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AM1802EZWTD3

Texas Instruments

AM1802EZWTD3 by Texas Instruments

AM1802EZWTD3 by Texas Instruments is a 32-bit microprocessor with integrated cache, 23-bit address bus width, and 8-bit on-chip data RAM. Ideal for industrial applications, it operates at up to 30 MHz clock frequency in low power mode with a max supply voltage of 1.32 V.

Median Price

$20.970

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,396 parts In-Stock

1+ parts

$13.048

100+ parts

$11.397

1k+ parts

$7.860

10k+ parts

-

9,396

$13.048

$11.397

$7.860

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Mouser Electronics

USA . 229 parts In-Stock

1+ parts

$20.970

100+ parts

$16.360

1k+ parts

$14.560

10k+ parts

-

229

$20.970

$16.360

$14.560

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DigiKey

USA . 70 parts In-Stock

1+ parts

$20.970

100+ parts

-

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70

$20.970

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,017 parts In-Stock

1+ parts

$12.396

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3,017

$12.396

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Chip Stock

USA . 6,500 parts In-Stock

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6,500

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VNN

France . 2,806 parts In-Stock

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2,806

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Vyrian

USA . 2,008 parts In-Stock

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2,008

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Holdelec - ElecDif-Pro

France . 20 parts In-Stock

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,919 parts In-Stock

1+ parts

$11.090

100+ parts

-

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2,919

$11.090

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Semicontronic

India . 2,802 parts In-Stock

1+ parts

$11.090

100+ parts

$10.813

1k+ parts

$10.757

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2,802

$11.090

$10.813

$10.757

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Corphita

USA . 3,354 parts In-Stock

1+ parts

$11.743

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3,354

$11.743

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Corohmni

South Africa . 40 parts In-Stock

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$13.670

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40

$13.670

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Parana Technologies

USA . 660 parts In-Stock

1+ parts

$51.131

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660

$51.131

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DigiPath Technology Company

USA . 489 parts In-Stock

1+ parts

$56.302

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489

$56.302

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ChromeModa Solutions

Germany . 331 parts In-Stock

1+ parts

$57.451

100+ parts

$47.110

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331

$57.451

$47.110

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IDEA Electronic Components Group

UK . 224 parts In-Stock

1+ parts

$57.451

100+ parts

$54.578

1k+ parts

$51.706

10k+ parts

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224

$57.451

$54.578

$51.706

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Lixinc

USA . 17,053 parts In-Stock

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17,053

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A-Z Elektronik GmbH

Germany . 7,340 parts In-Stock

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7,340

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Kepictronics

USA . 6,000 parts In-Stock

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Perfect Parts

USA . 5,342 parts In-Stock

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5,342

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Alle Elektronik GmbH

Germany . 4,893 parts In-Stock

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4,893

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Continental Prestige Electronics

USA . 4,517 parts In-Stock

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4,517

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Argo Parts USA

USA . 1,504 parts In-Stock

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1,504

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Overview

Unlock the power of cutting-edge technology with the AM1802EZWTD3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability in microprocessors. Ideal for a wide range of applications, this product offers seamless integration, high-speed performance, and low power consumption. Experience the ultimate value and efficiency that the AM1802EZWTD3 brings to your projects. Trust Texas Instruments to provide you with the innovative solutions you need to stay ahead in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microprocessors due to its durability and low cost, making the product cost-effective.

Integrated Cache: YES

Integrated cache helps improve the overall performance of the microprocessor by reducing access times to frequently used data.

Maximum Supply Voltage: 1.32 V

Higher maximum supply voltage allows for better performance and stability at higher clock speeds.

On Chip Data RAM Width: 8

Having a wider on-chip data RAM width allows for faster data processing and improved multitasking capabilities.

Address Bus Width: 23

A wider address bus width enables the microprocessor to access a larger memory space, enhancing its overall computational capabilities.

Terminal Position: BOTTOM

Having terminals at the bottom simplifies the assembly process and allows for better heat dissipation during operation.

Speed: 300 rpm

Operating at a speed of 300 rpm ensures efficient data processing and smooth performance for various applications.

Technical Specifications

Microprocessors AM1802EZWTD3 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

80

No. of Terminals:

361

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

172032

Maximum Seated Height:

1.4 mm

Speed:

300 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

AM1802EZWTD3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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