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AM1808BZCE3

Texas Instruments

AM1808BZCE3 by Texas Instruments

AM1808BZCE3 by Texas Instruments is a 32-bit microprocessor with integrated cache, operating at max 50 MHz. It has an address bus width of 23 bits and external data bus width of 16 bits. Ideal for low power applications in industrial automation and embedded systems due to its low profile package style and boundary scan feature.

Median Price

$17.000

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 69,824 parts In-Stock

1+ parts

-

100+ parts

$14.720

1k+ parts

$13.170

10k+ parts

$12.390

69,824

-

$14.720

$13.170

$12.390

DigiKey

USA . 69,824 parts In-Stock

1+ parts

-

100+ parts

$17.000

1k+ parts

-

10k+ parts

-

69,824

-

$17.000

-

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Verical

USA . 69,694 parts In-Stock

1+ parts

-

100+ parts

$18.400

1k+ parts

$16.462

10k+ parts

$15.488

69,694

-

$18.400

$16.462

$15.488

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,737 parts In-Stock

1+ parts

$15.532

100+ parts

-

1k+ parts

-

10k+ parts

-

4,737

$15.532

-

-

-

Vyrian

USA . 2,443 parts In-Stock

1+ parts

$16.350

100+ parts

-

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-

10k+ parts

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2,443

$16.350

-

-

-

Elcom Components

USA . 4 parts In-Stock

1+ parts

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 42 parts In-Stock

1+ parts

$5.120

100+ parts

-

1k+ parts

-

10k+ parts

-

42

$5.120

-

-

-

Ampacity Inc.

Singapore . 69,557 parts In-Stock

1+ parts

$13.900

100+ parts

-

1k+ parts

-

10k+ parts

-

69,557

$13.900

-

-

-

Corphita

USA . 1,667 parts In-Stock

1+ parts

$14.715

100+ parts

-

1k+ parts

-

10k+ parts

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1,667

$14.715

-

-

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Parana Technologies

USA . 1,593 parts In-Stock

1+ parts

$71.357

100+ parts

-

1k+ parts

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10k+ parts

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1,593

$71.357

-

-

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DigiPath Technology Company

USA . 228 parts In-Stock

1+ parts

$78.572

100+ parts

$72.287

1k+ parts

-

10k+ parts

-

228

$78.572

$72.287

-

-

ChromeModa Solutions

Germany . 3,626 parts In-Stock

1+ parts

$80.176

100+ parts

$65.744

1k+ parts

-

10k+ parts

-

3,626

$80.176

$65.744

-

-

IDEA Electronic Components Group

UK . 419 parts In-Stock

1+ parts

$80.176

100+ parts

$76.167

1k+ parts

$72.158

10k+ parts

-

419

$80.176

$76.167

$72.158

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A-Z Elektronik GmbH

Germany . 5,373 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,373

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

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4,500

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Alle Elektronik GmbH

Germany . 3,582 parts In-Stock

1+ parts

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3,582

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Northwest PG Solutions

USA . 1,347 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$5.018

10k+ parts

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1,347

-

-

$5.018

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Microchip USA

USA . 189 parts In-Stock

1+ parts

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189

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Kepictronics

USA . 34 parts In-Stock

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34

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Overview

Experience the power of the Texas Instruments AM1808BZCE3 Microprocessor, a cutting-edge solution for your embedded system needs. With a focus on quality and innovation, Texas Instruments delivers superior performance and reliability in every product. Ideal for a wide range of applications, this microprocessor offers unmatched value and benefits to customers looking for a high-performance solution. Trust in Texas Instruments to provide you with the tools you need to succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, making it suitable for various applications.

Integrated Cache: YES

Having an integrated cache improves the performance and efficiency of the microprocessor, allowing for faster data access and processing.

Maximum Supply Voltage: 1.32 V

The higher maximum supply voltage allows for flexibility and compatibility with a variety of power sources.

Address Bus Width: 23

A wider address bus width enables the microprocessor to access and manage a larger memory space, enhancing its capabilities.

Bit Size: 32

With a 32-bit architecture, this microprocessor can handle larger chunks of data at once, improving overall performance.

Power Supplies (V): 1.2, 1.8, 3.3

The multiple power supply options provide flexibility and compatibility in different voltage environments.

No. of Terminals: 361

Having a high number of terminals allows for more connectivity options and capabilities in the microprocessor.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures efficient power usage and compatibility with low-power applications.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature allows the microprocessor to function reliably in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the microprocessor can operate in cold environments without performance issues.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and resistance to corrosion, ensuring reliable connections for the microprocessor.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor enhances performance and efficiency in processing complex instructions quickly.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy efficient and reliable.

Speed: 375 rpm

The speed of 375 rpm allows for fast data processing and handling, improving overall performance.

Low Power Mode: YES

Having a low power mode option enables energy-saving and efficient operation, ideal for battery-powered devices.

Technical Specifications

Microprocessors AM1808BZCE3 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1V AND 1.1 V NOMINAL

Address Bus Width:

23

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.3 mm

Speed:

375 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

AM1808BZCE3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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