Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Freescale Semiconductor KMPC852TVR100A microprocessor features a 32-bit address and external data bus width, with a max clock frequency of 66 MHz. It is designed for low power mode applications, with integrated cache and boundary scan capabilities. Ideal for use in embedded systems requiring high-speed processing within a compact form factor.
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The use of plastic/epoxy material makes this microprocessor lightweight and durable, ideal for portable devices.
With integrated cache, this microprocessor can access data quickly, improving overall performance and efficiency.
Being surface mountable, this microprocessor can be easily installed on a circuit board, saving space and improving airflow.
Operating at a maximum supply voltage of 1.9V ensures energy efficiency and helps prevent overheating.
The 32-bit address bus width allows this microprocessor to access a larger memory space, enhancing its capabilities.
The square package shape makes this microprocessor easy to handle and install, reducing the risk of damage during assembly.
With a 32-bit architecture, this microprocessor can process data in larger chunks, increasing speed and efficiency.
Having 256 terminals allows for seamless communication with other components, enhancing connectivity and overall performance.
The grid array package style provides a secure connection and efficient heat dissipation, making this microprocessor reliable and long-lasting.
Operating at a minimum supply voltage of 1.7V ensures stability and reliability even under low power conditions.
The terminal finish of tin, silver, and copper enhances conductivity and corrosion resistance, improving the longevity of this microprocessor.
With terminals positioned at the bottom, this microprocessor can be easily integrated into various circuit layouts, saving space and simplifying design.
The low profile design of this microprocessor allows for compact installations, ideal for devices with limited space.
The compact width of 23mm makes this microprocessor suitable for small form factor devices without compromising on performance.
Having boundary scan capability allows for easy testing and troubleshooting of this microprocessor, reducing downtime and maintenance costs.
The 32-bit external data bus width enables seamless data transfer between this microprocessor and other components, enhancing overall system efficiency.
Operating at a maximum clock frequency of 66MHz, this microprocessor can handle high-speed data processing tasks with ease.
The ability to withstand a peak reflow temperature for 30 seconds ensures the durability and reliability of this microprocessor during manufacturing processes.
With a peak reflow temperature of 245°C, this microprocessor can endure high-temperature soldering processes without damage.
The compact length of 23mm makes this microprocessor suitable for devices with limited space constraints without compromising on performance.
Being a RISC-based microprocessor, this product offers improved performance, reduced power consumption, and faster execution of instructions.
Built using CMOS technology, this microprocessor delivers high speeds and low power consumption, making it an efficient choice for a wide range of applications.
The ball terminal form provides a secure and reliable connection for this microprocessor, ensuring stable performance under varying operating conditions.
Operating at a nominal supply voltage of 1.8V ensures energy efficiency and stability, making this microprocessor suitable for battery-powered devices.
The fine terminal pitch of 1.27mm allows for compact designs and efficient routing of signals, making this microprocessor ideal for small footprint applications.
With a fixed-point format, this microprocessor offers precise and efficient arithmetic operations, essential for applications requiring accuracy and speed.
With a moisture sensitivity level of 3, this microprocessor can withstand moderate exposure to humidity without compromising its performance or reliability.
Operating at a speed of 100 rpm, this microprocessor offers fast data processing and response times, suitable for high-performance applications.
With a low power mode option, this microprocessor can optimize energy consumption, extending battery life and reducing overall power usage.
Microprocessors KMPC852TVR100A attributes and parameters. Explore more Microprocessors devices from Freescale Semiconductor
Additional Features:
Address Bus Width:
Bit Size:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
KMPC852TVR100A Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Packaging - All Dev Label Update 15/Dec/2020
On December 7, 2015, NXP completed the merger with Freescale Semiconductor; the merged company continued its operation as NXP Semiconductors N.V.
1N4148WT
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CMX
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM107H/883
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
MMSZ5245BT1G
MMSZ5245BT1G by Onsemi is a Zener diode with 15V nominal reference voltage, 8.5mA test current, and 16 ohm dynamic impedance. It is used in applications requiring precise voltage regulation in a compact SMD package for temperatures ranging from -55 to 150°C.
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
SS14
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Vishay Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
261
Micronetics
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
1N4148W-T
Micro Commercial Components
1N4148W-T by Micro Commercial Components is a single rectifier diode with a max reverse recovery time of 0.004 us. It operates b/w -55 to 150 °C and has a max output current of 0.15 A. Ideal for applications requiring fast switching speeds in small outline packages.
MMBT3904LT1G
MMBT3904LT1G by Onsemi is a NPN BJT with max. collector-emitter voltage of 40V, hFE of 30, and fT of 300MHz. Ideal for small signal applications in electronics due to its compact size, high transition frequency, and low power dissipation capabilities.
LM358N
Harris Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148WSF-7
Diodes Incorporated
1N4148WSF-7 by Diodes Inc. is a single silicon rectifier diode with max output current of 0.25A and max reverse voltage of 100V. It operates b/w -55 to 150°C, has a small outline package style, and is suitable for surface mount applications in various electronic circuits.
Synsemi
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
1N4148
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
FDN306P
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
2N7002
Kec
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
BAV99
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
MCF5328CVM240
Freescale Semiconductor
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
MC7448VU800ND
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 360; Package Code: LGA; Package Shape: SQUARE;
MPC8248CVRTIEA
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;
MCF5275CVM166
MPC8270CZUQLDA
NXP Semiconductors
The NXP Semiconductors MPC8270CZUQLDA microprocessor features a 32-bit address bus width, 64-bit external data bus width, and max clock frequency of 83.33 MHz. It is commonly used in applications requiring high-speed processing and integrated cache memory for improved performance.
MCIMX7D2DVK12SC
MCIMX7D2DVK12SC by NXP Semiconductors is a Microprocessor with 32-bit size, 488 terminals, and 1.25V max supply voltage. Ideal for applications requiring low power mode, it features a CMOS technology, 16-bit external data bus width, and operates b/w 0-85°C temperature range.
STM32MP131CAF3
STMicroelectronics
STM32MP131CAF3 by STMicroelectronics is a 32-bit microprocessor with 48 MHz clock frequency, 172032 RAM words, and 56 DMA channels. It is used in applications requiring low power mode, such as IoT devices and embedded systems.
CH80566EE014DT/SLGPP
Intel
Intel CH80566EE014DT/SLGPP is a 64-bit microprocessor with 28-bit address bus width and 64-bit external data bus width. It operates at speeds up to 1330 rpm, suitable for industrial applications requiring low power consumption. The processor features integrated cache, boundary scan, and CMOS technology for efficient performance in various electronic devices.
MPC8347EVRAGDB
NXP Semiconductors' MPC8347EVRAGDB microprocessor features 32-bit address and external data bus width, with a max clock frequency of 66 MHz. It is suitable for applications requiring integrated cache, low power mode, and boundary scan capabilities. The package style is grid array with 620 terminals, making it ideal for high-performance computing systems.
14305R-2000
Dialog Semiconductor
14305R-2000 by Dialog Semiconductor is a Microprocessor with 48 terminals, operating at 3.3V nominal voltage and up to 10 MHz clock frequency. Ideal for industrial applications requiring CMOS technology, it features a compact square package style with boundary scan capability.
FH8065301487717SR3UT
Intel FH8065301487717SR3UT is a 64-bit microprocessor with 1170 terminals, operating at speeds up to 1910 rpm. Suitable for industrial applications, it features integrated cache, CMOS technology, and a rectangular grid array package shape.
AT91SAM9G35-CU-999
Atmel
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 217; Package Code: LFBGA; Package Shape: SQUARE;
MCF5282CVF80
Motorola
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
MCF5485CZP200
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE;
AM3354BZCZD80
Texas Instruments
AM3354BZCZD80 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.8 mm.
MCF5372LCVM240
NXP Semiconductors' MCF5372LCVM240 microprocessor features 32-bit architecture, 80 MHz clock frequency, and integrated cache. Ideal for industrial applications requiring low power mode, with a temperature range of -40 to 85°C. Package style is grid array with 196 terminals in a square shape.
MIMXRT1051DVJ6B
NXP Semiconductors' MIMXRT1051DVJ6B is a 32-bit microprocessor with integrated cache, 524288 RAM words, and 29 serial I/Os. Ideal for low power applications, it operates at up to 24 MHz clock frequency and features boundary scan technology. With a package style of grid array, this CMOS processor is suitable for various embedded systems requiring high-speed data processing.
MPC8270VVUPEA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu);
MPC880VR66
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
MIMXRT1024CAG4B
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
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KMPC8270CVRMIBA
KMPC8270CVRMIBA by Freescale Semiconductor is a 32-bit microprocessor with integrated cache and 64-bit external data bus width. It operates at a max clock frequency of 266 MHz and is suitable for applications requiring high-speed processing, such as networking equipment and industrial automation systems.
KMPC866TZP133A
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1.27 mm;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
KMPC8270VRMIBA
KMPC8270CZUQLDA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE;
KMPC885VR133
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B357;
KMPC8270CZQMIBA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Format: FLOATING POINT;
KMPC8347VVAJFB
MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 672; Package Code: LBGA; Package Shape: SQUARE;
KMPC8343CVRAGDB
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 620; Package Code: BGA; Package Shape: SQUARE;
KMPC8255ACVVMHBB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
KMPC880VR133
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
KMPC885CVR133
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;
KMPC880ZP133
KMPC880ZP66
KMPC8572EVJARLE
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 245; Maximum Time At Peak Reflow Temperature (s): 30;
KMPC880ZP80
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.7 V;
KMPC870ZT66
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: HBGA; Package Shape: SQUARE; Low Power Mode: YES;
KMPC875ZT66
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: HBGA; Package Shape: SQUARE; Qualification: Not Qualified;
KMPC880CZP133
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 32;
KMPC852TCZT100A
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Width: 23 mm;
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