Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Freescale Semiconductor KMPC885CVR133 microprocessor features a 32-bit address and external data bus width, with integrated cache and low power mode. It operates at a speed of 133 rpm, suitable for applications requiring high processing power in compact devices. The package style is grid array with terminal pitch of 1.27 mm, making it ideal for surface mount assembly processes.
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This material is lightweight and durable, making the microprocessor easy to handle and resistant to damage.
Having integrated cache improves processing speed and efficiency by allowing the processor to store frequently accessed data closer to the CPU.
Surface mount technology enables easy and efficient assembly of the microprocessor onto circuit boards, saving space and reducing costs.
Operating within a low maximum supply voltage helps in energy efficiency and reduces heat generation, extending the lifespan of the microprocessor.
A 32-bit address bus allows the microprocessor to access a large memory address space, enabling it to handle complex calculations and processes efficiently.
The square package shape provides a more even distribution of pins and terminals, making it easier for manufacturers to design and mount the microprocessor on a circuit board.
A 32-bit architecture allows the microprocessor to process data in larger chunks, leading to faster and more efficient operation.
Support for multiple power supply voltages provides flexibility in different operating environments and allows for optimized power consumption.
A higher number of terminals means more connections for input and output, enabling the microprocessor to communicate with other components effectively.
A grid array package style enhances thermal performance, improves signal integrity, and facilitates high-speed processing capabilities.
The ability to operate at a low minimum supply voltage increases the efficiency of the microprocessor and reduces power consumption.
The use of multiple metals for terminal finish enhances conductivity and reliability, ensuring stable connections for optimal performance.
Bottom terminal positioning simplifies installation and increases the stability of the microprocessor on the circuit board.
The low maximum seated height allows for a compact design, making the microprocessor suitable for slim electronic devices and applications with space constraints.
A moderate width size provides a balance between space efficiency and ease of handling during assembly and integration into electronic systems.
The presence of boundary scan capability helps in testing and debugging the microprocessor, ensuring reliability and quality control during production.
A 32-bit external data bus width enables faster data transfer between the microprocessor and other devices, enhancing overall system performance.
The ability to withstand extended time at peak reflow temperature ensures the reliability and durability of the microprocessor during the manufacturing process.
With a high peak reflow temperature, the microprocessor can endure harsh temperature conditions during soldering without affecting its functionality.
A compact length size contributes to space-saving and versatility in integrating the microprocessor into various electronic devices and systems.
Being a RISC microprocessor enhances processing speed, efficiency, and overall system performance, making it suitable for demanding computing tasks.
CMOS technology offers low power consumption, high noise immunity, and faster switching speeds, making the microprocessor energy-efficient and reliable.
Ball terminal form facilitates easy and secure connections, ensuring reliable signal transmission and enhancing the durability of the microprocessor.
Operating at a stable nominal supply voltage ensures consistent performance and reliability of the microprocessor in various operating conditions.
The optimal terminal pitch provides a good balance between space efficiency and ease of assembly, facilitating smooth integration into electronic systems.
Being a fixed-point format microprocessor simplifies arithmetic operations and enhances computational efficiency for specific applications and tasks.
Having a moisture sensitivity level of 3 ensures that the microprocessor is adequately protected from moisture-related damage during storage, handling, and operation.
Operating at a speed of 133 revolutions per minute allows the microprocessor to handle complex calculations and processes swiftly, meeting the demands of high-performance applications.
Support for a low-power mode helps in reducing energy consumption, heat dissipation, and extending the battery life of electronic devices powered by the microprocessor.
Microprocessors KMPC885CVR133 attributes and parameters. Explore more Microprocessors devices from Freescale Semiconductor
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KMPC885CVR133 Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A002
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
On December 7, 2015, NXP completed the merger with Freescale Semiconductor; the merged company continued its operation as NXP Semiconductors N.V.
1N4148WS
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20
Maxim Integrated
DS18B20 by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Commonly used in applications requiring precise temperature monitoring like HVAC systems and industrial automation.
LM555CM
Intersil
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BAV99
Kec
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
MBR0520LT1
Motorola
NC7WZ07P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
Comchip Technology
TM4C1294NCPDTI3
Texas Instruments
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
SMBJ18CA
Sangdest Microelectronics (Nanjing)
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Taiwan Semiconductor
SS14
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
LM7805CT
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
1N4148
Transys Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Operating Mode: ENHANCEMENT MODE;
M24308/2-1F
TE Connectivity
TE Connectivity's M24308/2-1F D-Sub Connector features 9 contacts, 2 rows, and a shell size of 1/E. With a rated current of 7.5A, it operates b/w -55°C to 125°C. Ideal for cable mounting applications, this connector has a steel shell with cadmium finish and uses crimp termination for female contact pins.
Forward International Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Maximum Operating Temperature: 200 Cel; No. of Phases: 1;
Daco Semiconductor
EU2B-YS3103F
Idec
ROTARY SWITCH;
P1010NXE5HHB
Freescale Semiconductor
MICROPROCESSOR, RISC; No. of Terminals: 425; Package Body Material: PLASTIC/EPOXY; Terminal Finish: TIN SILVER; Package Equivalence Code: BGA425,23X23,32; Technology: CMOS;
MPC8321EVRAFDCA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 0;
STM32MP131AAE3
STMicroelectronics
STM32MP131AAE3 by STMicroelectronics is a 32-bit microprocessor with 172032 RAM words, 48 MHz clock frequency, and 56 DMA channels. It is ideal for low power applications in IoT devices, offering a wide operating temperature range from -40 to 125 °C. With integrated cache and boundary scan feature, it ensures efficient data processing and testing capabilities.
ATSAMA5D31A-CFUR
Microchip Technology
ATSAMA5D31A-CFUR by Microchip Technology is a 32-bit microprocessor with 131072 RAM words, 48 MHz clock frequency, and 39 DMA channels. Ideal for industrial applications requiring high-speed processing and low power consumption. Features include integrated cache, boundary scan support, and a wide operating temperature range from -40 to 85 °C.
MCF54455VP266
MICROPROCESSOR; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
AT91SAM9G45-CU
AT91SAM9G45-CU by Microchip Technology is a 32-bit microprocessor with integrated cache and 8-bit on-chip data RAM. It features a max clock frequency of 50 MHz, 37 DMA channels, and operates in low power mode. This processor is commonly used in applications requiring high-speed processing and low power consumption.
MCF54453CVR200
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE;
STM32MP135DAE7
STM32MP135DAE7 by STMicroelectronics is a 32-bit microprocessor with 172032 RAM words and 48 MHz max clock frequency. Ideal for low power applications, it features 56 DMA channels and operates b/w -40 to 105 °C.
MCF5270CVM150R2
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LBGA; Package Shape: SQUARE;
MPC880ZP80
The NXP Semiconductors MPC880ZP80 microprocessor features 32-bit address and data bus width, with integrated cache and low power mode. It is a RISC-based processor with 357 terminals in a grid array package suitable for various applications requiring high-speed processing capabilities.
MPC8313VRADDC
NXP Semiconductors' MPC8313VRADDC microprocessor features 32-bit architecture, integrated cache, and max clock frequency of 66.67 MHz. Ideal for low power applications, it operates b/w 0-105°C with supply voltages ranging from 0.95-3.3V.
MPC8343ZQADDB
MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 620; Package Code: BGA; Package Shape: SQUARE;
AM3358BZCZ80
AM3358BZCZ80 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 16-bit external data bus width, and max clock frequency of 26 MHz. It is used in applications requiring low power mode, such as embedded systems and IoT devices.
MC9328MXSVP10R2
MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;
AM5749ABZXEA
The Texas Instruments AM5749ABZXEA microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 105 °C with a max clock frequency of 38.4 MHz.
MCIMX6U8DVM10AB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; External Data Bus Width: 64;
N80C186XL20
Rochester Electronics
N80C186XL20 by Rochester Electronics is a 16-bit microprocessor with 20-bit address bus width, operating at up to 40 MHz. It features low power mode, suitable for commercial applications requiring high-speed processing in a compact chip carrier package. With surface mount capability and CMOS technology, it offers efficient performance within a temperature range of 0-70°C.
STM32MP153FAA1
MICROPROCESSOR, RISC;
STM32MP135FAF7T
STM32MP135FAF7T by STMicroelectronics is a 32-bit microprocessor with integrated cache, 26-bit address bus width, and 48 MHz max clock frequency. It is ideal for applications requiring low power mode, such as IoT devices, industrial automation, and consumer electronics.
MCF5251VM140
The NXP Semiconductors MCF5251VM140 microprocessor features a 32-bit architecture, 24-bit address bus width, and integrated cache. It is suitable for applications requiring a max clock frequency of 140 MHz, such as embedded systems and industrial automation. With a low profile grid array package style and ball terminal form, it offers reliable performance in commercial-grade environments.
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KMPC8270CVRMIBA
KMPC8270CVRMIBA by Freescale Semiconductor is a 32-bit microprocessor with integrated cache and 64-bit external data bus width. It operates at a max clock frequency of 266 MHz and is suitable for applications requiring high-speed processing, such as networking equipment and industrial automation systems.
KMPC866TZP133A
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1.27 mm;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
KMPC8270VRMIBA
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;
KMPC8270CZUQLDA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE;
KMPC852TVR100A
The Freescale Semiconductor KMPC852TVR100A microprocessor features a 32-bit address and external data bus width, with a max clock frequency of 66 MHz. It is designed for low power mode applications, with integrated cache and boundary scan capabilities. Ideal for use in embedded systems requiring high-speed processing within a compact form factor.
KMPC885VR133
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B357;
KMPC8270CZQMIBA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Format: FLOATING POINT;
KMPC8347VVAJFB
MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 672; Package Code: LBGA; Package Shape: SQUARE;
KMPC8343CVRAGDB
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 620; Package Code: BGA; Package Shape: SQUARE;
KMPC8255ACVVMHBB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
KMPC880VR133
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
KMPC880ZP133
KMPC880ZP66
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
KMPC8572EVJARLE
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 245; Maximum Time At Peak Reflow Temperature (s): 30;
KMPC880ZP80
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.7 V;
KMPC870ZT66
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: HBGA; Package Shape: SQUARE; Low Power Mode: YES;
KMPC875ZT66
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: HBGA; Package Shape: SQUARE; Qualification: Not Qualified;
KMPC880CZP133
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 32;
KMPC885CVR66
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.9 V;
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