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STM32MP135FAF7T

STMicroelectronics

STM32MP135FAF7T by STMicroelectronics

STM32MP135FAF7T by STMicroelectronics is a 32-bit microprocessor with integrated cache, 26-bit address bus width, and 48 MHz max clock frequency. It is ideal for applications requiring low power mode, such as IoT devices, industrial automation, and consumer electronics.

Median Price

$7.140

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 2,000 parts In-Stock

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2,000

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Chip Stock

USA . 39,500 parts In-Stock

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39,500

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Cyclops Electronics Ltd

UK . 32,000 parts In-Stock

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32,000

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Vyrian

USA . 4,428 parts In-Stock

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4,428

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Digiode

USA . 3,612 parts In-Stock

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3,612

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TME

Poland . 2,000 parts In-Stock

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$7.140

2,000

-

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$7.140

Anansix

USA . 1,150 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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600

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Distributors (Availability)

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AZTECH Wire

Italy . 1,196 parts In-Stock

1+ parts

$10.110

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$10.110

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Ampacity Inc.

Singapore . 1,864 parts In-Stock

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$33.000

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1,864

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Argo Parts USA

USA . 2,487 parts In-Stock

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2,487

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Continental Prestige Electronics

USA . 1,485 parts In-Stock

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Corphita

USA . 396 parts In-Stock

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396

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Unleash the power of innovation with the STM32MP135FAF7T by STMicroelectronics! This cutting-edge microprocessor offers unparalleled performance, reliability, and versatility for a wide range of applications. With its integrated cache, low power mode, and high clock frequency, this product is a game-changer in the world of technology. Experience seamless operation and enhanced efficiency with this top-of-the-line microprocessor. Trust STMicroelectronics to deliver quality and value that exceeds expectations. Elevate your projects to new heights with the STM32MP135FAF7T!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY as the package body material ensures durability and lightweight, making the product suitable for portable devices.

Integrated Cache: YES

Having integrated cache enhances the processing speed and efficiency of the microprocessor, resulting in improved performance.

Maximum Supply Voltage: 1.38 V

The high maximum supply voltage allows for stable and reliable operation of the microprocessor under varying load conditions.

On Chip Data RAM Width: 8

The 8-bit data RAM width enables efficient data handling and storage within the microprocessor, enhancing overall processing capabilities.

Address Bus Width: 26

A wide address bus width of 26 bits allows for the microprocessor to access a large memory space, facilitating complex computations and tasks.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, ideal for integration into small electronic devices.

Bit Size: 32

With a bit size of 32, the microprocessor is capable of handling 32-bit data at a time, improving processing speed and efficiency.

No. of Terminals: 320

The large number of terminals allow for versatile connectivity options and compatibility with various peripheral devices, enhancing the functionality of the microprocessor.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The package style of GRID ARRAY, THIN PROFILE, FINE PITCH offers a high level of performance, thermal efficiency, and reliability in a compact form factor.

Minimum Supply Voltage: 1.32 V

The low minimum supply voltage ensures energy efficiency and helps in reducing power consumption during operation, ideal for power-sensitive applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures the microprocessor can function optimally even in harsh environments or under heavy workloads, improving overall reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the microprocessor to operate efficiently even in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Position: BOTTOM

The terminal position at the bottom of the microprocessor enhances ease of installation and ensures optimal connectivity with other components in the system.

Maximum Seated Height: 1.2 mm

The low maximum seated height facilitates a slim and compact overall design, making the microprocessor suitable for thin and space-constrained devices.

RAM Words: 172032

With a high number of RAM words, the microprocessor can efficiently manage and store a large amount of data, enhancing its processing capabilities.

Width: 11 mm

The compact width of 11 mm enables the microprocessor to be easily integrated into small form factor devices, offering flexibility in design.

Boundary Scan: YES

Having boundary scan capability allows for efficient testing and debugging of the microprocessor, ensuring high quality and reliability in the product.

External Data Bus Width: 16

With a wide external data bus width of 16 bits, the microprocessor can efficiently transfer data to and from external devices, improving overall performance.

Maximum Clock Frequency: 48 MHz

The high maximum clock frequency of 48 MHz enables fast and efficient operation of the microprocessor, making it suitable for tasks that require high-speed processing.

Length: 11 mm

The compact length of 11 mm complements the overall small form factor design of the microprocessor, providing versatility in application and integration.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor allows for efficient instruction execution and faster processing speeds, making it ideal for performance-critical applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high noise immunity, and reliable operation of the microprocessor, contributing to overall energy efficiency.

Terminal Form: BALL

The use of ball terminal form enhances soldering reliability and connectivity, ensuring stable electrical connections for optimal performance.

Maximum Supply Current: 268 mA

The maximum supply current of 268 mA allows for efficient power usage and helps in avoiding overloading the microprocessor, ensuring stable operation.

Nominal Supply Voltage: 1.35 V

With a nominal supply voltage of 1.35 V, the microprocessor operates within an optimal voltage range, ensuring reliable and consistent performance under specified conditions.

No. of DMA Channels: 56

Having 56 DMA channels enables efficient data transfer and processing, improving overall system performance and responsiveness.

No. of Serial I/Os: 10

The presence of 10 serial I/Os allows for versatile connectivity and communication options, making the microprocessor suitable for a wide range of interface requirements.

Terminal Pitch: 0.5 mm

With a small terminal pitch of 0.5 mm, the microprocessor provides high-density and compact connectivity options, ideal for miniaturized electronic devices.

Format: FIXED POINT

Utilizing a fixed-point format simplifies arithmetic operations and enhances overall computational efficiency, making the microprocessor well-suited for a variety of applications.

Speed: 1000 rpm

Operating at a speed of 1000 rpm, the microprocessor delivers fast and efficient performance, meeting the processing demands of various applications.

Low Power Mode: YES

The availability of a low power mode enables energy-saving operation and helps in extending battery life in mobile devices, making the microprocessor an energy-efficient choice.

Technical Specifications

Microprocessors STM32MP135FAF7T attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B320

Length:

11 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

10

No. of Terminals:

320

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA320,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.2 mm

Speed:

1000 rpm

Maximum Supply Current:

268 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.32 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

11 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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