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XAM3358ZCEA27

Texas Instruments

XAM3358ZCEA27 by Texas Instruments

XAM3358ZCEA27 by Texas Instruments is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 26 MHz. It features low power mode and boundary scan capabilities, suitable for industrial applications requiring high-speed processing in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,488 parts In-Stock

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Digiode

USA . 1,602 parts In-Stock

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1,602

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Distributors (Availability)

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One Stop Electronics

USA . 155 parts In-Stock

1+ parts

$6.000

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155

$6.000

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AZTECH Wire

Italy . 710 parts In-Stock

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$9.395

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710

$9.395

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Parana Technologies

USA . 2,353 parts In-Stock

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$52.748

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$52.748

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DigiPath Technology Company

USA . 1,752 parts In-Stock

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$58.082

100+ parts

$53.435

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1,752

$58.082

$53.435

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ChromeModa Solutions

Germany . 4,228 parts In-Stock

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$59.267

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$48.599

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4,228

$59.267

$48.599

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IDEA Electronic Components Group

UK . 257 parts In-Stock

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$59.267

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$56.304

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$53.340

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257

$59.267

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$53.340

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Corphita

USA . 1,509 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the XAM3358ZCEA27 by Texas Instruments. As a leader in microprocessor innovation, Texas Instruments sets the standard for quality and reliability. This versatile microprocessor is perfect for a wide range of applications, delivering unparalleled performance and efficiency. With integrated cache, low power mode, and a maximum clock frequency of 26 MHz, this product offers tremendous value and benefits to customers looking for top-notch performance in a compact package. Experience the difference with Texas Instruments and take your projects to the next level with the XAM3358ZCEA27.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is lightweight and durable, providing a cost-effective solution for packaging the microprocessor.

Integrated Cache: YES

Having an integrated cache improves the processing speed of the microprocessor by reducing the time it takes to access frequently used data.

Surface Mount: YES

Being surface mountable makes installation and replacement of the microprocessor easier and more efficient.

Maximum Supply Voltage: 1.15 V

The maximum supply voltage of 1.15 V ensures reliable operation of the microprocessor without risk of damage.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy integration into circuit boards.

Bit Size: 32

A 32-bit architecture provides better performance and compatibility with modern software applications.

No. of Terminals: 298

Having a high number of terminals allows for more connections and functionality within the microprocessor.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high density and reliability, making it suitable for advanced electronic applications.

Minimum Supply Voltage: 1.06 V

The minimum supply voltage of 1.06 V ensures energy efficiency and reliable operation under varying conditions.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C allows for reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the microprocessor can function in cold conditions without issues.

Terminal Finish: TIN SILVER COPPER

Having a terminal finish of tin silver copper provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal positioning offers easy access and connection points for integrating the microprocessor into a circuit.

Maximum Seated Height: 1.3 mm

With a low maximum seated height of 1.3 mm, this microprocessor can be used in slim devices without taking up too much space.

Width: 13 mm

The compact width of 13 mm allows for easy placement and integration of the microprocessor into circuit designs.

Boundary Scan: YES

Having boundary scan capability allows for efficient testing and debugging of the microprocessor during production and maintenance.

Maximum Clock Frequency: 26 MHz

A maximum clock frequency of 26 MHz enables fast processing speeds and smooth performance for various computing tasks.

Length: 13 mm

The short length of 13 mm makes this microprocessor suitable for compact devices and tight-spaced electronic applications.

Temperature Grade: INDUSTRIAL

Being industrial temperature grade means this microprocessor can withstand harsh environmental conditions and extended operating periods.

Peripheral IC Type: MICROPROCESSOR, RISC

Having a RISC-based microprocessor provides efficient processing capabilities for a wide range of computing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high integration capabilities, making this microprocessor energy-efficient and versatile.

Terminal Form: BALL

Having a ball terminal form allows for easy soldering and secure connections in the microprocessor's installation process.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1 V ensures stable and efficient operation of the microprocessor within specified voltage ranges.

Terminal Pitch: 0.65 mm

The tight terminal pitch of 0.65 mm allows for high-density integration of the microprocessor within compact electronic devices.

Format: FIXED POINT

The fixed-point format is suitable for a wide range of mathematical calculations and digital signal processing tasks in various applications.

Speed: 275 rpm

With a speed of 275 rpm, this microprocessor can efficiently process instructions and data at a fast pace for responsive performance.

Low Power Mode: YES

Having a low power mode option allows for energy-efficient operation and extended battery life in mobile devices or IoT applications.

Technical Specifications

Microprocessors XAM3358ZCEA27 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B298

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

No. of Terminals:

298

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.3 mm

Speed:

275 rpm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.06 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

Trade Compliance

XAM3358ZCEA27 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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