Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Freescale Semiconductor KMPC885CVR133 microprocessor features a 32-bit address and external data bus width, with integrated cache and low power mode. It operates at a speed of 133 rpm, suitable for applications requiring high processing power in compact devices. The package style is grid array with terminal pitch of 1.27 mm, making it ideal for surface mount assembly processes.
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This material is lightweight and durable, making the microprocessor easy to handle and resistant to damage.
Having integrated cache improves processing speed and efficiency by allowing the processor to store frequently accessed data closer to the CPU.
Surface mount technology enables easy and efficient assembly of the microprocessor onto circuit boards, saving space and reducing costs.
Operating within a low maximum supply voltage helps in energy efficiency and reduces heat generation, extending the lifespan of the microprocessor.
A 32-bit address bus allows the microprocessor to access a large memory address space, enabling it to handle complex calculations and processes efficiently.
The square package shape provides a more even distribution of pins and terminals, making it easier for manufacturers to design and mount the microprocessor on a circuit board.
A 32-bit architecture allows the microprocessor to process data in larger chunks, leading to faster and more efficient operation.
Support for multiple power supply voltages provides flexibility in different operating environments and allows for optimized power consumption.
A higher number of terminals means more connections for input and output, enabling the microprocessor to communicate with other components effectively.
A grid array package style enhances thermal performance, improves signal integrity, and facilitates high-speed processing capabilities.
The ability to operate at a low minimum supply voltage increases the efficiency of the microprocessor and reduces power consumption.
The use of multiple metals for terminal finish enhances conductivity and reliability, ensuring stable connections for optimal performance.
Bottom terminal positioning simplifies installation and increases the stability of the microprocessor on the circuit board.
The low maximum seated height allows for a compact design, making the microprocessor suitable for slim electronic devices and applications with space constraints.
A moderate width size provides a balance between space efficiency and ease of handling during assembly and integration into electronic systems.
The presence of boundary scan capability helps in testing and debugging the microprocessor, ensuring reliability and quality control during production.
A 32-bit external data bus width enables faster data transfer between the microprocessor and other devices, enhancing overall system performance.
The ability to withstand extended time at peak reflow temperature ensures the reliability and durability of the microprocessor during the manufacturing process.
With a high peak reflow temperature, the microprocessor can endure harsh temperature conditions during soldering without affecting its functionality.
A compact length size contributes to space-saving and versatility in integrating the microprocessor into various electronic devices and systems.
Being a RISC microprocessor enhances processing speed, efficiency, and overall system performance, making it suitable for demanding computing tasks.
CMOS technology offers low power consumption, high noise immunity, and faster switching speeds, making the microprocessor energy-efficient and reliable.
Ball terminal form facilitates easy and secure connections, ensuring reliable signal transmission and enhancing the durability of the microprocessor.
Operating at a stable nominal supply voltage ensures consistent performance and reliability of the microprocessor in various operating conditions.
The optimal terminal pitch provides a good balance between space efficiency and ease of assembly, facilitating smooth integration into electronic systems.
Being a fixed-point format microprocessor simplifies arithmetic operations and enhances computational efficiency for specific applications and tasks.
Having a moisture sensitivity level of 3 ensures that the microprocessor is adequately protected from moisture-related damage during storage, handling, and operation.
Operating at a speed of 133 revolutions per minute allows the microprocessor to handle complex calculations and processes swiftly, meeting the demands of high-performance applications.
Support for a low-power mode helps in reducing energy consumption, heat dissipation, and extending the battery life of electronic devices powered by the microprocessor.
Microprocessors KMPC885CVR133 attributes and parameters. Explore more Microprocessors devices from Freescale Semiconductor
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KMPC885CVR133 Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A002
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
On December 7, 2015, NXP completed the merger with Freescale Semiconductor; the merged company continued its operation as NXP Semiconductors N.V.
2N7002
Vishay Intertechnology
2N7002 by Vishay Intertechnology is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE, suitable for surface mount with GULL WING terminals.
LM317T
Bay Linear
Other Regulators; No. of Terminals: 3; No. of Outputs: 1; Surface Mount: NO; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel;
ATMEGA328P-AU
Microchip Technology
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
LM358AN
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BSS138
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Minimum DS Breakdown Voltage: 50 V; Maximum Operating Temperature: 150 Cel;
1N4148
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
STM8S003F3P6TR
STMicroelectronics
STM8S003F3P6TR by STMicroelectronics is an 8-bit microcontroller with a max clock frequency of 16 MHz. It features 1024 RAM bytes, 128 data EEPROM size, and 5-ch 10-bit ADC channels. Ideal for industrial applications requiring low power mode and connectivity via I2C, SPI, and UART interfaces.
06035C104KAT2A
KYOCERA AVX
06035C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
FDV304P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
BSS138BK,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): 260; Additional Features: LOGIC LEVEL COMPATIBLE; Maximum Operating Temperature: 150 Cel;
M39029/56-351
Carlisle Interconnect Technologies
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Type: CRIMP; Removal Tools: M81969/8-06, M81969/14-02; IEC Conformity: NO; Contact Gender: FEMALE;
Lite-on Semiconductor
SMBJ18CA
Eic Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002-T1-E3
Vishay Intertechnology's 2N7002-T1-E3 is a N-CHANNEL FET for SWITCHING applications. Features include 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. With ENHANCEMENT MODE operation, this GULL WING transistor is ideal for small outline surface mount designs up to 150°C.
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 40; Minimum DS Breakdown Voltage: 60 V;
USB3320C-EZK-TR
Microchip Technology's USB3320C-EZK-TR is a Bus Controller IC with 32 terminals, operating at 1.6-2V. It supports USB bus compatibility, clock frequency up to 60MHz, and CMOS technology. Ideal for applications requiring Universal Serial Bus peripherals in compact designs with low power consumption.
Kec
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
1N4148WT
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
MPC5200CVR400BR2
NXP Semiconductors
NXP Semiconductors' MPC5200CVR400BR2 microprocessor features 32-bit address and external data bus width, with a clock frequency of 35 MHz. Ideal for industrial applications, it operates at temperatures ranging from -40 to 85 °C, offering low power mode and integrated cache for efficient performance.
MIMXRT1064DVL6AR
The NXP Semiconductors MIMXRT1064DVL6AR microprocessor features integrated cache, 1048576 RAM words, and low power mode. It is suitable for applications requiring high-speed processing in a compact form factor, such as IoT devices and embedded systems.
T1042NSN7MQB
The NXP Semiconductors T1042NSN7MQB microprocessor features a 32-bit architecture with integrated cache and 64-bit external data bus width. It operates at a max clock frequency of 133.3 MHz, making it suitable for high-speed computing applications. With low power mode support and CMOS technology, this processor is ideal for energy-efficient systems requiring fast processing capabilities.
MCIMX6S7CVM08AC
Freescale Semiconductor
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; JESD-609 Code: e1;
STM32MP153AAB3T
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
SPC5125YVN400
NXP Semiconductors' SPC5125YVN400 is a 32-bit microprocessor with power supplies of 1.4V and 3.3V, suitable for industrial applications. Featuring a grid array package style with 324 terminals, it operates b/w -40°C to 85°C and has a peak reflow temperature of 260°C. This RISC-based processor is designed for high-speed performance at 400 rpm in automotive electronics and other industrial settings.
MCIMX6S4AVM08AB
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE;
MPC860TVR66D4
The NXP Semiconductors MPC860TVR66D4 is a 32-bit microprocessor with integrated cache and a max clock frequency of 50 MHz. It is commonly used in applications requiring low power mode, such as embedded systems and industrial automation.
P1011NXN2HFB
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 689; Package Code: HBGA; Package Shape: SQUARE;
ADSP-21489KSWZ-5B
Analog Devices
ADSP-21489KSWZ-5B by Analog Devices is a 40-bit microprocessor with 24-bit address bus width, 16-bit external data bus width, and max clock frequency of 25 MHz. It is used in commercial applications requiring high-speed processing capabilities.
14305R-500
Echelon
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
STM32MP135AAE3
STM32MP135AAE3 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 172032 RAM words. It features an address bus width of 26, external data bus width of 16, and operates at a max clock frequency of 48 MHz. Ideal for low power applications requiring high-speed processing capabilities.
MIMXRT1175DVMAA
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;
R7S721010VCFP
Renesas Electronics
Renesas Electronics R7S721010VCFP microprocessor features 32-bit architecture with 8KB integrated cache. Suitable for industrial applications, it offers a max clock frequency of 48MHz and includes peripherals like DMA(16), LCD, POR, PWM(2), RTC, TIMER(7), WDT. With low power mode and extensive connectivity options such as CAN(5), ETHERNET(2), I2C(4), LIN(2), SCI(10), SPDIF, SPI(7), SSI(6), UART, USB(2).
P1010NXE5FFA
The NXP Semiconductors P1010NXE5FFA microprocessor features integrated cache, 32-bit external data bus width, and 16-bit address bus width. Ideal for industrial applications requiring a high-speed RISC microprocessor with boundary scan capability.
AM3352BZCZ60
Texas Instruments
AM3352BZCZ60 by Texas Instruments is a 32-bit microprocessor with integrated cache, 131072 RAM words, and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz and is suitable for applications requiring low power mode and boundary scan capabilities.
MCF5373LCVM240
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
MCF54415CMJ250
NXP Semiconductors' MCF54415CMJ250 microprocessor features 32-bit architecture, integrated cache, and operates at a max clock frequency of 100 MHz. Ideal for industrial applications requiring low power consumption, it supports multiple power supplies and has a temperature range from -40 to 85°C.
MICROPROCESSOR, RISC; No. of Terminals: 425; Maximum Time At Peak Reflow Temperature (s): 40; Package Body Material: PLASTIC/EPOXY; Peak Reflow Temperature (C): 260; Qualification: Not Qualified;
MC9328MXSVP10
MC9328MXSVP10 by NXP Semiconductors is a 32-bit microprocessor with 225 terminals, operating at a max frequency of 16 MHz. It features an address bus width of 25 bits and external data bus width of 32 bits. Ideal for applications requiring low power mode and fixed point format in commercial temperature grade environments.
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KMPC8270CVRMIBA
KMPC8270CVRMIBA by Freescale Semiconductor is a 32-bit microprocessor with integrated cache and 64-bit external data bus width. It operates at a max clock frequency of 266 MHz and is suitable for applications requiring high-speed processing, such as networking equipment and industrial automation systems.
KMPC866TZP133A
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1.27 mm;
Motorola
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
KMPC8270VRMIBA
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;
KMPC8270CZUQLDA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE;
KMPC852TVR100A
The Freescale Semiconductor KMPC852TVR100A microprocessor features a 32-bit address and external data bus width, with a max clock frequency of 66 MHz. It is designed for low power mode applications, with integrated cache and boundary scan capabilities. Ideal for use in embedded systems requiring high-speed processing within a compact form factor.
KMPC885VR133
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B357;
KMPC8270CZQMIBA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Format: FLOATING POINT;
KMPC8347VVAJFB
MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 672; Package Code: LBGA; Package Shape: SQUARE;
KMPC8343CVRAGDB
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 620; Package Code: BGA; Package Shape: SQUARE;
KMPC8255ACVVMHBB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
KMPC880VR133
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
KMPC880ZP133
KMPC880ZP66
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
KMPC8572EVJARLE
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 245; Maximum Time At Peak Reflow Temperature (s): 30;
KMPC880ZP80
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.7 V;
KMPC870ZT66
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: HBGA; Package Shape: SQUARE; Low Power Mode: YES;
KMPC875ZT66
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: HBGA; Package Shape: SQUARE; Qualification: Not Qualified;
KMPC880CZP133
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 32;
KMPC885CVR66
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.9 V;
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