Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The NXP Semiconductors MPC8313CVRADDC is a 32-bit microprocessor with integrated cache, operating at a max frequency of 66.67 MHz. It features a 32-bit external data bus width and supports low power mode, making it ideal for industrial applications requiring high-speed processing in compact form factors.
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$31.940
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Rochester
$35.920
$32.140
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Perfect Parts
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Aranea Global
Kepictronics
The plastic/epoxy package material provides durability and protection to the microprocessor, ensuring reliable performance in various environments.
Having integrated cache helps improve the overall processing speed and efficiency of the microprocessor, making it suitable for tasks that require quick access to data.
The low maximum supply voltage of 1.05 V results in reduced power consumption and heat generation, making the microprocessor energy-efficient.
With a 32-bit address bus width, the microprocessor can access a large amount of memory, allowing for efficient data handling and processing.
The square package shape helps in easy integration and mounting of the microprocessor onto circuit boards, enhancing the overall design flexibility.
The 32-bit architecture allows the microprocessor to handle data in 32-bit chunks, improving efficiency and speed in data processing tasks.
The availability of multiple power supply options allows for compatibility with various systems and voltage requirements, making the microprocessor versatile.
Having 516 terminals provides a wide range of connectivity options, enabling the microprocessor to interface with multiple peripherals and components for enhanced functionality.
The grid array package style offers a compact and efficient layout, optimizing space utilization on circuit boards and facilitating easier assembly.
The low minimum supply voltage of 0.95 V ensures that the microprocessor can operate efficiently even at lower power levels, contributing to energy savings.
With a high maximum operating temperature of 105°C, the microprocessor can withstand elevated temperature conditions without compromising performance, ensuring reliability in demanding applications.
The wide temperature range of -40°C to 105°C allows the microprocessor to function effectively in both extreme cold and hot environments, enhancing its versatility and durability.
The tin silver terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections and long-term performance of the microprocessor.
Having terminals located at the bottom facilitates easier soldering and mounting of the microprocessor onto circuit boards, streamlining the manufacturing process.
The low maximum seated height of 2.55 mm allows for a compact and slim profile, making the microprocessor suitable for applications where space is limited.
The 27 mm width provides a balance between compactness and ease of integration, allowing the microprocessor to be conveniently installed in various devices and systems.
The presence of boundary scan capability enables efficient testing and debugging of the microprocessor during manufacturing and system integration, ensuring higher product quality.
Having a 32-bit external data bus width enables faster data transfer between the microprocessor and external components, improving overall system performance.
With a maximum clock frequency of 66.67 MHz, the microprocessor can process instructions and data at high speeds, making it suitable for demanding computational tasks.
The maximum time of 40 seconds at peak reflow temperature ensures proper soldering and assembly of the microprocessor without damaging its components, enhancing product reliability.
The peak reflow temperature of 260°C allows for effective soldering and reworking processes during assembly, ensuring secure and durable connections for the microprocessor.
The 27 mm length provides a compact form factor for the microprocessor, allowing for easy fitment and integration in space-constrained devices and systems.
The industrial temperature grade ensures that the microprocessor can operate reliably in harsh industrial environments with wide temperature variations, meeting the stringent requirements of industrial applications.
Being a microprocessor, this product is designed for high-speed data processing, complex computations, and interfacing with various peripherals, making it suitable for a wide range of applications.
Utilizing CMOS technology offers low power consumption, high noise immunity, and versatile design options, making the microprocessor energy-efficient and reliable in diverse operational scenarios.
Having terminal balls allows for easier alignment and connection during the assembly process, improving the overall reliability and efficiency of the microprocessor.
The nominal supply voltage of 1 V provides a stable power source for the microprocessor, ensuring consistent and reliable performance in various operating conditions.
The 1 mm terminal pitch offers compatibility with standard PCB layouts and assembly processes, making it easier to integrate the microprocessor into existing systems.
The floating-point format allows the microprocessor to handle complex mathematical calculations with high precision and efficiency, making it suitable for applications requiring advanced computational capabilities.
With an MSL of 3, the microprocessor can withstand moderate exposure to moisture during storage and handling, ensuring reliability and performance consistency over time.
With a speed of 266 rpm, the microprocessor can process instructions and data at a rapid pace, making it ideal for applications that require high computing speeds and performance.
The availability of a low power mode allows the microprocessor to reduce its power consumption during idle or low-demand periods, enhancing energy efficiency and extending battery life in portable devices.
Microprocessors MPC8313CVRADDC attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Address Bus Width:
Bit Size:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Speed:
Sub-Category:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
MPC8313CVRADDC Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
USB3320C-EZK-TR
Standard Microsystems
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
BAV99
Comchip Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Rectron
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MBR0520LT1
Motorola
LM107H/883
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
LL4148
Transys Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3.5 ohm; Maximum Drain Current (ID): .2 A; Peak Reflow Temperature (C): NOT SPECIFIED;
DS18B20
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 3; Package Shape or Style: ROUND; Housing: PLASTIC; Output Interface Type: 1-WIRE INTERFACE;
2N7002
Calogic
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): NOT SPECIFIED; Terminal Position: DUAL;
BSS138-TP
Micro Commercial Components
BSS138-TP by Micro Commercial Components is a N-channel small signal FET with a min DS breakdown voltage of 50V and max drain current of 0.22A. It is commonly used in applications requiring enhancement mode operation, such as power management and switching circuits.
LM358AN
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
Microchip Technology
Microchip Technology's USB3320C-EZK-TR is a Bus Controller IC with 32 terminals, operating at 1.6-2V. It supports USB bus compatibility, clock frequency up to 60MHz, and CMOS technology. Ideal for applications requiring Universal Serial Bus peripherals in compact designs with low power consumption.
SMBJ18CA
Onsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
2N2222A
Digitron Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
MC7805CTG
MC7805CTG by Onsemi is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring stable voltage regulation. The package style is flange mount with through-hole terminals, ensuring easy installation and reliability in diverse electronic designs.
BSS138W-7-F
Diodes Incorporated
Diodes Inc.'s BSS138W-7-F is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, Gull Wing terminals, and operates in enhancement mode. With 0.2A max drain current and 3.5 ohm RDS(on), it's UL recognized and suitable for small outline packages at temperatures ranging from -55 to 150°C.
Toshiba
CP80C88-2Z
Renesas Electronics
CP80C88-2Z by Renesas Electronics is a 16-bit microprocessor with an address bus width of 20 and external data bus width of 8. It operates b/w 0 to 70 °C, suitable for commercial applications requiring low power consumption at speeds up to 8 rpm.
MPC5200CVR400B
Freescale Semiconductor
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE;
AM5708BCBDJEA
Texas Instruments
AM5708BCBDJEA by Texas Instruments is a Microprocessor with 32-bit External Data Bus, 16-bit Address Bus, and integrated cache. It operates at a max clock frequency of 38.4 MHz and supports low power mode. Ideal for industrial applications requiring high-speed processing in compact form factor.
MIMXRT1175DVMAA
NXP Semiconductors
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;
MPC860DEZQ50D4
The NXP Semiconductors MPC860DEZQ50D4 is a 32-bit microprocessor with integrated cache and 3.3V power supply. It features a max clock frequency of 50 MHz, suitable for low power mode applications in various industries like telecommunications and networking. With a package style of grid array and terminal pitch of 1.27mm, it offers high performance in a compact design.
N80C186XL20
Rochester Electronics
N80C186XL20 by Rochester Electronics is a 16-bit microprocessor with 20-bit address bus width, operating at up to 40 MHz. It features low power mode, suitable for commercial applications requiring high-speed processing in a compact chip carrier package. With surface mount capability and CMOS technology, it offers efficient performance within a temperature range of 0-70°C.
AM5748ABZXA
The Texas Instruments AM5748ABZXA microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at temperatures ranging from -40 to 105°C with low power mode support. The package style is grid array with 760 terminals in a square shape.
P1014NXE5HFB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE; Maximum Clock Frequency: 100 MHz;
SMOMAPL138BGWTA3R
Texas Instruments SMOMAPL138BGWTA3R is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 30 MHz, suitable for industrial applications requiring low power mode and floating-point format processing. With a terminal pitch of 0.8 mm and 361 terminals, it offers high performance in a compact package style.
MCF5272CVM66
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: BGA; Package Shape: SQUARE;
MCF5484CZP200
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE;
P1010NXE5FFA
MICROPROCESSOR, RISC; No. of Terminals: 425; Maximum Time At Peak Reflow Temperature (s): 40; Package Body Material: PLASTIC/EPOXY; Peak Reflow Temperature (C): 260; Qualification: Not Qualified;
ATSAMA5D27C-D5M-CU
ATSAMA5D27C-D5M-CU by Microchip Technology is a 16-bit microprocessor with integrated cache, operating at up to 24 MHz. Ideal for industrial applications, it features 65536 RAM words and 51 DMA channels, supporting low power mode with a supply voltage range of 1.14V to 1.3V.
MIMXRT1061DVL6B
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Peak Reflow Temperature (C): 260;
MCF54418CMJ250
The NXP Semiconductors MCF54418CMJ250 microprocessor features a 32-bit architecture, integrated cache, and operates at a max clock frequency of 100 MHz. Ideal for industrial applications requiring low power consumption, it supports multiple power supplies (1.2V, 1.8V, 3.3V) and has a temperature range of -40 to 85°C.
MCF5272VM66R2
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: BGA; Package Shape: SQUARE;
AM1705DPTP4
AM1705DPTP4 by Texas Instruments is a 32-bit microprocessor with integrated cache and 176 terminals. It operates at a max clock frequency of 50 MHz, suitable for low power applications. With a package style of flatpack and boundary scan capability, it is ideal for embedded systems requiring high performance in compact designs.
CL8068404165200SRFEH
Intel
Intel CL8068404165200SRFEH microprocessor features 64-bit technology, 4100 rpm speed, and integrated cache. Suitable for various applications requiring high processing power and efficiency. With 1440 terminals in a rectangular package shape, it is ideal for surface mount configurations in electronic devices.
STM32MP151DAC1
STMicroelectronics
STM32MP151DAC1 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 48 MHz clock frequency. It features 361 terminals, 724992 RAM words, and operates b/w -20 to 105 °C. Ideal for low power applications in IoT devices, wearables, and industrial automation systems.
P3041NXN7PNC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1295;
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MPC8270CVRMIBA
The NXP Semiconductors MPC8270CVRMIBA is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 266 MHz. It features an external data bus width of 64 bits and is suitable for applications requiring high-speed processing in devices such as networking equipment and industrial control systems.
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;
MPC8308CVMAGDA
NXP Semiconductors' MPC8308CVMAGDA is a 32-bit microprocessor with integrated cache, operating at speeds up to 400 rpm. It features low power mode and boundary scan support, suitable for industrial applications. With a package style of grid array and fine pitch, it offers 473 terminals in a compact square shape.
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 473; Package Code: LFBGA; Package Shape: SQUARE;
MPC8270CVRMIBA,557
NXP Semiconductors' MPC8270CVRMIBA,557 microprocessor features 32-bit address bus width, 64-bit external data bus width, and a max clock frequency of 266 MHz. Ideal for applications requiring high-speed processing such as networking equipment and industrial automation systems.
MPC8308VMAGDA
The NXP Semiconductors MPC8308VMAGDA microprocessor features integrated cache, operates at a max clock frequency of 66.67 MHz, and supports low power mode. Ideal for applications requiring high-speed processing in a compact form factor with a square package shape and 473 terminals.
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 473; Package Code: LFBGA; Package Shape: SQUARE; Data EEPROM Size: 0;
MPC8314VRAGDA
MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 620; Package Code: HBGA; Package Shape: SQUARE;
The NXP Semiconductors MPC8314VRAGDA is a 32-bit microprocessor with integrated cache, operating at a max frequency of 66.67 MHz. It features low power mode and boundary scan capabilities, making it suitable for applications requiring high-speed processing in compact devices. With a package style of grid array and heat sink/slug, this processor is ideal for use in various embedded systems where space efficiency is crucial.
MPC8569EVTAUNLB
MPC8569EVTAUNLB by Freescale: 32-bit microprocessor with 64-bit data bus, 16-bit address bus, and integrated cache. Ideal for RISC applications requiring low power mode, operating at max clock frequency of 133 MHz. Features grid array package style suitable for surface mount assembly.
MPC8321ECVRADDCA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 0;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B516;
MPC8270VRMIBA
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;
MPC8321VRADDCA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Bit Size: 32;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
MPC8280CZUQLDA
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE;
MPC852TVR100A
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA256,16X16,50;
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