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STM32MP135AAG3

STMicroelectronics

STM32MP135AAG3 by STMicroelectronics

STM32MP135AAG3 by STMicroelectronics is a 32-bit microprocessor with 172032 RAM words and 48 MHz max clock frequency. Ideal for low power applications, it features 56 DMA channels and operates b/w -40 to 125 °C temperature range.

Median Price

$8.080

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 146 parts In-Stock

1+ parts

$3.544

100+ parts

-

1k+ parts

-

10k+ parts

-

146

$3.544

-

-

-

Chip1Stop

Japan . 146 parts In-Stock

1+ parts

$5.130

100+ parts

-

1k+ parts

-

10k+ parts

-

146

$5.130

-

-

-

Newark

USA . 300 parts In-Stock

1+ parts

$7.880

100+ parts

$5.300

1k+ parts

$5.080

10k+ parts

-

300

$7.880

$5.300

$5.080

-

Element14

Singapore . 150 parts In-Stock

1+ parts

$7.960

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$7.960

-

-

-

DigiKey

USA . 150 parts In-Stock

1+ parts

$8.200

100+ parts

$5.388

1k+ parts

$5.001

10k+ parts

$4.816

150

$8.200

$5.388

$5.001

$4.816

Mouser Electronics

USA . 93 parts In-Stock

1+ parts

$8.200

100+ parts

$5.390

1k+ parts

$4.820

10k+ parts

-

93

$8.200

$5.390

$4.820

-

RS (Exports)

UK . 248 parts In-Stock

1+ parts

$8.723

100+ parts

$7.083

1k+ parts

-

10k+ parts

-

248

$8.723

$7.083

-

-

Farnell

UK . 150 parts In-Stock

1+ parts

$9.440

100+ parts

$6.238

1k+ parts

$5.559

10k+ parts

-

150

$9.440

$6.238

$5.559

-

Verical

USA . 146 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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146

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,565 parts In-Stock

1+ parts

$3.563

100+ parts

-

1k+ parts

-

10k+ parts

-

2,565

$3.563

-

-

-

Nova Conductors

Japan . 35 parts In-Stock

1+ parts

$7.997

100+ parts

-

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-

10k+ parts

-

35

$7.997

-

-

-

Vyrian

USA . 8,721 parts In-Stock

1+ parts

-

100+ parts

-

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8,721

-

-

-

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IBS Electronics

USA . 1,557 parts In-Stock

1+ parts

-

100+ parts

$5.358

1k+ parts

$5.175

10k+ parts

-

1,557

-

$5.358

$5.175

-

Anansix

USA . 1,262 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,262

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 170 parts In-Stock

1+ parts

$3.310

100+ parts

-

1k+ parts

-

10k+ parts

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170

$3.310

-

-

-

Corphita

USA . 118 parts In-Stock

1+ parts

$3.376

100+ parts

-

1k+ parts

-

10k+ parts

-

118

$3.376

-

-

-

Semicontronic

India . 55 parts In-Stock

1+ parts

$3.520

100+ parts

$3.432

1k+ parts

$3.414

10k+ parts

-

55

$3.520

$3.432

$3.414

-

Continental Prestige Electronics

USA . 150 parts In-Stock

1+ parts

$5.710

100+ parts

$4.320

1k+ parts

-

10k+ parts

-

150

$5.710

$4.320

-

-

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$7.997

100+ parts

$7.597

1k+ parts

-

10k+ parts

$7.117

300

$7.997

$7.597

-

$7.117

Argo Parts USA

USA . 4,869 parts In-Stock

1+ parts

-

100+ parts

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4,869

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Overview

Discover the power and efficiency of the STM32MP135AAG3 microprocessor by STMicroelectronics. With a reputation for quality and innovation, STMicroelectronics delivers cutting-edge technology that meets the demands of modern applications. Ideal for a wide range of uses, this microprocessor offers integrated cache, low power modes, and a maximum clock frequency of 48 MHz. Unlock the potential of your projects with the STM32MP135AAG3 and experience the value, benefits, and advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Integrated Cache: YES

Having integrated cache improves performance by reducing data access time, making the processor efficient.

Maximum Supply Voltage: 1.38 V

The higher maximum supply voltage allows for better processing capabilities and performance under load.

On Chip Data RAM Width: 8

Having a wider on-chip data RAM width enables the processor to handle larger amounts of data simultaneously, improving multitasking capabilities.

Address Bus Width: 26

A wider address bus width allows the processor to access a larger memory space, enhancing overall performance.

Package Shape: SQUARE

The square package shape provides efficient use of space, making it easier to integrate the processor into various devices.

Bit Size: 32

A 32-bit processor can handle larger chunks of data at once, improving processing speed and efficiency.

No. of Terminals: 289

Having a high number of terminals allows for more connectivity options and versatility in system integration.

Minimum Supply Voltage: 1.21 V

The lower minimum supply voltage helps in reducing power consumption and heat generation, making the processor energy-efficient.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the processor can withstand harsh environmental conditions and maintain stable performance.

Minimum Operating Temperature: -40 °C

The processor can operate in low-temperature environments, making it suitable for a wide range of applications.

Terminal Position: BOTTOM

The bottom terminal position simplifies the installation process and allows for better heat dissipation.

Maximum Seated Height: 1.2 mm

The slim profile of the processor with a low seated height enables compact design solutions in devices.

RAM Words: 172032

A high number of RAM words allows for storing and processing a larger amount of data, enhancing the performance of the processor.

Width: 9 mm

The compact width of the processor enables it to be integrated into small form factor devices without compromising on performance.

Boundary Scan: YES

The presence of boundary scan simplifies testing and debugging processes, ensuring the reliability and quality of the product.

External Data Bus Width: 16

A wider external data bus width allows for faster data transfer between the processor and external devices, improving overall system performance.

Maximum Clock Frequency: 48 MHz

The high maximum clock frequency enables the processor to execute instructions at a faster rate, enhancing overall system speed.

Length: 9 mm

The compact length of the processor makes it suitable for applications where space is limited.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor allows for efficient execution of instructions, leading to better performance and power efficiency.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various devices, making the processor versatile.

Terminal Form: BALL

The ball terminal form provides reliable connections and allows for easy integration into circuit boards.

Maximum Supply Current: 239 mA

The maximum supply current requirement of 239 mA indicates efficient power usage, ensuring energy efficiency in the system.

Nominal Supply Voltage: 1.25 V

The nominal supply voltage of 1.25 V is within a safe operating range, ensuring stable performance of the processor.

No. of DMA Channels: 56

Having 56 DMA channels allows for efficient data transfer between peripherals and memory, improving overall system performance.

No. of Serial I/Os: 10

The presence of 10 serial I/Os provides versatile connectivity options for external devices, enhancing the functionality of the processor.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density packaging and enables compact system design.

Format: FIXED POINT

Using a fixed-point format simplifies arithmetic operations and improves processing efficiency in the processor.

Speed: 650 rpm

With a speed of 650 rpm, the processor can execute instructions quickly, enhancing overall system performance.

Low Power Mode: YES

The availability of a low power mode allows the processor to optimize power consumption based on the processing requirements, improving energy efficiency.

Technical Specifications

Microprocessors STM32MP135AAG3 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B289

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

10

No. of Terminals:

289

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.2 mm

Speed:

650 rpm

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

9 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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