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AM3357ZCZD27

Texas Instruments

AM3357ZCZD27 by Texas Instruments

AM3357ZCZD27 by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. Operating at a max clock frequency of 26 MHz, it features low power mode and boundary scan for efficient performance. Ideal for applications requiring high-speed processing in compact devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 3,545 parts In-Stock

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Vyrian

USA . 2,699 parts In-Stock

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VNN

France . 1,393 parts In-Stock

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Nova Conductors

Japan . 44 parts In-Stock

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AZTECH Wire

Italy . 335 parts In-Stock

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$5.806

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One Stop Electronics

USA . 1,625 parts In-Stock

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$23.000

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Ampacity Inc.

Singapore . 1,082 parts In-Stock

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$26.000

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Corohmni

South Africa . 304 parts In-Stock

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$32.387

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Parana Technologies

USA . 1,317 parts In-Stock

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$70.795

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DigiPath Technology Company

USA . 2,160 parts In-Stock

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$77.954

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$71.718

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$71.718

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ChromeModa Solutions

Germany . 5,752 parts In-Stock

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$79.545

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$65.227

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IDEA Electronic Components Group

UK . 1,280 parts In-Stock

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$79.545

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$75.568

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$71.590

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A-Z Elektronik GmbH

Germany . 7,044 parts In-Stock

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Continental Prestige Electronics

USA . 3,454 parts In-Stock

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Corphita

USA . 3,015 parts In-Stock

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Argo Parts USA

USA . 2,995 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Microchip USA

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264

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Advanced Electronics

New Zealand . 200 parts In-Stock

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Overview

Discover the power and innovation of the Texas Instruments AM3357ZCZD27 Microprocessor, a cutting-edge solution that brings unparalleled performance to your projects. With a focus on quality and reliability, Texas Instruments is a trusted manufacturer known for pushing the boundaries of technology. Ideal for a wide range of applications, this microprocessor offers seamless integration and maximum efficiency. Unlock the full potential of your designs with the value and benefits that the AM3357ZCZD27 provides, making it a top choice for customers seeking top-notch performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material is lightweight and durable, making the microprocessor easy to handle and less prone to damage during installation or use.

Integrated Cache: YES

Integrated cache helps in faster data access and processing, improving the overall performance of the microprocessor.

Maximum Supply Voltage: 1.144 V

With a maximum supply voltage of 1.144 V, the microprocessor operates efficiently without risking damage from overvoltage.

Address Bus Width: 28

A wider address bus width of 28 allows the microprocessor to access larger memory addresses, enabling it to handle more complex tasks and data effectively.

Package Shape: SQUARE

Square package shape provides a compact design, making it easy to fit the microprocessor into various devices without taking up too much space.

Bit Size: 32

32-bit architecture allows the microprocessor to handle larger chunks of data at a time, improving computational efficiency and performance.

Power Supplies (V): 0.95/1.1,0.95/1.26

Multiple power supply voltage options provide flexibility for different power requirements, ensuring compatibility with various system configurations.

No. of Terminals: 324

Having a high number of terminals enables the microprocessor to support a wide range of connections and interfaces, enhancing its compatibility with different peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style facilitates easy PCB mounting, reduces the overall footprint of the microprocessor, and minimizes signal interference.

Minimum Supply Voltage: 1.056 V

A lower minimum supply voltage of 1.056 V helps in reducing power consumption and heat generation, leading to improved energy efficiency and thermal performance.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish offers excellent conductivity and corrosion resistance, ensuring reliable electrical connections for optimal performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies the PCB layout and assembly process, making it more convenient for integration into various electronic applications.

Maximum Seated Height: 1.4 mm

With a maximum seated height of 1.4 mm, the microprocessor can be accommodated in slim devices or tight spaces, expanding its range of applicability.

Width: 15 mm

Compact width of 15 mm allows for easy integration and installation of the microprocessor in space-constrained environments, without compromising on performance.

Boundary Scan: YES

Boundary scan feature enables comprehensive testing and debugging of the microprocessor, ensuring robustness and reliability in operation.

External Data Bus Width: 16

16-bit external data bus width enables faster data transfer between the microprocessor and external peripherals, enhancing overall system efficiency.

Maximum Clock Frequency: 26 MHz

A high maximum clock frequency of 26 MHz allows the microprocessor to process instructions at a rapid rate, contributing to seamless and responsive performance.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the microprocessor can withstand soldering processes without compromising its reliability or functionality.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures proper solder joint formation during assembly, enhancing the mechanical strength and electrical connectivity of the microprocessor.

Length: 15 mm

Compact length of 15 mm allows for efficient placement and routing of the microprocessor on the PCB, optimizing signal integrity and minimizing signal delays.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture in the microprocessor enhances performance by simplifying instruction execution and processing, resulting in faster data handling and improved efficiency.

Technology: CMOS

CMOS technology offers low power consumption, high speed operation, and compatibility with various system configurations, making the microprocessor an energy-efficient and versatile choice.

Terminal Form: BALL

Ball terminal form provides reliable solder connections and facilitates easy installation on the PCB, ensuring stable electrical contact for optimal performance.

Nominal Supply Voltage: 1.1 V

A nominal supply voltage of 1.1 V ensures stable and efficient operation of the microprocessor, meeting the voltage requirements for reliable performance.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, the microprocessor supports fine-pitch mounting, enabling high-density integration and compact PCB designs for space-saving applications.

Format: FIXED POINT

Fixed-point format enables precise and efficient arithmetic calculations, supporting a wide range of mathematical operations and algorithms in various computational tasks.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, ensuring proper handling and storage conditions to prevent damage to the microprocessor during assembly or operation.

Speed: 275 rpm

Operating at a speed of 275 rpm, the microprocessor delivers fast and responsive performance, meeting the demands of high-speed computing and data processing applications.

Low Power Mode: YES

Low power mode feature helps in reducing power consumption during idle or low-load conditions, enhancing energy efficiency and prolonging battery life in portable devices.

Technical Specifications

Microprocessors AM3357ZCZD27 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

324

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1,0.95/1.26

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Speed:

275 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3357ZCZD27 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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