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AM1806EZCE3

Texas Instruments

AM1806EZCE3 by Texas Instruments

AM1806EZCE3 by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 30 MHz, suitable for low power applications in various industries like automotive and industrial automation. The package style is grid array with 361 terminals, making it ideal for compact designs requiring high processing speed.

Median Price

$12.218

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 80 parts In-Stock

1+ parts

$12.218

100+ parts

$10.672

1k+ parts

$7.360

10k+ parts

-

80

$12.218

$10.672

$7.360

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 682 parts In-Stock

1+ parts

$11.607

100+ parts

-

1k+ parts

-

10k+ parts

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682

$11.607

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-

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Vyrian

USA . 4,568 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,568

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 538 parts In-Stock

1+ parts

$0.986

100+ parts

-

1k+ parts

-

10k+ parts

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538

$0.986

-

-

-

Northwest PG Solutions

USA . 734 parts In-Stock

1+ parts

$1.085

100+ parts

-

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-

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734

$1.085

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-

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Ampacity Inc.

Singapore . 80 parts In-Stock

1+ parts

$10.390

100+ parts

-

1k+ parts

-

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80

$10.390

-

-

-

Corphita

USA . 756 parts In-Stock

1+ parts

$10.996

100+ parts

-

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756

$10.996

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AZTECH Wire

Italy . 436 parts In-Stock

1+ parts

$12.910

100+ parts

-

1k+ parts

-

10k+ parts

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436

$12.910

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Microchip USA

USA . 2,221 parts In-Stock

1+ parts

$35.270

100+ parts

$34.770

1k+ parts

$34.510

10k+ parts

$34.260

2,221

$35.270

$34.770

$34.510

$34.260

Parana Technologies

USA . 447 parts In-Stock

1+ parts

$47.083

100+ parts

-

1k+ parts

-

10k+ parts

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447

$47.083

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ChromeModa Solutions

Germany . 3,148 parts In-Stock

1+ parts

$52.902

100+ parts

$43.380

1k+ parts

-

10k+ parts

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3,148

$52.902

$43.380

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IDEA Electronic Components Group

UK . 1,608 parts In-Stock

1+ parts

$52.902

100+ parts

$50.257

1k+ parts

$47.612

10k+ parts

-

1,608

$52.902

$50.257

$47.612

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DigiPath Technology Company

USA . 800 parts In-Stock

1+ parts

-

100+ parts

$47.696

1k+ parts

-

10k+ parts

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800

-

$47.696

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Overview

Experience unparalleled performance and reliability with the AM1806EZCE3 by Texas Instruments, a cutting-edge microprocessor designed for a wide range of applications. With integrated cache and advanced technology, this product delivers superior processing power and efficiency. Whether you're working on embedded systems, industrial automation, or consumer electronics, this microprocessor is the perfect choice. Trust in Texas Instruments' reputation for quality and innovation, and unlock the full potential of your projects with the AM1806EZCE3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the package, ensuring long-term performance of the microprocessor.

Integrated Cache: YES

Having an integrated cache improves the processing speed and efficiency of the microprocessor, making it a good choice for handling complex tasks.

Maximum Supply Voltage: 1.32 V

Operating within a safe maximum supply voltage range ensures the stability and safety of the microprocessor, making it a reliable choice for various applications.

Surface Mount: YES

Being surface mountable makes the microprocessor easy to integrate into circuit boards, facilitating the manufacturing process.

Address Bus Width: 23

A wider address bus allows for more memory addresses to be accessed, enabling the microprocessor to handle large amounts of data efficiently.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the microprocessor can withstand demanding environments and maintain performance under stress.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computer) microprocessor offers improved performance and efficiency in executing instructions, making it a suitable choice for high-speed processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable in various applications.

Technical Specifications

Microprocessors AM1806EZCE3 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

80

No. of Terminals:

361

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

172032

Maximum Seated Height:

1.3 mm

Speed:

375 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

AM1806EZCE3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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