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AM1806BZCE3

Texas Instruments

AM1806BZCE3 by Texas Instruments

AM1806BZCE3 by Texas Instruments is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 30 MHz. Suitable for low power applications, it features a 23-bit address bus width and external data bus width of 16. Ideal for use in devices requiring high-speed processing within a temperature range of 0 to 90°C.

Median Price

$15.310

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 34,704 parts In-Stock

1+ parts

-

100+ parts

$13.250

1k+ parts

$11.860

10k+ parts

$11.160

34,704

-

$13.250

$11.860

$11.160

DigiKey

USA . 34,704 parts In-Stock

1+ parts

-

100+ parts

$15.310

1k+ parts

-

10k+ parts

-

34,704

-

$15.310

-

-

Verical

USA . 29,598 parts In-Stock

1+ parts

-

100+ parts

$16.563

1k+ parts

$14.825

10k+ parts

$13.950

29,598

-

$16.563

$14.825

$13.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,670 parts In-Stock

1+ parts

$13.984

100+ parts

-

1k+ parts

-

10k+ parts

-

4,670

$13.984

-

-

-

Vyrian

USA . 2,750 parts In-Stock

1+ parts

$14.720

100+ parts

-

1k+ parts

-

10k+ parts

-

2,750

$14.720

-

-

-

DigiKey Marketplace

USA . 34,704 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

34,704

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 590 parts In-Stock

1+ parts

$0.294

100+ parts

-

1k+ parts

-

10k+ parts

$0.282

590

$0.294

-

-

$0.282

Northwest PG Solutions

USA . 1,634 parts In-Stock

1+ parts

$0.323

100+ parts

-

1k+ parts

-

10k+ parts

$0.285

1,634

$0.323

-

-

$0.285

Ampacity Inc.

Singapore . 34,623 parts In-Stock

1+ parts

$12.510

100+ parts

-

1k+ parts

-

10k+ parts

-

34,623

$12.510

-

-

-

Corphita

USA . 3,986 parts In-Stock

1+ parts

$13.248

100+ parts

-

1k+ parts

-

10k+ parts

-

3,986

$13.248

-

-

-

Parana Technologies

USA . 2,199 parts In-Stock

1+ parts

$44.054

100+ parts

-

1k+ parts

-

10k+ parts

-

2,199

$44.054

-

-

-

DigiPath Technology Company

USA . 890 parts In-Stock

1+ parts

$48.509

100+ parts

-

1k+ parts

-

10k+ parts

-

890

$48.509

-

-

-

ChromeModa Solutions

Germany . 6,463 parts In-Stock

1+ parts

$49.499

100+ parts

$40.589

1k+ parts

-

10k+ parts

-

6,463

$49.499

$40.589

-

-

IDEA Electronic Components Group

UK . 2,182 parts In-Stock

1+ parts

$49.499

100+ parts

$47.024

1k+ parts

$44.549

10k+ parts

-

2,182

$49.499

$47.024

$44.549

-

Microchip USA

USA . 484 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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484

-

-

-

-

Overview

Experience the unparalleled performance and reliability of the Texas Instruments AM1806BZCE3 microprocessor. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge technology and innovation. The AM1806BZCE3 is perfect for a wide range of applications, offering seamless integration and high-speed processing. Unlock new possibilities and achieve optimal efficiency with this top-of-the-line microprocessor. Elevate your projects with the unmatched quality and value that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

Having an integrated cache improves the efficiency and speed of data processing, making this microprocessor ideal for high-performance computing.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage of 1.32 V allows for reliable operation without risk of overloading the microprocessor.

Address Bus Width: 23

With a wide address bus width of 23, this microprocessor can handle large amounts of memory and data efficiently.

Package Shape: SQUARE

The square package shape allows for easy integration and placement within electronic devices, optimizing space usage.

Bit Size: 32

Having a 32-bit architecture enables this microprocessor to handle complex computations and tasks with precision and accuracy.

Power Supplies (V): 1.2, 1.8, 3.3

Supporting multiple power supply voltages allows for flexibility in different operating conditions and power requirements.

No. of Terminals: 361

The high number of terminals enables efficient connectivity and communication with other components in the system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style provides versatility in mounting and installation options, catering to different design requirements.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14 V ensures stable operation even under low power conditions, improving energy efficiency.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature of 90°C, this microprocessor can withstand elevated temperatures without compromising performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures reliable operation even in cold environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and signal transmission.

Terminal Position: BOTTOM

The bottom terminal position simplifies installation and alignment of the microprocessor within the system.

Maximum Seated Height: 1.4 mm

The low maximum seated height allows for compact design integration and space-saving in electronic devices.

Width: 16 mm

With a width of 16 mm, this microprocessor can fit seamlessly into a variety of device configurations.

Boundary Scan: YES

Having boundary scan capability enables efficient testing and debugging of the microprocessor during development and production.

External Data Bus Width: 16

The external data bus width of 16 allows for high-speed data transfer and processing, enhancing overall system performance.

Maximum Clock Frequency: 30 MHz

The maximum clock frequency of 30 MHz provides fast processing speeds for demanding applications and tasks.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures that the microprocessor can withstand peak reflow temperatures for a sufficient duration during manufacturing processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable soldering and assembly of the microprocessor in circuit boards.

Length: 16 mm

The compact length of 16 mm contributes to the overall space efficiency of the microprocessor in electronic devices.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor, it offers simplified instruction sets and high performance for specific computing tasks.

Technology: CMOS

The CMOS technology used in this microprocessor provides low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

With a ball terminal form, the microprocessor can be easily mounted and connected to circuit boards for seamless integration.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V ensures consistent and reliable power delivery to the microprocessor for stable operation.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8 mm allows for precise and compact placement of the microprocessor on circuit boards.

Format: FIXED POINT

Having a fixed-point format simplifies arithmetic operations and calculations, making the microprocessor suitable for specific computational tasks.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, precautions must be taken to protect the microprocessor from moisture during storage and handling.

Speed: 375 rpm

The speed of 375 rpm allows for quick data processing and task execution, making this microprocessor efficient for various applications.

Low Power Mode: YES

The low power mode capability enables the microprocessor to operate efficiently in power-saving modes, reducing energy consumption and heat generation.

Technical Specifications

Microprocessors AM1806BZCE3 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Speed:

375 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

AM1806BZCE3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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