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AM1705DPTPD4

Texas Instruments

AM1705DPTPD4 by Texas Instruments

AM1705DPTPD4 by Texas Instruments is a 32-bit microprocessor with integrated cache and 8-bit on-chip data RAM. It features an address bus width of 13, external data bus width of 16, and operates at a max clock frequency of 50 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$19.188

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 187 parts In-Stock

1+ parts

$14.366

100+ parts

$12.548

1k+ parts

$8.654

10k+ parts

-

187

$14.366

$12.548

$8.654

-

Mouser Electronics

USA . 4 parts In-Stock

1+ parts

$24.010

100+ parts

$14.730

1k+ parts

$14.640

10k+ parts

-

4

$24.010

$14.730

$14.640

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,844 parts In-Stock

1+ parts

$13.648

100+ parts

-

1k+ parts

-

10k+ parts

-

3,844

$13.648

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$16.920

100+ parts

-

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-

10k+ parts

-

300

$16.920

-

-

-

Vyrian

USA . 6,139 parts In-Stock

1+ parts

-

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-

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6,139

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-

-

-

VNN

France . 3,546 parts In-Stock

1+ parts

-

100+ parts

-

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-

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3,546

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 25 parts In-Stock

1+ parts

$12.210

100+ parts

-

1k+ parts

-

10k+ parts

-

25

$12.210

-

-

-

Corphita

USA . 1,434 parts In-Stock

1+ parts

$12.929

100+ parts

-

1k+ parts

-

10k+ parts

-

1,434

$12.929

-

-

-

Aranea Global

USA . 50 parts In-Stock

1+ parts

$16.582

100+ parts

-

1k+ parts

$15.918

10k+ parts

-

50

$16.582

-

$15.918

-

Continental Prestige Electronics

USA . 5,426 parts In-Stock

1+ parts

$16.920

100+ parts

-

1k+ parts

-

10k+ parts

$16.582

5,426

$16.920

-

-

$16.582

AZTECH Wire

Italy . 741 parts In-Stock

1+ parts

$17.397

100+ parts

-

1k+ parts

-

10k+ parts

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741

$17.397

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-

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Microchip USA

USA . 1,469 parts In-Stock

1+ parts

$45.280

100+ parts

$44.630

1k+ parts

$44.310

10k+ parts

$43.980

1,469

$45.280

$44.630

$44.310

$43.980

Corohmni

South Africa . 2 parts In-Stock

1+ parts

$57.244

100+ parts

-

1k+ parts

-

10k+ parts

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2

$57.244

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-

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Parana Technologies

USA . 1,244 parts In-Stock

1+ parts

$68.105

100+ parts

-

1k+ parts

-

10k+ parts

-

1,244

$68.105

-

-

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ChromeModa Solutions

Germany . 5,800 parts In-Stock

1+ parts

$76.523

100+ parts

$62.749

1k+ parts

-

10k+ parts

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5,800

$76.523

$62.749

-

-

IDEA Electronic Components Group

UK . 2 parts In-Stock

1+ parts

$76.523

100+ parts

$72.697

1k+ parts

$68.871

10k+ parts

-

2

$76.523

$72.697

$68.871

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QUARKTWIN TECHNOLOGY LTD

USA . 27,866 parts In-Stock

1+ parts

-

100+ parts

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27,866

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-

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Argo Parts USA

USA . 2,548 parts In-Stock

1+ parts

-

100+ parts

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2,548

-

-

-

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DigiPath Technology Company

USA . 2,154 parts In-Stock

1+ parts

-

100+ parts

$68.993

1k+ parts

-

10k+ parts

-

2,154

-

$68.993

-

-

Overview

Experience the power of cutting-edge technology with the AM1705DPTPD4 by Texas Instruments. As a leader in microprocessor innovation, Texas Instruments delivers quality and reliability that customers can trust. With integrated cache and a wide range of applications, this microprocessor offers unparalleled value and benefits. Whether you're designing industrial equipment or consumer electronics, the AM1705DPTPD4 provides the performance and efficiency you need to stay ahead in today's competitive market. Unlock new possibilities with Texas Instruments and revolutionize your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness for the microprocessor package.

Integrated Cache: YES

Having integrated cache can greatly improve the performance of the microprocessor by reducing access time to frequently used data.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microprocessor onto a circuit board.

Address Bus Width: 13

A wider address bus allows the microprocessor to access a larger range of memory locations, enhancing its capabilities.

Maximum Operating Temperature: 105 °C

Being able to operate at higher temperatures makes this microprocessor suitable for industrial applications where heat may be a factor.

Technical Specifications

Microprocessors AM1705DPTPD4 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

13

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

40

No. of Terminals:

176

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

172032

Maximum Seated Height:

1.6 mm

Speed:

375 rpm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

AM1705DPTPD4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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