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XAM3517AZER

Texas Instruments

XAM3517AZER by Texas Instruments

XAM3517AZER by Texas Instruments is a microprocessor with integrated cache and a max clock frequency of 26 MHz. It has a package style of grid array with heat sink, making it suitable for applications requiring high performance and low power consumption.

Median Price

$19.420

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 90 parts In-Stock

1+ parts

$19.420

100+ parts

$19.030

1k+ parts

$18.640

10k+ parts

-

90

$19.420

$19.030

$18.640

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,264 parts In-Stock

1+ parts

-

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8,264

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Digiode

USA . 3,610 parts In-Stock

1+ parts

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3,610

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Nova Conductors

Japan . 52 parts In-Stock

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-

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52

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,276 parts In-Stock

1+ parts

$9.000

100+ parts

-

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-

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1,276

$9.000

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AZTECH Wire

Italy . 719 parts In-Stock

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$11.671

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719

$11.671

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Ampacity Inc.

Singapore . 259 parts In-Stock

1+ parts

$21.000

100+ parts

-

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259

$21.000

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Parana Technologies

USA . 965 parts In-Stock

1+ parts

$48.588

100+ parts

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965

$48.588

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DigiPath Technology Company

USA . 1,819 parts In-Stock

1+ parts

$53.501

100+ parts

$49.221

1k+ parts

-

10k+ parts

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1,819

$53.501

$49.221

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ChromeModa Solutions

Germany . 6,141 parts In-Stock

1+ parts

$54.593

100+ parts

$44.766

1k+ parts

-

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6,141

$54.593

$44.766

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IDEA Electronic Components Group

UK . 1,409 parts In-Stock

1+ parts

$54.593

100+ parts

$51.863

1k+ parts

$49.134

10k+ parts

-

1,409

$54.593

$51.863

$49.134

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Corphita

USA . 2,571 parts In-Stock

1+ parts

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2,571

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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Argo Parts USA

USA . 493 parts In-Stock

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493

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Continental Prestige Electronics

USA . 478 parts In-Stock

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478

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Microchip USA

USA . 379 parts In-Stock

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379

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Overview

Discover the XAM3517AZER, a high-quality microprocessor manufactured by Texas Instruments. With its advanced features and cutting-edge technology, this product is perfect for a wide range of applications. From robotics to industrial automation, the XAM3517AZER offers exceptional performance and reliability. Its integrated cache and low power mode ensure optimal efficiency, while its surface mount and compact design make it easy to integrate into any project. Experience the value, benefits, and advantages that the XAM3517AZER brings to your business today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microprocessor, ensuring long-lasting performance.

Integrated Cache: YES

Having integrated cache improves the processing speed and efficiency of the microprocessor.

Surface Mount: YES

Surface mounting capability makes it easy to install and integrate the microprocessor into various devices.

Maximum Supply Voltage: 1.248 V

Operating within a specified maximum supply voltage ensures optimal performance and prevents damage to the microprocessor.

Address Bus Width: 16

A wider address bus width allows for efficient communication and handling of memory addresses, enhancing overall performance.

Package Shape: SQUARE

Square package shape provides a compact design, making it easy to fit into different electronic devices.

No. of Terminals: 484

Having a high number of terminals enables connectivity with various other components, expanding the microprocessor's functionality.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The grid array package style, along with a heat sink or slug, helps in dissipating heat efficiently, maintaining optimal operating temperature.

Minimum Supply Voltage: 1.152 V

Operating within a specified minimum supply voltage ensures stability and efficiency in power consumption.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good electrical conductivity, ensuring reliable connections and signal transmission.

Terminal Position: BOTTOM

Bottom terminal position makes it easier to connect the microprocessor to the circuit board, simplifying the assembly process.

Maximum Seated Height: 2.48 mm

With a low maximum seated height, the microprocessor can be used in slim and compact devices without compromising on performance.

Width: 23 mm

Compact width allows for easy integration of the microprocessor in various device designs.

Boundary Scan: YES

Boundary scan capability allows for testing and debugging of the microprocessor, ensuring high reliability and ease of maintenance.

External Data Bus Width: 16

Having a wide external data bus width allows for faster data transfer and processing, enhancing overall system performance.

Maximum Clock Frequency: 26 MHz

Operating at a high clock frequency allows for fast data processing and execution of instructions, improving overall system speed.

Length: 23 mm

Compact length makes the microprocessor suitable for space-constrained applications while still delivering high performance.

Peripheral IC Type: MICROPROCESSOR

Being a microprocessor, it is designed for handling complex processing tasks and managing various peripheral devices efficiently.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the microprocessor efficient and reliable.

Terminal Form: BALL

The ball terminal form ensures easy soldering and secure connections, making the installation process simple and reliable.

Nominal Supply Voltage: 1.2 V

Operating at a nominal supply voltage ensures stability and efficiency in power consumption, contributing to overall system reliability.

Terminal Pitch: 1 mm

A small terminal pitch allows for more terminals in a compact space, enabling high connectivity and functionality in a limited area.

Format: FLOATING POINT

Using a floating-point format enables the microprocessor to perform complex mathematical calculations with high precision and accuracy.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates the microprocessor's ability to withstand moderate levels of moisture exposure, enhancing its reliability.

Speed: 600 rpm

Operating at a speed of 600 rpm allows for efficient data processing and system operation, suitable for various computing applications.

Low Power Mode: YES

Having a low power mode option allows the microprocessor to operate with reduced power consumption when needed, promoting energy efficiency.

Technical Specifications

Microprocessors XAM3517AZER attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

484

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Qualification:

Not Qualified

Maximum Seated Height:

2.48 mm

Speed:

600 rpm

Maximum Supply Voltage:

1.248 V

Minimum Supply Voltage:

1.152 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

XAM3517AZER Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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