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XAM3358ZCED50

Texas Instruments

XAM3358ZCED50 by Texas Instruments

XAM3358ZCED50 by Texas Instruments is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 26 MHz. It features low power mode and boundary scan capabilities, suitable for industrial applications requiring high-speed processing in compact form factors.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,372 parts In-Stock

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Digiode

USA . 3,010 parts In-Stock

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3,010

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Distributors (Availability)

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AZTECH Wire

Italy . 796 parts In-Stock

1+ parts

$5.011

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796

$5.011

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One Stop Electronics

USA . 127 parts In-Stock

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$31.000

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127

$31.000

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Parana Technologies

USA . 627 parts In-Stock

1+ parts

$39.463

100+ parts

$3,664.784

1k+ parts

$35.517

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627

$39.463

$3,664.784

$35.517

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DigiPath Technology Company

USA . 296 parts In-Stock

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$43.454

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296

$43.454

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ChromeModa Solutions

Germany . 4,498 parts In-Stock

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$44.341

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$36.360

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4,498

$44.341

$36.360

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IDEA Electronic Components Group

UK . 675 parts In-Stock

1+ parts

$44.341

100+ parts

$42.124

1k+ parts

$39.907

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675

$44.341

$42.124

$39.907

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Corphita

USA . 2,927 parts In-Stock

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Overview

Elevate your projects with the XAM3358ZCED50 by Texas Instruments, a high-quality microprocessor that offers unparalleled performance and reliability. Manufactured by the trusted brand Texas Instruments, this product is designed for a wide range of applications in industries such as automotive, industrial automation, and consumer electronics. With integrated cache and low power mode, this microprocessor delivers efficiency and speed without compromising on power consumption. Trust in Texas Instruments to provide you with cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product easy to handle and resistant to damage during handling or transportation.

Integrated Cache: YES

Integrated cache improves the efficiency of data access and processing, resulting in faster and more responsive performance.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.15 V

With a maximum supply voltage of 1.15 V, the product operates efficiently without the risk of overheating or damage from excessive voltage.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, ideal for applications where size is a constraint.

Bit Size: 32

32-bit architecture allows for processing of larger chunks of data at a time, enhancing overall performance and speed.

No. of Terminals: 298

With 298 terminals, this product offers a high level of connectivity and potential for integration with various external components and interfaces.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The Grid Array, Low Profile, Fine Pitch package style ensures secure and stable mounting on circuit boards, maintaining reliability and performance.

Minimum Supply Voltage: 1.06 V

The minimum supply voltage of 1.06 V ensures efficient power consumption and reduces the risk of overloading or excessive energy use.

Maximum Operating Temperature: 90 °C

With a maximum operating temperature of 90°C, the product can withstand high temperatures and maintain performance in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures reliable performance even in extreme cold conditions, making the product suitable for a wide range of environments.

Terminal Finish: TIN SILVER COPPER

The tin silver copper terminal finish provides excellent conductivity and resistance to corrosion, ensuring stable and reliable connections.

Terminal Position: BOTTOM

Having terminals positioned at the bottom allows for easier installation and maintenance, reducing the risk of damage or misalignment during use.

Maximum Seated Height: 1.3 mm

The maximum seated height of 1.3 mm ensures a low-profile design, ideal for applications where space is limited or a compact form factor is required.

Width: 13 mm

With a width of 13 mm, the product offers a balance between compact size and ease of handling, making it versatile for various installation requirements.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the product, improving reliability and ease of maintenance during operation.

Maximum Clock Frequency: 26 MHz

With a maximum clock frequency of 26 MHz, the product provides fast processing speeds and responsiveness for demanding applications.

Length: 13 mm

The length of 13 mm contributes to the compact and space-saving design of the product, making it suitable for applications with limited physical dimensions.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh environmental conditions, making the product suitable for industrial and rugged applications.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture of the microprocessor allows for efficient processing of instructions, improving overall performance and energy efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high performance, making the product energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

The ball terminal form provides secure and reliable connections, ensuring stable performance and reducing the risk of signal loss or interference.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1 V ensures stable and efficient power delivery, optimizing performance and reliability of the product.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, the product offers a high level of connectivity and potential for integration with various external components and interfaces.

Format: FIXED POINT

The fixed-point format allows for precise and efficient processing of numerical data, improving accuracy and performance in mathematical calculations.

Speed: 500 rpm

With a speed of 500 rpm, the product offers fast and responsive performance, ideal for applications requiring real-time data processing and control.

Low Power Mode: YES

Low power mode capability allows for energy-efficient operation and extended battery life, making the product suitable for portable and power-sensitive applications.

Technical Specifications

Microprocessors XAM3358ZCED50 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B298

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

No. of Terminals:

298

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.3 mm

Speed:

500 rpm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.06 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

Trade Compliance

XAM3358ZCED50 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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