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STM32MP151DAC1

STMicroelectronics

STM32MP151DAC1 by STMicroelectronics

STM32MP151DAC1 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 48 MHz clock frequency. It features 361 terminals, 724992 RAM words, and operates b/w -20 to 105 °C. Ideal for low power applications in IoT devices, wearables, and industrial automation systems.

Median Price

$7.602

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 7,578 parts In-Stock

1+ parts

$6.303

100+ parts

-

1k+ parts

-

10k+ parts

-

7,578

$6.303

-

-

-

Verical

USA . 7,578 parts In-Stock

1+ parts

$6.303

100+ parts

-

1k+ parts

-

10k+ parts

-

7,578

$6.303

-

-

-

Mouser Electronics

USA . 808 parts In-Stock

1+ parts

$8.900

100+ parts

$7.100

1k+ parts

$6.830

10k+ parts

$6.820

808

$8.900

$7.100

$6.830

$6.820

Chip1Stop

Japan . 4,276 parts In-Stock

1+ parts

$9.263

100+ parts

$6.850

1k+ parts

-

10k+ parts

-

4,276

$9.263

$6.850

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,117 parts In-Stock

1+ parts

$5.959

100+ parts

-

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10k+ parts

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4,117

$5.959

-

-

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$11.505

100+ parts

-

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450

$11.505

-

-

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Vyrian

USA . 3,838 parts In-Stock

1+ parts

-

100+ parts

-

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3,838

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Anansix

USA . 1,528 parts In-Stock

1+ parts

-

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10k+ parts

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1,528

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,468 parts In-Stock

1+ parts

$5.646

100+ parts

-

1k+ parts

-

10k+ parts

-

1,468

$5.646

-

-

-

Semicontronic

India . 4,258 parts In-Stock

1+ parts

$6.480

100+ parts

$6.318

1k+ parts

$6.286

10k+ parts

-

4,258

$6.480

$6.318

$6.286

-

Ampacity Inc.

Singapore . 3,905 parts In-Stock

1+ parts

$6.480

100+ parts

-

1k+ parts

-

10k+ parts

-

3,905

$6.480

-

-

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Continental Prestige Electronics

USA . 5,932 parts In-Stock

1+ parts

$11.505

100+ parts

-

1k+ parts

-

10k+ parts

$11.275

5,932

$11.505

-

-

$11.275

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$11.505

100+ parts

-

1k+ parts

$10.930

10k+ parts

$10.700

1,000

$11.505

-

$10.930

$10.700

Vigor

Singapore . 100 parts In-Stock

1+ parts

$13.180

100+ parts

-

1k+ parts

-

10k+ parts

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100

$13.180

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Aztec Data Supply Inc.

USA . 126 parts In-Stock

1+ parts

$15.220

100+ parts

-

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10k+ parts

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126

$15.220

-

-

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$23.811

100+ parts

$21.668

1k+ parts

$19.525

10k+ parts

-

3,000

$23.811

$21.668

$19.525

-

IDEA Electronic Components Group

UK . 385 parts In-Stock

1+ parts

$54.638

100+ parts

-

1k+ parts

$49.174

10k+ parts

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385

$54.638

-

$49.174

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Corohmni

South Africa . 121 parts In-Stock

1+ parts

$83.856

100+ parts

-

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121

$83.856

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MKK Technologies

India . 1,790 parts In-Stock

1+ parts

$102.743

100+ parts

-

1k+ parts

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10k+ parts

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1,790

$102.743

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DigiPath Technology Company

USA . 1,790 parts In-Stock

1+ parts

$102.743

100+ parts

-

1k+ parts

-

10k+ parts

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1,790

$102.743

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QUARKTWIN TECHNOLOGY LTD

USA . 26,498 parts In-Stock

1+ parts

-

100+ parts

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26,498

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Argo Parts USA

USA . 2,411 parts In-Stock

1+ parts

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2,411

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Parana Technologies

USA . 1,659 parts In-Stock

1+ parts

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100+ parts

$65.328

1k+ parts

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1,659

-

$65.328

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iodParts Technologies Inc.

India . 100 parts In-Stock

1+ parts

-

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100

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Overview

Experience the next level of innovation with the STM32MP151DAC1 by STMicroelectronics. As a leading manufacturer in the microprocessor industry, STMicroelectronics delivers top-quality products that guarantee reliability and performance. With applications in a wide range of industries, this microprocessor offers unparalleled value, benefits, and advantages to customers looking for cutting-edge technology. Unlock new possibilities and drive your projects forward with the STM32MP151DAC1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Allows for a lightweight and durable package construction, making the product suitable for various applications.

Integrated Cache: YES

Improves the performance of the microprocessor by providing faster access to frequently used data.

Maximum Supply Voltage: 1.38 V

Allows for higher voltage operation without exceeding the maximum limit, ensuring stable performance.

On Chip Data RAM Width: 8

Provides ample space for storing data on the chip, enhancing the processing speed and efficiency.

Address Bus Width: 26

Enables the microprocessor to access a larger memory space, allowing for more complex and advanced operations.

Package Shape: SQUARE

Optimizes space utilization and allows for easy integration into various circuit designs.

Bit Size: 32

Provides a balance between processing power and memory efficiency, suitable for a wide range of applications.

No. of Terminals: 361

Offers flexibility in connecting external devices and peripherals, enhancing the product's compatibility.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Facilitates high-density mounting and efficient thermal management, making it suitable for compact designs.

Minimum Supply Voltage: 1.3 V

Allows for low power operation while maintaining stable performance, increasing energy efficiency.

Maximum Operating Temperature: 105 °C

Ensures reliable operation even in high-temperature environments, extending the product's lifespan.

Minimum Operating Temperature: -20 °C

Allows for operation in a wide range of temperature conditions, making the product versatile and adaptable.

Terminal Position: BOTTOM

Facilitates easy PCB layout and assembly, improving the overall manufacturing process.

Maximum Seated Height: 1.2 mm

Enables low-profile designs and compact form factors, suitable for space-constrained applications.

RAM Words: 724992

Provides a large memory capacity for storing data and instructions, supporting complex computational tasks.

Width: 12 mm

Compact size allows for easy integration into various PCB layouts and space-constrained designs.

Boundary Scan: YES

Facilitates testing and debugging of the microprocessor, ensuring high reliability and quality control.

External Data Bus Width: 16

Enables efficient data transfer between the microprocessor and external devices, improving overall system performance.

Maximum Clock Frequency: 48 MHz

Provides high processing speed for quick data processing and improved system responsiveness.

Length: 12 mm

Compact form factor allows for versatile placement and integration into various system designs.

Peripheral IC Type: MICROPROCESSOR, RISC

Utilizes Reduced Instruction Set Computing (RISC) architecture for efficient data processing and lower power consumption.

Technology: CMOS

Uses Complementary Metal-Oxide-Semiconductor technology for energy-efficient operation and high-speed performance.

Terminal Form: BALL

Facilitates reliable connections and soldering during PCB assembly, ensuring secure and stable operation.

Maximum Supply Current: 955 mA

Supports high current operation for demanding tasks, ensuring stability and reliability under heavy loads.

Nominal Supply Voltage: 1.34 V

Provides a standard voltage level for consistent and reliable operation, ensuring compatibility with various power sources.

No. of DMA Channels: 48

Supports efficient data transfer and management, enabling high-speed communication with external devices.

No. of Serial I/Os: 8

Allows for flexible connectivity options and communication interfaces, enhancing the product's versatility.

Terminal Pitch: 0.65 mm

Enables precise and compact PCB layout, optimizing space utilization and system integration.

Format: FLOATING POINT

Supports floating-point arithmetic operations for advanced mathematical computations and data processing tasks.

Speed: 800 rpm

Provides high processing speed for quick data processing and efficient system performance.

Low Power Mode: YES

Offers energy-saving features for extended battery life and reduced power consumption, making it suitable for portable devices.

Technical Specifications

Microprocessors STM32MP151DAC1 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

Length:

12 mm

Low Power Mode:

YES

No. of DMA Channels:

48

No. of Serial I/Os:

8

No. of Terminals:

361

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,23X23,25/20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

724992

Maximum Seated Height:

1.2 mm

Speed:

800 rpm

Maximum Supply Current:

955 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.3 V

Nominal Supply Voltage:

1.34 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Trade Compliance

STM32MP151DAC1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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