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AM1808BZCE4

Texas Instruments

AM1808BZCE4 by Texas Instruments

AM1808BZCE4 by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. Operating at up to 50 MHz, it has a max supply voltage of 1.35 V and is suitable for low power applications in various industries such as automotive and industrial automation.

Median Price

$18.310

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 34,893 parts In-Stock

1+ parts

-

100+ parts

$15.850

1k+ parts

$14.180

10k+ parts

$13.340

34,893

-

$15.850

$14.180

$13.340

DigiKey

USA . 34,287 parts In-Stock

1+ parts

-

100+ parts

$18.310

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34,287

-

$18.310

-

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Verical

USA . 29,034 parts In-Stock

1+ parts

-

100+ parts

$19.813

1k+ parts

$17.725

10k+ parts

$16.675

29,034

-

$19.813

$17.725

$16.675

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,217 parts In-Stock

1+ parts

$16.730

100+ parts

-

1k+ parts

-

10k+ parts

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4,217

$16.730

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-

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Vyrian

USA . 3,078 parts In-Stock

1+ parts

$17.610

100+ parts

-

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3,078

$17.610

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DigiKey Marketplace

USA . 34,927 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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34,927

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 699 parts In-Stock

1+ parts

$5.120

100+ parts

-

1k+ parts

-

10k+ parts

-

699

$5.120

-

-

-

Ampacity Inc.

Singapore . 34,238 parts In-Stock

1+ parts

$14.970

100+ parts

-

1k+ parts

-

10k+ parts

-

34,238

$14.970

-

-

-

Corphita

USA . 3,419 parts In-Stock

1+ parts

$15.849

100+ parts

-

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3,419

$15.849

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Parana Technologies

USA . 1,819 parts In-Stock

1+ parts

$19.786

100+ parts

-

1k+ parts

$19.752

10k+ parts

-

1,819

$19.786

-

$19.752

-

ChromeModa Solutions

Germany . 5,632 parts In-Stock

1+ parts

$22.231

100+ parts

$18.229

1k+ parts

-

10k+ parts

-

5,632

$22.231

$18.229

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-

IDEA Electronic Components Group

UK . 1,889 parts In-Stock

1+ parts

$22.231

100+ parts

$21.119

1k+ parts

$20.008

10k+ parts

-

1,889

$22.231

$21.119

$20.008

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S.R.D Solutions

India . 46,000 parts In-Stock

1+ parts

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46,000

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A-Z Elektronik GmbH

Germany . 6,974 parts In-Stock

1+ parts

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6,974

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Alle Elektronik GmbH

Germany . 4,649 parts In-Stock

1+ parts

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4,649

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DigiPath Technology Company

USA . 1,388 parts In-Stock

1+ parts

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100+ parts

$20.043

1k+ parts

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10k+ parts

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1,388

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$20.043

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Northwest PG Solutions

USA . 1,313 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$5.018

10k+ parts

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1,313

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$5.018

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Microchip USA

USA . 266 parts In-Stock

1+ parts

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266

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Overview

Experience unparalleled performance and reliability with the AM1808BZCE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microprocessors that are ideal for a wide range of applications. With integrated cache, low power mode, and a maximum clock frequency of 50 MHz, this product offers exceptional value to customers seeking high-speed processing and efficiency. Trust Texas Instruments to provide you with cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the AM1808BZCE4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good durability and protection for the microprocessor, ensuring its longevity and reliability.

Integrated Cache: YES

Having integrated cache helps in improving the overall performance and speed of the microprocessor by reducing data access times.

Maximum Supply Voltage: 1.35 V

Operating within the maximum supply voltage of 1.35V ensures efficient power consumption and reduces the risk of overheating or damage to the microprocessor.

Address Bus Width: 23

With a wide address bus width of 23, the microprocessor can handle large amounts of memory and data more efficiently, making it suitable for demanding tasks.

Package Shape: SQUARE

Square package shape allows for easier integration and placement of the microprocessor on a circuit board, optimizing space and layout design.

Bit Size: 32

32-bit architecture enables the microprocessor to process data in chunks of 32 bits, enhancing its processing capabilities and performance.

Power Supplies (V): 1.3,1.8,3.3

Supporting multiple power supply voltages provides flexibility in different usage scenarios and allows for efficient power management.

No. of Terminals: 361

Having a high number of terminals allows for more connections and interfaces, enabling the microprocessor to communicate with other components effectively.

Minimum Supply Voltage: 1.25 V

Operating with a minimum supply voltage of 1.25V ensures stable performance and reliability, especially under low power conditions.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature of 90°C, the microprocessor can withstand elevated temperatures without compromising its functionality or lifespan.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C ensures the microprocessor can function in colder environments without any performance issues.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides good conductivity and corrosion resistance, ensuring reliable connections and signal transmission.

Terminal Position: BOTTOM

Having terminals positioned at the bottom enables easy installation and connection of the microprocessor onto a circuit board, simplifying the assembly process.

Maximum Seated Height: 1.3 mm

With a low maximum seated height of 1.3mm, the microprocessor can be installed in compact spaces or slim devices without sacrificing performance or functionality.

Width: 13 mm

With a moderate width of 13mm, the microprocessor can fit well within standard circuit board layouts and designs, ensuring compatibility with various systems.

Boundary Scan: YES

Having boundary scan capability allows for efficient testing and debugging of the microprocessor during production or maintenance, ensuring quality and reliability.

External Data Bus Width: 16

With a wide external data bus width of 16, the microprocessor can handle data transfers efficiently and effectively between external devices and components.

Maximum Clock Frequency: 50 MHz

Operating at a maximum clock frequency of 50MHz allows the microprocessor to perform tasks at high speeds, making it suitable for applications requiring quick data processing.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the microprocessor can undergo soldering processes without encountering heat-related issues.

Peak Reflow Temperature °C: 260

Being able to withstand a peak reflow temperature of 260°C ensures the microprocessor remains stable and functional during soldering procedures.

Length: 13 mm

With a moderate length of 13mm, the microprocessor can be accommodated within various device designs and form factors, offering versatility in product development.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor allows for efficient and streamlined processing of instructions, improving overall performance and speed of operations.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high speed, and compatibility with various devices, making the microprocessor energy-efficient and versatile.

Terminal Form: BALL

Having ball terminal form simplifies the installation and connection process of the microprocessor, ensuring secure and reliable connections for optimal performance.

Nominal Supply Voltage: 1.3 V

Operating at a nominal supply voltage of 1.3V ensures stable and efficient power delivery to the microprocessor, enhancing its overall performance and reliability.

Terminal Pitch: 0.65 mm

With a small terminal pitch of 0.65mm, the microprocessor allows for closer spacing of terminals, enabling compact design and efficient signal transmission.

Format: FIXED POINT

Utilizing a fixed-point format simplifies arithmetic operations and enhances accuracy in calculations, making the microprocessor suitable for precise computational tasks.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the microprocessor can withstand moderate exposure to moisture during assembly or storage, ensuring reliability.

Speed: 456 rpm

Operating at a speed of 456 rpm allows the microprocessor to execute instructions and tasks swiftly, making it suitable for high-performance applications and computing needs.

Low Power Mode: YES

Having a low power mode feature helps in reducing power consumption during idle or low-load situations, improving energy efficiency and prolonging battery life in portable devices.

Technical Specifications

Microprocessors AM1808BZCE4 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1V AND 1.1 V NOMINAL

Address Bus Width:

23

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.3 mm

Speed:

456 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

AM1808BZCE4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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