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XAM3359ZCZA50

Texas Instruments

XAM3359ZCZA50 by Texas Instruments

XAM3359ZCZA50 by Texas Instruments is a 32-bit microprocessor with integrated cache and operates at a max clock frequency of 26 MHz. It features low power mode, boundary scan, and CMOS technology. Ideal for industrial applications requiring high-speed processing in compact devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,909 parts In-Stock

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5,909

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Digiode

USA . 3,670 parts In-Stock

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3,670

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Distributors (Availability)

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AZTECH Wire

Italy . 643 parts In-Stock

1+ parts

$16.309

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643

$16.309

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Parana Technologies

USA . 2,018 parts In-Stock

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$18.411

100+ parts

-

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$18.534

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2,018

$18.411

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$18.534

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One Stop Electronics

USA . 401 parts In-Stock

1+ parts

$20.000

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-

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401

$20.000

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ChromeModa Solutions

Germany . 2,748 parts In-Stock

1+ parts

$20.687

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$16.963

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2,748

$20.687

$16.963

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IDEA Electronic Components Group

UK . 1,123 parts In-Stock

1+ parts

$20.687

100+ parts

$19.653

1k+ parts

$18.618

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1,123

$20.687

$19.653

$18.618

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Corphita

USA . 207 parts In-Stock

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207

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DigiPath Technology Company

USA . 84 parts In-Stock

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$18.651

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84

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$18.651

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Overview

Elevate your electronic devices with the XAM3359ZCZA50 by Texas Instruments, a top-tier microprocessor that delivers unmatched quality and performance. Designed by a reputable manufacturer known for cutting-edge technology, this chip is perfect for a wide range of applications. With integrated cache and low power mode, it offers exceptional value and benefits to customers looking for reliability and efficiency in their products. Upgrade your devices today with the XAM3359ZCZA50 and experience the difference in speed and functionality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components due to its durability and resistance to heat, making this microprocessor reliable for long-term use.

Integrated Cache: YES

Having an integrated cache improves processing speed and efficiency, making this microprocessor a good choice for tasks requiring quick data access.

Maximum Supply Voltage: 1.15 V

The maximum supply voltage of 1.15 V allows for efficient power management and helps prevent overheating, contributing to the reliability of this microprocessor.

Package Shape: SQUARE

The square package shape makes it easier to handle and install, ensuring a secure fit in various electronic devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microprocessor energy-efficient and reliable in different operating conditions.

Maximum Clock Frequency: 26 MHz

With a maximum clock frequency of 26 MHz, this microprocessor can handle high-speed data processing tasks efficiently, making it suitable for demanding applications.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature range (-40°C to 105°C) allows this microprocessor to perform reliably in harsh environments, making it ideal for industrial applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor, it executes instructions quickly and efficiently, making it suitable for applications that require high performance and low power consumption.

Technical Specifications

Microprocessors XAM3359ZCZA50 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

No. of Terminals:

324

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.4 mm

Speed:

500 rpm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.06 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Trade Compliance

XAM3359ZCZA50 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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