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AM3356BZCZ80

Texas Instruments

AM3356BZCZ80 by Texas Instruments

AM3356BZCZ80 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for low power applications. With 64 DMA channels, it is ideal for use in devices requiring high-speed data processing and boundary scan capabilities.

Median Price

$16.932

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,127 parts In-Stock

1+ parts

$13.033

100+ parts

$11.384

1k+ parts

$7.851

10k+ parts

-

1,127

$13.033

$11.384

$7.851

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Mouser Electronics

USA . 81 parts In-Stock

1+ parts

$20.830

100+ parts

$13.300

1k+ parts

$12.650

10k+ parts

-

81

$20.830

$13.300

$12.650

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,791 parts In-Stock

1+ parts

$12.381

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-

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3,791

$12.381

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Nova Conductors

Japan . 100 parts In-Stock

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$15.350

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100

$15.350

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Chip Stock

USA . 3,110 parts In-Stock

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VNN

France . 1,210 parts In-Stock

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Vyrian

USA . 491 parts In-Stock

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491

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Cyclops Electronics Ltd

UK . 130 parts In-Stock

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130

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Distributors (Availability)

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Semicontronic

India . 552 parts In-Stock

1+ parts

$11.080

100+ parts

$10.803

1k+ parts

$10.748

10k+ parts

-

552

$11.080

$10.803

$10.748

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Ampacity Inc.

Singapore . 545 parts In-Stock

1+ parts

$11.080

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545

$11.080

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Corphita

USA . 4,083 parts In-Stock

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$11.730

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4,083

$11.730

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Continental Prestige Electronics

USA . 4,433 parts In-Stock

1+ parts

$15.350

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-

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$15.043

4,433

$15.350

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-

$15.043

Parana Technologies

USA . 43 parts In-Stock

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$46.904

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43

$46.904

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DigiPath Technology Company

USA . 474 parts In-Stock

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$51.647

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474

$51.647

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ChromeModa Solutions

Germany . 4,777 parts In-Stock

1+ parts

$52.701

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$43.215

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4,777

$52.701

$43.215

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IDEA Electronic Components Group

UK . 2,267 parts In-Stock

1+ parts

$52.701

100+ parts

$50.066

1k+ parts

$47.431

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2,267

$52.701

$50.066

$47.431

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Corohmni

South Africa . 3 parts In-Stock

1+ parts

$53.419

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3

$53.419

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$79.949

100+ parts

$75.951

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$75.951

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2,000

$79.949

$75.951

$75.951

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Perfect Parts

USA . 112,000 parts In-Stock

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112,000

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Lixinc

USA . 2,567 parts In-Stock

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2,567

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A-Z Elektronik GmbH

Germany . 2,000 parts In-Stock

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2,000

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Argo Parts USA

USA . 1,112 parts In-Stock

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Overview

Experience the power and reliability of the Texas Instruments AM3356BZCZ80 microprocessor. With a reputation for excellence in manufacturing, Texas Instruments delivers cutting-edge technology that meets the highest standards in the industry. Ideal for a wide range of applications, this microprocessor offers unparalleled performance and efficiency, making it the perfect choice for customers looking for quality and value. Upgrade your device with the AM3356BZCZ80 and enjoy the benefits of top-notch technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, making it ideal for portable devices.

Integrated Cache: YES

Having an integrated cache improves the overall performance of the microprocessor by reducing access time to frequently used data.

Maximum Supply Voltage: 1.326 V

The higher maximum supply voltage allows for better power management and performance capabilities.

Address Bus Width: 28

A wider address bus width allows for higher memory addressing capabilities, enabling the processor to access more data efficiently.

Bit Size: 32

A 32-bit processor can handle larger chunks of data at once, resulting in improved speed and performance.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, this microprocessor can withstand heat and operate reliably under various conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor, it executes instructions quickly and efficiently, enhancing overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making it energy-efficient and reliable for long-term use.

Speed: 800 rpm

Operating at a speed of 800 rpm ensures efficient processing and computing tasks, suitable for a variety of applications.

Technical Specifications

Microprocessors AM3356BZCZ80 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

800 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.326 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3356BZCZ80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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