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SMOMAPL138BGWTA3R

Texas Instruments

SMOMAPL138BGWTA3R by Texas Instruments

Texas Instruments SMOMAPL138BGWTA3R is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 30 MHz, suitable for industrial applications requiring low power mode and floating-point format processing. With a terminal pitch of 0.8 mm and 361 terminals, it offers high performance in a compact package style.

Median Price

$80.168

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,302 parts In-Stock

1+ parts

$68.953

100+ parts

$61.291

1k+ parts

$45.067

10k+ parts

-

9,302

$68.953

$61.291

$45.067

-

Chip1Stop

Japan . 5 parts In-Stock

1+ parts

$104.000

100+ parts

$83.100

1k+ parts

$71.800

10k+ parts

-

5

$104.000

$83.100

$71.800

-

Rochester

USA . 139 parts In-Stock

1+ parts

-

100+ parts

$71.260

1k+ parts

$63.760

10k+ parts

$60.010

139

-

$71.260

$63.760

$60.010

DigiKey

USA . 139 parts In-Stock

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-

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139

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Verical

USA . 87 parts In-Stock

1+ parts

-

100+ parts

$89.075

1k+ parts

$79.700

10k+ parts

$75.013

87

-

$89.075

$79.700

$75.013

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,474 parts In-Stock

1+ parts

$55.765

100+ parts

-

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-

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4,474

$55.765

-

-

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Vyrian

USA . 8,837 parts In-Stock

1+ parts

-

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8,837

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DigiKey Marketplace

USA . 662 parts In-Stock

1+ parts

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662

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Component Sense

UK . 246 parts In-Stock

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246

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,641 parts In-Stock

1+ parts

$38.305

100+ parts

-

1k+ parts

-

10k+ parts

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1,641

$38.305

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-

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Corohmni

South Africa . 281 parts In-Stock

1+ parts

$41.859

100+ parts

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281

$41.859

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DigiPath Technology Company

USA . 1,743 parts In-Stock

1+ parts

$42.178

100+ parts

$38.804

1k+ parts

-

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1,743

$42.178

$38.804

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ChromeModa Solutions

Germany . 4,993 parts In-Stock

1+ parts

$43.039

100+ parts

$35.292

1k+ parts

-

10k+ parts

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4,993

$43.039

$35.292

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IDEA Electronic Components Group

UK . 249 parts In-Stock

1+ parts

$43.039

100+ parts

$40.887

1k+ parts

$38.735

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249

$43.039

$40.887

$38.735

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Ampacity Inc.

Singapore . 1,976 parts In-Stock

1+ parts

$49.900

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1,976

$49.900

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Corphita

USA . 2,719 parts In-Stock

1+ parts

$52.830

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2,719

$52.830

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Argo Parts USA

USA . 4,262 parts In-Stock

1+ parts

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4,262

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Perfect Parts

USA . 1,817 parts In-Stock

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1,817

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Continental Prestige Electronics

USA . 1,313 parts In-Stock

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1,313

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Overview

Discover the cutting-edge technology of the SMOMAPL138BGWTA3R by Texas Instruments, a top-of-the-line microprocessor that boasts integrated cache and a wide address bus for enhanced performance. Perfect for industrial applications, this powerhouse offers a seamless user experience with low power mode and high-speed processing capabilities. With Texas Instruments' renowned reputation for quality and innovation, you can trust that this microprocessor delivers unrivaled value and efficiency. Upgrade your systems today with the SMOMAPL138BGWTA3R and experience the difference in speed, reliability, and overall performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the microprocessor.

Integrated Cache: YES

Having an integrated cache helps in faster data access and overall improved performance.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage ensures safe operation within specified limits.

On Chip Data RAM Width: 8

A wider on-chip data RAM width allows for efficient data processing and storage.

Address Bus Width: 23

A larger address bus width enables the microprocessor to access a larger memory space.

Package Shape: SQUARE

Square package shape offers a compact and space-efficient design for the microprocessor.

Bit Size: 32

A 32-bit architecture allows for handling larger amounts of data and instructions at once.

Power Supplies (V): 1.2, 1.8/3.3

Multiple power supply options provide flexibility in operating the microprocessor in various systems.

No. of Terminals: 361

Having a high number of terminals allows for connectivity to multiple components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style enables easy mounting and integration into electronic devices with a compact size.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage ensures stable operation even under lower power conditions.

Maximum Operating Temperature: 105 °C

With a high operating temperature range, the microprocessor can perform reliably in various environments.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the microprocessor to operate in extreme cold conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good conductivity and solderability for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and soldering on circuit boards.

Maximum Seated Height: 1.4 mm

Low maximum seated height makes the microprocessor suitable for compact device designs.

RAM Words: 131072

Having a large RAM capacity allows for storing and processing a significant amount of data.

Width: 16 mm

Compact width dimension enables the microprocessor to fit into space-constrained applications.

Boundary Scan: YES

Boundary scan support helps in debugging and testing the microprocessor during development.

External Data Bus Width: 16

Matching external data bus width with on-chip data RAM width enhances data transfer efficiency.

Maximum Clock Frequency: 30 MHz

High maximum clock frequency allows for faster processing and data handling speed.

Maximum Time At Peak Reflow Temperature (s): 20

The specified time at peak reflow temperature ensures proper soldering without damaging the microprocessor.

Peak Reflow Temperature °C: 220

The high peak reflow temperature tolerance ensures reliable soldering in the manufacturing process.

Length: 16 mm

Compact length dimension allows for easy integration and placement of the microprocessor in devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures stable operation in harsh industrial environments.

Peripheral IC Type: MICROPROCESSOR, RISC

Having a RISC-based microprocessor design offers high performance and efficiency in data processing.

Technology: CMOS

CMOS technology provides low power consumption and high speed operation for the microprocessor.

Terminal Form: BALL

Ball terminal form allows for reliable connections and easy soldering during assembly.

Maximum Supply Current: 0.31 mA

Low maximum supply current consumption helps in energy-efficient operation of the microprocessor.

Nominal Supply Voltage: 1.2 V

Having a stable nominal supply voltage ensures consistent performance of the microprocessor.

No. of DMA Channels: 64

A high number of DMA channels enable efficient data transfer and processing in the microprocessor.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for compact design and space-saving in electronic applications.

Format: FLOATING POINT

Floating-point format supports high-precision calculations and mathematical operations in the microprocessor.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, suitable for standard assembly and storage conditions.

Speed: 456 rpm

High speed rating ensures fast data processing and efficient operation of the microprocessor.

Low Power Mode: YES

Support for low power mode allows for energy-efficient operation and extended battery life in devices.

Technical Specifications

Microprocessors SMOMAPL138BGWTA3R attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e0

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

361

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

456 rpm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Current:

.31 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

16 mm

Peripheral IC Type:

Trade Compliance

SMOMAPL138BGWTA3R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-645-4302, 5962016454302

NIIN

016454302

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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