Stable and reliable voltage supply for consistent performance.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for PCB layout and connectivity.

Format: FIXED POINT

Fixed point format for precise and accurate computational abilities.

Speed: 800 rpm

High speed operation for efficient processing and performance.

Low Power Mode: YES

Low power mode option for energy-efficient operation and prolonged battery life.

Technical Specifications

Microprocessors MC7448VU800ND attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

800 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-CBGA-N360

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

360

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

LGA

Package Equivalence Code:

BGA360,19X19,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8/2.5

Qualification:

Not Qualified

Maximum Seated Height:

2.8 mm

Speed:

800 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

25 mm

Peripheral IC Type:

Trade Compliance

MC7448VU800ND Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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