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MPC8360ECVVAJDGA

NXP Semiconductors

MPC8360ECVVAJDGA by NXP Semiconductors

The NXP Semiconductors MPC8360ECVVAJDGA is a 32-bit microprocessor with integrated cache and a max clock frequency of 66.67 MHz. It is commonly used in applications requiring low power mode and high-speed processing, such as networking equipment and industrial automation systems.

Median Price

$140.350

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

MPC8360ECVVAJDGA by NXP Semiconductors
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Rochester

USA . 3,294 parts In-Stock

1+ parts

$140.350

100+ parts

$131.930

1k+ parts

$123.510

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3,294

$140.350

$131.930

$123.510

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Distributors (In-Stock)

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Digiode

USA . 717 parts In-Stock

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$134.615

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717

$134.615

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Anansix

USA . 2,263 parts In-Stock

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2,263

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Chip Stock

USA . 440 parts In-Stock

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440

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Flip Electronics

USA . 37 parts In-Stock

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Vyrian

USA . 34 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 3,551 parts In-Stock

1+ parts

$29.719

100+ parts

$29.719

1k+ parts

$29.719

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3,551

$29.719

$29.719

$29.719

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Corohmni

South Africa . 211 parts In-Stock

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$39.996

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211

$39.996

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Aztec Data Supply Inc.

USA . 173 parts In-Stock

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$49.760

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173

$49.760

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Corphita

USA . 2,645 parts In-Stock

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$127.530

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One Stop Electronics

USA . 34 parts In-Stock

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$150.560

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34

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Ampacity Inc.

Singapore . 34 parts In-Stock

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$150.560

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34

$150.560

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Semicontronic

India . 34 parts In-Stock

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$150.560

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$146.796

1k+ parts

$146.043

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34

$150.560

$146.796

$146.043

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Vigor

Singapore . 307 parts In-Stock

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$231.880

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307

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Microchip USA

USA . 363 parts In-Stock

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$243.103

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363

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Lixinc

USA . 18,447 parts In-Stock

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UNI Independent Distributors

Spain . 5,305 parts In-Stock

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Continental Prestige Electronics

USA . 2,812 parts In-Stock

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Argo Parts USA

USA . 2,065 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Perfect Parts

USA . 24 parts In-Stock

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Overview

Discover the power of the MPC8360ECVVAJDGA microprocessor by NXP Semiconductors. With its high-quality manufacturing and state-of-the-art technology, this versatile microprocessor delivers unmatched performance for a wide range of applications. Whether you're looking to enhance your computing systems, optimize networking capabilities, or streamline industrial automation processes, the MPC8360ECVVAJDGA is the solution you need. Offering exceptional value, benefits, and advantages, this product promises to revolutionize your operations and propel your business forward. Experience the future of microprocessors with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY. This material ensures durability and reliability of the microprocessor, making it a good choice for long-term usage.

Integrated Cache

YES. The integrated cache enhances the processor's performance by storing frequently accessed data, resulting in faster execution speeds and improved overall system performance.

Surface Mount

YES. The surface mount feature allows for easier installation and soldering onto circuit boards, making it convenient for manufacturers and reducing production time and costs.

Maximum Supply Voltage

1.35 V. With a higher maximum supply voltage, this microprocessor can handle increased power demands, enabling it to operate effectively in power-hungry applications.

Address Bus Width

32. A wide address bus width of 32 bits allows the microprocessor to access a larger memory space, enabling it to handle more complex calculations and data operations.

Package Shape

SQUARE. The square package shape provides a compact and space-saving design, making it suitable for devices with limited physical dimensions.

Bit Size

32. This microprocessor's 32-bit architecture allows it to process and handle larger chunks of data at a time, leading to faster data processing and improved performance.

Power Supplies (V)

1.8/2.5, 3.3. The microprocessor can operate on three different power supply voltages, providing flexibility and compatibility with various system configurations.

No. of Terminals

740. With a high number of terminals, this microprocessor can support a wide range of input and output connections, making it versatile and adaptable for diverse applications.

Package Style (Meter)

GRID ARRAY, LOW PROFILE. This style offers a low-profile design, which is suitable for applications with limited vertical space while maintaining a robust and reliable connection.

Minimum Supply Voltage

1.15 V. The minimum supply voltage allows this microprocessor to operate efficiently in low-power scenarios, making it a suitable choice for energy-conscious devices.

Terminal Finish

TIN SILVER. The tin silver terminal finish provides excellent conductivity and corrosion resistance, ensuring stable and reliable electrical connections over the product's lifespan.

Terminal Position

BOTTOM. The bottom terminal position facilitates easy integration into circuit boards, simplifying the design and assembly process for manufacturers.

Maximum Seated Height

1.69 mm. The microprocessor's low-seated height is useful in applications with tight space constraints or when stacked with other components, enabling compact device designs.

Width

37.5 mm. The microprocessor's width accommodates compatibility with standard board layouts, ensuring easy integration into existing systems without major modifications.

Boundary Scan

YES. The boundary scan feature allows for efficient testing and debugging of the microprocessor's circuitry, simplifying troubleshooting and ensuring product quality.

External Data Bus Width

32. An external data bus width of 32 bits facilitates high-speed data transfer between the microprocessor and peripherals, enabling swift and efficient communication.

Maximum Clock Frequency

66.67 MHz. With a high maximum clock frequency, this microprocessor is capable of handling demanding computational tasks, resulting in faster processing speeds.

Maximum Time At Peak Reflow Temperature (s)

40. This microprocessor can withstand peak reflow temperatures for up to 40 seconds, ensuring soldering reliability during manufacturing processes.

Peak Reflow Temperature °C

260. The high peak reflow temperature tolerance allows for robust soldering and ensures the microprocessor's longevity and stability under challenging operating conditions.

Length

37.5 mm. The microprocessor's length ensures compatibility with standard board layouts, making it suitable for a wide range of applications without requiring extensive modifications.

Peripheral IC Type

MICROPROCESSOR, RISC. With a RISC architecture, this microprocessor offers simplified instructions and improved performance, making it suitable for efficient data processing.

Technology

CMOS. The CMOS technology used in this microprocessor allows for low power consumption while maintaining high speed and performance, making it energy-efficient and cost-effective.

Terminal Form

BALL. The ball terminal form offers reliable and secure connections, ensuring stable electrical contact and optimal performance in a variety of system environments.

Nominal Supply Voltage

1.3 V. The nominal supply voltage provides a stable power source for the microprocessor, allowing it to operate consistently and reliably in various operating conditions.

Terminal Pitch

1 mm. With a small terminal pitch, this microprocessor offers high-density interconnection possibilities, enabling it to be utilized in space-constrained applications.

Format

FLOATING POINT. The floating-point format in this microprocessor supports accurate and efficient handling of decimal numbers, making it suitable for applications involving complex mathematical calculations.

Moisture Sensitivity Level (MSL)

3. This microprocessor's MSL level indicates its resistance to moisture and enables safe handling and storage, ensuring its quality and reliability over time.

Speed

533 rpm. With a high rotation speed, this microprocessor can process data quickly and efficiently, enhancing overall system performance in demanding applications.

Low Power Mode

YES. The low power mode feature allows the microprocessor to operate with reduced power consumption, making it suitable for energy-efficient devices requiring longer battery life.

Technical Specifications

Microprocessors MPC8360ECVVAJDGA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.67 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B740

JESD-609 Code:

e2

Length:

37.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

740

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA740,37X37,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/2.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.69 mm

Speed:

533 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.15 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

37.5 mm

Peripheral IC Type:

Trade Compliance

MPC8360ECVVAJDGA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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