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AF82801JIRSLB8S

Intel

AF82801JIRSLB8S by Intel

Intel's AF82801JIRSLB8S microprocessor features 676 terminals in a square grid array package. Operating at 1.1V, 1.5V, 3.3V, and 5V, it is a CMOS technology chip with ball terminals for surface mounting applications. Ideal for various electronic devices requiring high-performance processing capabilities.

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VNN

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Digiode

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Bristol Electronics

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Inventory MP

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ComSIT Distribution GmbH

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Andel Nordic

Denmark . 913 parts In-Stock

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$5.781

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Ampacity Inc.

Singapore . 583 parts In-Stock

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MARBEL Systems

Belgium . 244 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 2,976 parts In-Stock

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Qasali Group International

UK . 111 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

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Glotronic Ltd.

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Alle Elektronik GmbH

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Perfect Parts

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Authorized Procurement Solutions

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Argo Parts USA

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Continental Prestige Electronics

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Aranea Global

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GreenTree Electronics

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Corphita

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Overview

Unleash the power of innovation with the AF82801JIRSLB8S by Intel. Crafted with precision and expertise, this microprocessor exemplifies Intel's commitment to excellence. From enhancing performance to enabling seamless connectivity, this product caters to a wide range of applications with unparalleled efficiency. Experience the ultimate in reliability and speed, as you unlock endless possibilities with Intel's cutting-edge technology. Elevate your projects and elevate your success with the AF82801JIRSLB8S - the choice of champions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and thermal stability, making this microprocessor suitable for a variety of applications.

Surface Mount: YES

The ability to be surface mounted allows for easy and efficient assembly onto printed circuit boards, saving time and labor costs.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on a PCB and facilitates easier routing of traces.

Power Supplies (V): 1.1,1.5,3.3,5

Having multiple voltage options allows for flexibility in design and compatibility with various power sources, making this microprocessor versatile.

No. of Terminals: 676

The high number of terminals enables complex connectivity and integration of various functions, making this microprocessor suitable for advanced applications.

Package Style (Meter): GRID ARRAY

The grid array package style provides excellent thermal performance and electrical connectivity, ensuring optimal performance of the microprocessor.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easy and secure connections to the PCB, enhancing the reliability of the microprocessor.

Peripheral IC Type: MICROPROCESSOR

Being a microprocessor, this product is designed to execute complex tasks efficiently, making it suitable for demanding applications requiring high processing power.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microprocessor energy-efficient and reliable in various operating conditions.

Terminal Form: BALL

The ball terminal form ensures secure and reliable connections, reducing the risk of signal loss or malfunction, making this microprocessor highly dependable.

Terminal Pitch: 1 mm

With a small terminal pitch of 1 mm, this microprocessor allows for high-density mounting on the PCB, saving space and enabling more compact designs.

Technical Specifications

Microprocessors AF82801JIRSLB8S attributes and parameters. Explore more Microprocessors devices from Intel

Specs

JESD-30 Code:

S-PBGA-B676

No. of Terminals:

676

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA676,30X30,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1.1,1.5,3.3,5

Qualification:

Not Qualified

Sub-Category:

Other uPs/uCs/Peripheral ICs

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

AF82801JIRSLB8S Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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