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MCF54453VP266

NXP Semiconductors

MCF54453VP266 by NXP Semiconductors

MICROPROCESSOR; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;

Median Price

$28.003

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,900 parts In-Stock

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$28.003

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Distributors (In-Stock)

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Digiode

USA . 3,777 parts In-Stock

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Vyrian

USA . 2,787 parts In-Stock

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Anansix

USA . 2,625 parts In-Stock

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Flip Electronics

USA . 848 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,313 parts In-Stock

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$1.000

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Ampacity Inc.

Singapore . 1,539 parts In-Stock

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$8.000

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Corohmni

South Africa . 960 parts In-Stock

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$42.425

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Modulus Dynamics

Lithuania . 3,610 parts In-Stock

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$63.591

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$63.591

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$63.591

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Microchip USA

USA . 2,507 parts In-Stock

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$65.414

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UNI Independent Distributors

Spain . 6,428 parts In-Stock

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Corphita

USA . 4,768 parts In-Stock

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Continental Prestige Electronics

USA . 3,523 parts In-Stock

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Argo Parts USA

USA . 2,506 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Technical Specifications

Microprocessors MCF54453VP266 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

MCF54453VP266 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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