Loading...

AM3356BZCZ60

Texas Instruments

AM3356BZCZ60 by Texas Instruments

AM3356BZCZ60 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 26 MHz clock frequency, and 1.144 V max supply voltage. Ideal for applications requiring low power mode, such as embedded systems and IoT devices due to its compact size and integrated cache.

Median Price

$12.392

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,804 parts In-Stock

1+ parts

$12.392

100+ parts

$10.824

1k+ parts

$7.465

10k+ parts

-

6,804

$12.392

$10.824

$7.465

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,326 parts In-Stock

1+ parts

$11.772

100+ parts

-

1k+ parts

-

10k+ parts

-

3,326

$11.772

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$12.776

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$12.776

-

-

-

Vyrian

USA . 8,424 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,424

-

-

-

-

VNN

France . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 6,670 parts In-Stock

1+ parts

$10.530

100+ parts

$10.267

1k+ parts

$10.214

10k+ parts

-

6,670

$10.530

$10.267

$10.214

-

Corphita

USA . 4,803 parts In-Stock

1+ parts

$11.153

100+ parts

-

1k+ parts

-

10k+ parts

-

4,803

$11.153

-

-

-

Continental Prestige Electronics

USA . 908 parts In-Stock

1+ parts

$12.168

100+ parts

-

1k+ parts

-

10k+ parts

$11.925

908

$12.168

-

-

$11.925

Netroflash

USA . 50 parts In-Stock

1+ parts

$12.776

100+ parts

$12.521

1k+ parts

-

10k+ parts

-

50

$12.776

$12.521

-

-

AZTECH Wire

Italy . 399 parts In-Stock

1+ parts

$13.670

100+ parts

-

1k+ parts

-

10k+ parts

-

399

$13.670

-

-

-

Ampacity Inc.

Singapore . 6,306 parts In-Stock

1+ parts

$22.930

100+ parts

-

1k+ parts

-

10k+ parts

-

6,306

$22.930

-

-

-

Parana Technologies

USA . 273 parts In-Stock

1+ parts

$31.650

100+ parts

-

1k+ parts

$86.082

10k+ parts

-

273

$31.650

-

$86.082

-

DigiPath Technology Company

USA . 19 parts In-Stock

1+ parts

$34.851

100+ parts

$32.063

1k+ parts

-

10k+ parts

-

19

$34.851

$32.063

-

-

IDEA Electronic Components Group

UK . 1,711 parts In-Stock

1+ parts

$35.562

100+ parts

$33.784

1k+ parts

$32.006

10k+ parts

-

1,711

$35.562

$33.784

$32.006

-

ChromeModa Solutions

Germany . 1,226 parts In-Stock

1+ parts

$35.562

100+ parts

$29.161

1k+ parts

-

10k+ parts

-

1,226

$35.562

$29.161

-

-

Lixinc

USA . 19,322 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,322

-

-

-

-

Argo Parts USA

USA . 3,989 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,989

-

-

-

-

A-Z Elektronik GmbH

Germany . 1,386 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,386

-

-

-

-

Overview

Looking for a reliable microprocessor that delivers top-notch performance? Look no further than the AM3356BZCZ60 by Texas Instruments. With integrated cache, surface mount capability, and a wide range of power supplies, this product is perfect for a variety of applications. Whether you're designing embedded systems or working on IoT projects, this microprocessor offers unparalleled value, benefits, and advantages. Trust in Texas Instruments' reputation for quality and innovation, and take your projects to the next level with the AM3356BZCZ60.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Helps in reducing the weight of the microprocessor, making it suitable for portable devices.

Integrated Cache: YES

Improves the performance of the microprocessor by reducing the time taken to access frequently used data.

Maximum Supply Voltage: 1.144 V

Ensures stable operation of the microprocessor under varying voltage conditions.

On Chip Data RAM Width: 8

Allows for faster data processing and storage on the microprocessor.

Address Bus Width: 28

Enables the microprocessor to access a larger memory space, enhancing its functionality.

Package Shape: SQUARE

Helps in efficient utilization of space for mounting the microprocessor on a circuit board.

Bit Size: 32

Provides higher data processing capability compared to lower bit sizes.

Power Supplies (V): 0.95/1.1

Offers a flexible range of power supplies for the microprocessor, making it versatile in different applications.

No. of Terminals: 324

Allows for a greater number of connections for input, output, and power, enabling more functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables compact placement of the microprocessor on the circuit board, saving space.

Minimum Supply Voltage: 1.056 V

Ensures stable operation of the microprocessor even at lower voltage levels.

Maximum Operating Temperature: 90 °C

Allows the microprocessor to operate efficiently in high-temperature environments.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity for the terminals, ensuring reliable connections.

Terminal Position: BOTTOM

Facilitates convenient soldering and mounting of the microprocessor on the circuit board.

Maximum Seated Height: 1.4 mm

Enables a low profile design for the microprocessor, suitable for slim devices.

RAM Words: 131072

Offers a large memory capacity for data storage and processing on the microprocessor.

Width: 15 mm

Compact size facilitates easy integration of the microprocessor into various electronic devices.

Boundary Scan: YES

Allows for testing and debugging of the microprocessor during manufacturing and operation.

External Data Bus Width: 16

Facilitates fast data transfer between the microprocessor and external devices.

Maximum Clock Frequency: 26 MHz

Provides high-speed processing capability for the microprocessor, enhancing overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures the microprocessor can withstand peak reflow temperatures for a specified duration during manufacturing.

Peak Reflow Temperature °C: 260

Specifies the maximum temperature the microprocessor can be exposed to during the soldering process.

Length: 15 mm

Compact size allows for efficient placement of the microprocessor on the circuit board.

Peripheral IC Type: MICROPROCESSOR, RISC

Features a Reduced Instruction Set Computing (RISC) architecture, providing efficient data processing and performance.

Technology: CMOS

Uses Complementary Metal-Oxide-Semiconductor technology, known for low power consumption and high performance.

Terminal Form: BALL

Enables reliable and secure connections for the microprocessor on the circuit board.

Maximum Supply Current: 400 mA

Specifies the maximum current the microprocessor can draw from the power supply, ensuring safe operation.

Nominal Supply Voltage: 1.1 V

Standard supply voltage for the microprocessor, ensuring compatibility with various power sources.

No. of DMA Channels: 64

Provides multiple Direct Memory Access channels for efficient data transfer and processing.

Terminal Pitch: 0.8 mm

Specifies the distance between terminals, allowing for compact placement and connections.

Format: FIXED POINT

Supports fixed-point arithmetic operations for precise calculations on the microprocessor.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture during handling and storage of the microprocessor.

Speed: 600 rpm

Specifies the rotational speed of the microprocessor for efficient data processing.

Low Power Mode: YES

Provides energy-saving capabilities for the microprocessor, enhancing battery life in portable devices.

Technical Specifications

Microprocessors AM3356BZCZ60 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

600 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3356BZCZ60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20