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AM1707BZKBT3

Texas Instruments

AM1707BZKBT3 by Texas Instruments

AM1707BZKBT3 by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit address bus width. It operates at a max clock frequency of 20 MHz, making it suitable for automotive applications requiring low power mode and boundary scan capability. With a package style of grid array and fine pitch, this CMOS technology processor has a temperature grade of AUTOMOTIVE.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,912 parts In-Stock

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Digiode

USA . 2,281 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 940 parts In-Stock

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$6.305

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940

$6.305

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One Stop Electronics

USA . 1,197 parts In-Stock

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$7.000

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$7.000

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AZTECH Wire

Italy . 837 parts In-Stock

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$18.850

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837

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Parana Technologies

USA . 911 parts In-Stock

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$62.716

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911

$62.716

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DigiPath Technology Company

USA . 1,889 parts In-Stock

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$69.058

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ChromeModa Solutions

Germany . 2,373 parts In-Stock

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$70.467

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$57.783

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2,373

$70.467

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IDEA Electronic Components Group

UK . 1,655 parts In-Stock

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$70.467

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$66.944

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$63.420

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QUARKTWIN TECHNOLOGY LTD

USA . 14,579 parts In-Stock

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Microchip USA

USA . 5,899 parts In-Stock

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Corphita

USA . 2,183 parts In-Stock

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Northwest PG Solutions

USA . 2,077 parts In-Stock

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$6.179

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Overview

Experience unmatched performance and reliability with the AM1707BZKBT3 by Texas Instruments, a top-tier manufacturer known for cutting-edge technology. As a Microprocessor with integrated cache, this product delivers seamless operation in various applications. With a wide range of power supplies and a maximum clock frequency of 20 MHz, it offers customers unparalleled value and efficiency. Trust in Texas Instruments for superior quality and innovative solutions to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to damage, making this microprocessor suitable for long-term use.

Integrated Cache: YES

Having integrated cache helps in improving the speed and efficiency of the microprocessor by providing quick access to frequently used data.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage of 1.32 V allows for efficient power utilization and prevents damage due to voltage surges.

Address Bus Width: 16

With a wider address bus width of 16, this microprocessor can handle larger amounts of memory and data, making it suitable for complex tasks.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even under intense computational loads and environmental conditions.

Technical Specifications

Microprocessors AM1707BZKBT3 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Speed:

375 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM1707BZKBT3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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