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MCIMX537CVV8C

NXP Semiconductors

MCIMX537CVV8C by NXP Semiconductors

MCIMX537CVV8C by NXP Semiconductors is a microprocessor with 32-bit architecture, 26-bit address bus width, and integrated cache. Ideal for automotive applications, it features a max clock frequency of 27 MHz and low power mode support. With a package style of grid array and fine pitch, this processor offers compatibility with various bus interfaces like CAN, Ethernet, I2C, SPI, UART, and USB.

Median Price

$40.278

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Nova Conductors

Japan . 10 parts In-Stock

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$31.557

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Forefront Electronics and Design

USA . 2 parts In-Stock

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Digiode

USA . 4,837 parts In-Stock

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Vyrian

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Anansix

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Chip Stock

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J2 Sourcing AB

Sweden . 5 parts In-Stock

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NexGen Digital

USA . 1 parts In-Stock

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ComSIT Distribution GmbH

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AZTECH Wire

Italy . 583 parts In-Stock

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$12.159

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Ampacity Inc.

Singapore . 532 parts In-Stock

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$31.000

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Continental Prestige Electronics

USA . 5,047 parts In-Stock

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$31.557

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$30.926

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Semicontronic

India . 1,600 parts In-Stock

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$33.000

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$32.175

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$32.010

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One Stop Electronics

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Modulus Dynamics

Lithuania . 4,085 parts In-Stock

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$43.812

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Advanced Electronics

New Zealand . 92 parts In-Stock

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$44.734

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$42.497

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Corohmni

South Africa . 480 parts In-Stock

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Aztec Data Supply Inc.

USA . 148 parts In-Stock

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UNI Independent Distributors

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

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Kepictronics

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Robosynatics

Brazil . 1,611 parts In-Stock

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$58.436

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Lucentia Tech

USA . 1,611 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$30.926

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$29.979

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$29.348

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Perfect Parts

USA . 539 parts In-Stock

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Corphita

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Microchip USA

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Overview

Discover the unmatched quality and reliability of the MCIMX537CVV8C by NXP Semiconductors. As a leader in the industry, NXP Semiconductors brings you a cutting-edge microprocessor that excels in performance and efficiency. Ideal for automotive applications, this microprocessor offers seamless integration and high-speed processing capabilities. With features like integrated cache and low power mode, it provides unparalleled value to customers looking for top-notch solutions. Experience the benefits of superior technology with the MCIMX537CVV8C and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of strength, durability, and cost-effectiveness for the product.

Integrated Cache: YES

Having an integrated cache improves the speed and efficiency of the microprocessor, making it a more powerful choice for computing tasks.

Maximum Supply Voltage: 1.15 V

The maximum supply voltage allows for a stable power supply to the microprocessor, ensuring reliable performance.

Address Bus Width: 26

A wider address bus allows for more memory addresses to be accessed, increasing the overall capabilities of the microprocessor.

Terminal Finish: TIN SILVER

The tin silver finish on the terminals provides good conductivity and corrosion resistance, ensuring a reliable connection.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the microprocessor to perform effectively in harsh environments or under heavy workloads.

Maximum Clock Frequency: 27 MHz

The high maximum clock frequency enables fast processing speeds, making the product ideal for demanding computing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Technical Specifications

Microprocessors MCIMX537CVV8C attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

1.1V NOMIVAL AVAILABLE WITH 800MHZ

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Bus Compatibility:

CAN; ETHERNET; I2C; I2S; IRDA; RS-232; SPI; UART; USB

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e2

Length:

19 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

19

No. of Serial I/Os:

2

No. of Terminals:

529

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Words:

73728

Maximum Seated Height:

1.85 mm

Speed:

800 rpm

Maximum Supply Current:

1450 mA

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

Trade Compliance

MCIMX537CVV8C Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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