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MPC8347EVVAJDB

NXP Semiconductors

MPC8347EVVAJDB by NXP Semiconductors

The NXP Semiconductors MPC8347EVVAJDB is a 32-bit microprocessor with integrated cache and external data bus width of 32. It operates at a max clock frequency of 66 MHz, suitable for low power mode applications in various industries. With a package style of grid array and low profile, it offers high performance within a compact form factor.

Median Price

$131.829

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,799 parts In-Stock

1+ parts

$121.220

100+ parts

$113.950

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$106.670

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3,799

$121.220

$113.950

$106.670

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Verical

USA . 3,436 parts In-Stock

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$142.438

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$133.338

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DigiKey

USA . 48 parts In-Stock

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Digiode

USA . 1,592 parts In-Stock

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$116.270

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Anansix

USA . 1,953 parts In-Stock

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Vyrian

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DigiKey Marketplace

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Nova Conductors

Japan . 10 parts In-Stock

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Prism Electronics

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Distributors (Availability)

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Corohmni

South Africa . 197 parts In-Stock

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$62.535

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$62.535

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Aztec Data Supply Inc.

USA . 894 parts In-Stock

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$80.674

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Ampacity Inc.

Singapore . 2,317 parts In-Stock

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$104.030

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Corphita

USA . 765 parts In-Stock

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$110.151

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Component Stockers USA

USA . 33 parts In-Stock

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$178.620

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Vigor

Singapore . 209 parts In-Stock

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Microchip USA

USA . 122 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 13,213 parts In-Stock

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UNI Independent Distributors

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Perfect Parts

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Futuretech Components

Singapore . 898 parts In-Stock

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Aranea Global

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Authorized Procurement Solutions

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Continental Prestige Electronics

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Argo Parts USA

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Overview

Unleash the power of the MPC8347EVVAJDB by NXP Semiconductors, a cutting-edge microprocessor that elevates performance to new heights. With integrated cache and a maximum clock frequency of 66 MHz, this powerhouse delivers seamless operation for a multitude of applications. NXP Semiconductors, renowned for quality and reliability, ensures that every product meets the highest standards. From smart appliances to industrial automation, the MPC8347EVVAJDB offers unparalleled value, efficiency, and innovation, making it the go-to choice for tech-savvy customers looking to stay ahead in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components as it is cost-effective, lightweight, and offers good protection for the internal circuitry.

Integrated Cache: YES

Having integrated cache helps improve the overall performance of the microprocessor by reducing the average time to access memory.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the microprocessor onto a PCB, making it a more versatile and convenient option.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26V ensures safe and reliable operation of the microprocessor within specified limits, preventing any potential damage due to overvoltage.

Address Bus Width: 32

A wider address bus width of 32 bits allows the microprocessor to access a larger memory space, enabling it to handle more data and perform complex operations efficiently.

Package Shape: SQUARE

The square package shape makes the microprocessor easier to handle and mount on a PCB, ensuring a more secure and stable connection.

Bit Size: 32

With a bit size of 32, the microprocessor can process data in 32-bit chunks, enhancing performance and speed of computations.

Power Supplies (V): 1.2,2.5,3.3

Having multiple power supply options allows for greater flexibility in system design and compatibility with various voltage requirements.

No. of Terminals: 672

With 672 terminals, the microprocessor can accommodate a large number of connections, supporting multiple functions and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array, low profile package style helps in achieving a compact and space-efficient design, ideal for applications with size constraints.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14V ensures stable operation of the microprocessor even under low power conditions, enhancing reliability and performance.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures that the microprocessor can withstand challenging thermal conditions, making it suitable for demanding environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C indicates that the microprocessor can function effectively even in cold environments, providing versatility in application usage.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easier and more secure PCB mounting, ensuring reliable electrical connections.

Maximum Seated Height: 1.69 mm

The low maximum seated height of 1.69mm allows for a slim and compact overall design, ideal for space-constrained applications.

Width: 35 mm

The width of 35mm provides a balanced form factor for the microprocessor, making it suitable for a wide range of PCB layouts and configurations.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the microprocessor during production, ensuring high quality and reliability in the final product.

External Data Bus Width: 32

A wider external data bus width of 32 bits allows for faster data transfer between the microprocessor and external devices, enhancing overall system performance.

Maximum Clock Frequency: 66 MHz

The high maximum clock frequency of 66 MHz enables the microprocessor to perform operations at a faster rate, improving overall system responsiveness and efficiency.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum time of 40 seconds at peak reflow temperature, the microprocessor can undergo solder reflow processes effectively, ensuring reliable assembly on a PCB.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for proper soldering of the microprocessor on a PCB, creating strong and durable connections.

Length: 35 mm

The length of 35mm provides a standardized form factor for the microprocessor, ensuring compatibility with various PCB layouts and enclosure designs.

Peripheral IC Type: MICROPROCESSOR

Being a microprocessor, this product is designed specifically for handling various computing tasks efficiently, making it a reliable choice for processing-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and faster switching speeds, making the microprocessor energy-efficient and reliable for long-term operation.

Terminal Form: BALL

Having ball terminals simplifies the soldering process and enhances the reliability of electrical connections, ensuring stable performance of the microprocessor in the system.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2V indicates the standard operating voltage for the microprocessor, ensuring optimal performance and compatibility with common power sources.

Terminal Pitch: 1 mm

The 1mm terminal pitch allows for compact and closely spaced connections on the PCB, optimizing board real estate and enabling efficient signal routing.

Format: FLOATING POINT

Utilizing a floating-point format enables the microprocessor to perform complex mathematical calculations with higher precision and accuracy, making it suitable for scientific and computational applications.

Moisture Sensitivity Level (MSL): 3

Having an MSL of 3 indicates moderate sensitivity to moisture, requiring proper handling and storage to prevent any potential damage during manufacturing and assembly processes.

Speed: 533 rpm

With a speed of 533 rpm, the microprocessor can execute instructions and process data at a rapid rate, enhancing overall system performance and responsiveness.

Low Power Mode: YES

The presence of a low power mode allows the microprocessor to operate at reduced power levels during idle or low-demand periods, conserving energy and prolonging battery life in portable devices.

Technical Specifications

Microprocessors MPC8347EVVAJDB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B672

Length:

35 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

672

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA672,34X34,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,2.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.69 mm

Speed:

533 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

35 mm

Peripheral IC Type:

Trade Compliance

MPC8347EVVAJDB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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