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MCIMX536AVV8CR2

NXP Semiconductors

MCIMX536AVV8CR2 by NXP Semiconductors

MCIMX536AVV8CR2 by NXP Semiconductors is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 27 MHz. Ideal for automotive applications, it features a low power mode and boundary scan capability, with a temperature grade suitable for harsh environments.

Median Price

$32.820

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

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$32.820

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Anansix

USA . 1,797 parts In-Stock

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Digiode

USA . 1,056 parts In-Stock

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Vyrian

USA . 1,026 parts In-Stock

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Chip Stock

USA . 480 parts In-Stock

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480

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,420 parts In-Stock

1+ parts

$1.000

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$1.000

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AZTECH Wire

Italy . 524 parts In-Stock

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$5.407

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524

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One Stop Electronics

USA . 2,756 parts In-Stock

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$14.000

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2,756

$14.000

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Semicontronic

India . 1,544 parts In-Stock

1+ parts

$27.000

100+ parts

$26.325

1k+ parts

$26.190

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1,544

$27.000

$26.325

$26.190

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Continental Prestige Electronics

USA . 6,462 parts In-Stock

1+ parts

$32.820

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$32.164

6,462

$32.820

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$32.164

Corohmni

South Africa . 181 parts In-Stock

1+ parts

$44.198

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181

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Aztec Data Supply Inc.

USA . 444 parts In-Stock

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$60.200

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444

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Microchip USA

USA . 294 parts In-Stock

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$310.021

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294

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UNI Independent Distributors

Spain . 6,173 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 2,314 parts In-Stock

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Corphita

USA . 1,064 parts In-Stock

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Advanced Electronics

New Zealand . 750 parts In-Stock

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750

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Overview

Unleash the power of innovation with the MCIMX536AVV8CR2 by NXP Semiconductors! This cutting-edge microprocessor is designed to meet the highest standards of quality, offering seamless integration and unparalleled performance. Ideal for a wide range of applications, this product boasts a sleek design and advanced features that deliver exceptional value to customers. Elevate your projects with the reliability and efficiency of NXP Semiconductors, setting new standards in the industry. Experience the difference with the MCIMX536AVV8CR2 - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Integrated Cache: YES

Integrated cache helps in speeding up data access and improving overall performance of the microprocessor.

Maximum Supply Voltage: 1.15 V

A maximum supply voltage of 1.15V ensures efficient power management and stable operation of the microprocessor.

Address Bus Width: 26

A wider address bus allows the microprocessor to access a larger range of memory locations, enhancing its capabilities.

Bit Size: 32

With a bit size of 32, the microprocessor can handle 32 bits of data in a single clock cycle, increasing processing efficiency.

Power Supplies (V): 1.1,1.3,1.8/3.3

Support for multiple power supply voltages offers flexibility in power consumption and compatibility with various systems.

No. of Terminals: 529

A higher number of terminals enable more connectivity options and signal pathways, enhancing the versatility of the microprocessor.

Minimum Operating Temperature: -40 °C

The ability to operate at extremely low temperatures makes the microprocessor suitable for use in harsh environments.

Maximum Seated Height: 1.85 mm

The low seated height contributes to a compact design and allows for efficient heat dissipation.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor ensures streamlined instruction execution and high performance computing capabilities.

Technical Specifications

Microprocessors MCIMX536AVV8CR2 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e2

Length:

19 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

529

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.3,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.85 mm

Speed:

800 rpm

Sub-Category:

Graphics Processors

Maximum Supply Current:

1450 mA

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

Trade Compliance

MCIMX536AVV8CR2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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