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AM1705CPTPD4

Texas Instruments

AM1705CPTPD4 by Texas Instruments

AM1705CPTPD4 by Texas Instruments is a 32-bit microprocessor with integrated cache, 13-bit address bus width, and 16-bit external data bus width. It is used in applications requiring low power mode, operating at a max clock frequency of 50 MHz.

Median Price

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Lifecycle Status

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2

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1k+

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Digiode

USA . 4,162 parts In-Stock

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Vyrian

USA . 3,431 parts In-Stock

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AZTECH Wire

Italy . 425 parts In-Stock

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$5.181

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One Stop Electronics

USA . 269 parts In-Stock

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$18.000

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Parana Technologies

USA . 432 parts In-Stock

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$41.365

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DigiPath Technology Company

USA . 1,655 parts In-Stock

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$45.548

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$41.905

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IDEA Electronic Components Group

UK . 2,254 parts In-Stock

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$46.478

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$44.154

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$41.830

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ChromeModa Solutions

Germany . 878 parts In-Stock

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$46.478

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$38.112

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Native Components

USA . 785 parts In-Stock

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$48.740

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Northwest PG Solutions

USA . 1,771 parts In-Stock

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Corphita

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Microchip USA

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Overview

Upgrade your devices with the AM1705CPTPD4 microprocessor from Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments has once again delivered a powerful solution for your applications. With integrated cache and a wide address bus width of 13, this microprocessor offers unparalleled performance. Its low power mode ensures efficiency while its maximum clock frequency of 50 MHz guarantees speed. Whether you're looking to enhance your embedded systems or boost your IoT devices, the AM1705CPTPD4 provides unbeatable value, benefits, and advantages that will take your projects to the next level. Trust Texas Instruments for all your microprocessor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and resistance to heat, making the microprocessor suitable for a variety of applications.

Integrated Cache: YES

Integrated cache helps improve the overall performance and efficiency of the microprocessor, enabling faster data access and processing.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying the manufacturing process.

Address Bus Width: 13

With a wide address bus width of 13, the microprocessor can handle larger memory capacities and address more data, enhancing its processing capabilities.

Bit Size: 32

A 32-bit size allows for higher data processing speeds and improved performance, making the microprocessor suitable for demanding tasks and applications.

Power Supplies (V): 1.3,1.8/3.3

Multiple power supply options ensure compatibility with various voltage requirements, providing flexibility in design and application usage.

No. of Terminals: 176

A high number of terminals allow for more connections and functionalities, enabling the microprocessor to interface with other components effectively.

Maximum Operating Temperature: 90 °C

High maximum operating temperature tolerance ensures reliable performance in varying environmental conditions, making the microprocessor suitable for industrial applications.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature limit ensures stable performance even in colder environments, enhancing the microprocessor's reliability and versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability and performance of the microprocessor.

Technical Specifications

Microprocessors AM1705CPTPD4 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

13

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

176

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Speed:

375 rpm

Sub-Category:

Microprocessors

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

AM1705CPTPD4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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