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MPC8343ZQADDB

NXP Semiconductors

MPC8343ZQADDB by NXP Semiconductors

NXP Semiconductors' MPC8343ZQADDB microprocessor features 32-bit address and external data bus width, with integrated cache and max clock frequency of 66 MHz. Ideal for low power applications, it operates b/w 0-105°C, in a square grid array package with 620 terminals.

Median Price

$30.500

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

MPC8343ZQADDB by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,004 parts In-Stock

1+ parts

$30.500

100+ parts

$29.890

1k+ parts

$29.280

10k+ parts

-

5,004

$30.500

$29.890

$29.280

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Distributors (In-Stock)

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NAC Semi

USA . 5 parts In-Stock

1+ parts

$65.000

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5

$65.000

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Digiode

USA . 3,159 parts In-Stock

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3,159

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Vyrian

USA . 955 parts In-Stock

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955

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Anansix

USA . 808 parts In-Stock

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808

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Cyclops Electronics Ltd

UK . 103 parts In-Stock

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103

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J2 Sourcing AB

Sweden . 19 parts In-Stock

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19

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Nova Conductors

Japan . 15 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 475 parts In-Stock

1+ parts

$10.849

100+ parts

-

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475

$10.849

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Ampacity Inc.

Singapore . 1,429 parts In-Stock

1+ parts

$14.000

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1,429

$14.000

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One Stop Electronics

USA . 2,631 parts In-Stock

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$23.000

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2,631

$23.000

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Vigor

Singapore . 563 parts In-Stock

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$33.200

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563

$33.200

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Aztec Data Supply Inc.

USA . 215 parts In-Stock

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$36.354

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215

$36.354

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Microchip USA

USA . 2,603 parts In-Stock

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$56.839

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2,603

$56.839

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Corohmni

South Africa . 75 parts In-Stock

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$86.234

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75

$86.234

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UNI Independent Distributors

Spain . 5,403 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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A-Z Elektronik GmbH

Germany . 4,592 parts In-Stock

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4,592

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Continental Prestige Electronics

USA . 3,818 parts In-Stock

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Argo Parts USA

USA . 1,513 parts In-Stock

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1,513

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Robosynatics

Brazil . 1,464 parts In-Stock

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$51.626

1k+ parts

$50.573

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$50.573

1,464

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$51.626

$50.573

$50.573

Lucentia Tech

USA . 1,464 parts In-Stock

1+ parts

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100+ parts

$51.626

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$50.573

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$50.573

1,464

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$51.626

$50.573

$50.573

Corphita

USA . 1,260 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Discover the cutting-edge technology of the MPC8343ZQADDB by NXP Semiconductors, a top-tier manufacturer in the industry. This microprocessor offers unparalleled performance and reliability for a wide range of applications. With its integrated cache and low power mode, this product delivers optimal efficiency and speed, ensuring seamless operation. Trust NXP Semiconductors to provide you with the quality and innovation you need to stay ahead in today's fast-paced world. Elevate your projects with the MPC8343ZQADDB and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the microprocessor easier to handle and manufacture.

Integrated Cache: YES

Having an integrated cache improves the microprocessor's performance by reducing memory access times and boosting overall speed.

Maximum Supply Voltage: 1.26 V

The microprocessor can operate efficiently at a maximum supply voltage of 1.26 V, ensuring stable performance under peak loads.

Address Bus Width: 32

A wider address bus allows the microprocessor to access a larger range of memory locations, enhancing its capabilities and speed.

Package Shape: SQUARE

Square packages are more space-efficient and facilitate better thermal management in electronic devices.

Bit Size: 32

With a 32-bit architecture, the microprocessor can handle larger chunks of data at once, leading to faster processing speeds.

No. of Terminals: 620

The high number of terminals allows for efficient connectivity and communication with other components in the system.

Maximum Operating Temperature: 105 °C

The microprocessor can withstand high operating temperatures of up to 105°C, making it suitable for demanding computing tasks.

Technology: CMOS

CMOS technology offers low power consumption and excellent noise immunity, enhancing the efficiency of the microprocessor.

Peripheral IC Type: MICROPROCESSOR

Designed specifically as a microprocessor, this product is optimized for processing tasks, ensuring reliable performance in computing applications.

Technical Specifications

Microprocessors MPC8343ZQADDB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B620

JESD-609 Code:

e0

Length:

29 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

620

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

2.46 mm

Speed:

266 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

29 mm

Peripheral IC Type:

Trade Compliance

MPC8343ZQADDB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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