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AM3357BZCZA60

Texas Instruments

AM3357BZCZA60 by Texas Instruments

AM3357BZCZA60 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. The package style is grid array, making it ideal for compact designs in harsh environments.

Median Price

$17.135

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,782 parts In-Stock

1+ parts

$17.135

100+ parts

$14.967

1k+ parts

$10.322

10k+ parts

-

1,782

$17.135

$14.967

$10.322

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,225 parts In-Stock

1+ parts

$16.278

100+ parts

-

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-

10k+ parts

-

4,225

$16.278

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$17.960

100+ parts

-

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-

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-

100

$17.960

-

-

-

VNN

France . 29,222 parts In-Stock

1+ parts

-

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29,222

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-

-

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Vyrian

USA . 7,714 parts In-Stock

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-

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7,714

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-

-

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Chip Stock

USA . 3,765 parts In-Stock

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-

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3,765

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,396 parts In-Stock

1+ parts

$14.560

100+ parts

-

1k+ parts

-

10k+ parts

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1,396

$14.560

-

-

-

Corphita

USA . 1,146 parts In-Stock

1+ parts

$15.422

100+ parts

-

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-

1,146

$15.422

-

-

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AZTECH Wire

Italy . 426 parts In-Stock

1+ parts

$16.660

100+ parts

-

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426

$16.660

-

-

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Continental Prestige Electronics

USA . 4,686 parts In-Stock

1+ parts

$17.960

100+ parts

-

1k+ parts

-

10k+ parts

$17.601

4,686

$17.960

-

-

$17.601

Netroflash

USA . 100 parts In-Stock

1+ parts

$17.960

100+ parts

$17.601

1k+ parts

-

10k+ parts

-

100

$17.960

$17.601

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-

Corohmni

South Africa . 79 parts In-Stock

1+ parts

$40.004

100+ parts

-

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-

10k+ parts

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79

$40.004

-

-

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$43.187

100+ parts

$39.300

1k+ parts

$35.413

10k+ parts

-

2,000

$43.187

$39.300

$35.413

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Parana Technologies

USA . 123 parts In-Stock

1+ parts

$60.406

100+ parts

-

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123

$60.406

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-

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ChromeModa Solutions

Germany . 2,258 parts In-Stock

1+ parts

$67.872

100+ parts

$55.655

1k+ parts

-

10k+ parts

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2,258

$67.872

$55.655

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IDEA Electronic Components Group

UK . 880 parts In-Stock

1+ parts

$67.872

100+ parts

$64.478

1k+ parts

$61.085

10k+ parts

-

880

$67.872

$64.478

$61.085

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Lixinc

USA . 19,378 parts In-Stock

1+ parts

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19,378

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DigiPath Technology Company

USA . 1,936 parts In-Stock

1+ parts

-

100+ parts

$61.193

1k+ parts

-

10k+ parts

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1,936

-

$61.193

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Argo Parts USA

USA . 1,816 parts In-Stock

1+ parts

-

100+ parts

-

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1,816

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-

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Robosynatics

Brazil . 300 parts In-Stock

1+ parts

-

100+ parts

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300

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Lucentia Tech

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$15.507

1k+ parts

$14.359

10k+ parts

$14.359

300

-

$15.507

$14.359

$14.359

Overview

Upgrade your electronic devices with the Texas Instruments AM3357BZCZA60 Microprocessor. With a powerful 32-bit architecture and integrated cache, this innovative component offers unparalleled performance and efficiency. Designed by a trusted manufacturer, Texas Instruments, this microprocessor guarantees reliability and durability. Ideal for a wide range of applications, from industrial automation to consumer electronics, this product delivers top-notch speed and functionality. Experience the value and benefits of superior technology with the AM3357BZCZA60.

Feature Benefit Bullets

Integrated Cache: YES

Having integrated cache helps improve the performance of the microprocessor by reducing the time it takes to access frequently used data and instructions.

Address Bus Width: 28

With a larger address bus width, the microprocessor can access a larger memory space, making it suitable for handling complex tasks and larger data sets efficiently.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows the microprocessor to operate reliably in demanding industrial environments without overheating.

Maximum Clock Frequency: 26 MHz

The high maximum clock frequency enables the microprocessor to perform tasks at a faster rate, making it suitable for applications that require quick processing speed.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor, it is designed for high-speed processing by optimizing instruction execution, making it a good choice for performance-critical applications.

Technical Specifications

Microprocessors AM3357BZCZA60 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

600 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3357BZCZA60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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