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AM3357BZCZA30

Texas Instruments

AM3357BZCZA30 by Texas Instruments

AM3357BZCZA30 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. With a terminal pitch of 0.8 mm and package style of grid array, it offers high performance in compact designs.

Median Price

$20.090

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 649 parts In-Stock

1+ parts

$16.379

100+ parts

$14.307

1k+ parts

$9.867

10k+ parts

-

649

$16.379

$14.307

$9.867

-

Mouser Electronics

USA . 34 parts In-Stock

1+ parts

$23.800

100+ parts

$14.300

1k+ parts

$14.240

10k+ parts

-

34

$23.800

$14.300

$14.240

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 781 parts In-Stock

1+ parts

$15.560

100+ parts

-

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-

10k+ parts

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781

$15.560

-

-

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Nova Conductors

Japan . 44 parts In-Stock

1+ parts

$19.300

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-

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44

$19.300

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-

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VNN

France . 30,011 parts In-Stock

1+ parts

-

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30,011

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Vyrian

USA . 7,868 parts In-Stock

1+ parts

-

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-

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7,868

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 675 parts In-Stock

1+ parts

$6.681

100+ parts

-

1k+ parts

-

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675

$6.681

-

-

-

Ampacity Inc.

Singapore . 336 parts In-Stock

1+ parts

$13.920

100+ parts

-

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-

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336

$13.920

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-

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Corphita

USA . 520 parts In-Stock

1+ parts

$14.741

100+ parts

-

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-

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520

$14.741

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-

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Continental Prestige Electronics

USA . 6,226 parts In-Stock

1+ parts

$19.300

100+ parts

-

1k+ parts

-

10k+ parts

$18.914

6,226

$19.300

-

-

$18.914

Bastille Electronics

Australia . 650 parts In-Stock

1+ parts

$19.300

100+ parts

$18.335

1k+ parts

-

10k+ parts

$17.177

650

$19.300

$18.335

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$17.177

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$19.686

100+ parts

$19.686

1k+ parts

$19.686

10k+ parts

-

2,500

$19.686

$19.686

$19.686

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Semicontronic

India . 131 parts In-Stock

1+ parts

$30.300

100+ parts

$29.542

1k+ parts

$29.391

10k+ parts

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131

$30.300

$29.542

$29.391

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Microchip USA

USA . 1,554 parts In-Stock

1+ parts

$47.280

100+ parts

$46.610

1k+ parts

$46.270

10k+ parts

$45.930

1,554

$47.280

$46.610

$46.270

$45.930

Parana Technologies

USA . 1,501 parts In-Stock

1+ parts

$50.313

100+ parts

-

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1,501

$50.313

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DigiPath Technology Company

USA . 1,473 parts In-Stock

1+ parts

$55.400

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1,473

$55.400

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ChromeModa Solutions

Germany . 2,096 parts In-Stock

1+ parts

$56.531

100+ parts

$46.355

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-

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2,096

$56.531

$46.355

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IDEA Electronic Components Group

UK . 146 parts In-Stock

1+ parts

$56.531

100+ parts

$53.704

1k+ parts

$50.878

10k+ parts

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146

$56.531

$53.704

$50.878

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Corohmni

South Africa . 490 parts In-Stock

1+ parts

$85.033

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490

$85.033

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Argo Parts USA

USA . 3,562 parts In-Stock

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3,562

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Perfect Parts

USA . 564 parts In-Stock

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564

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A-Z Elektronik GmbH

Germany . 368 parts In-Stock

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368

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Lixinc

USA . 178 parts In-Stock

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178

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iodParts Technologies Inc.

India . 50 parts In-Stock

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50

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Overview

Elevate your product designs with the AM3357BZCZA30 by Texas Instruments. As a leading manufacturer, Texas Instruments delivers top-quality microprocessors that excel in various applications. This powerful chip boasts integrated cache and low power mode, providing unmatched performance and energy efficiency. With its industrial-grade temperature grade and boundary scan capability, this microprocessor is perfect for demanding projects. Trust in Texas Instruments to meet your design needs and take your products to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good thermal and mechanical properties, making the product durable and reliable.

Integrated Cache: YES

Integrated cache improves the performance of the microprocessor by reducing data access times and increasing overall speed.

Maximum Supply Voltage: 1.144 V

Operating within a safe maximum supply voltage ensures the longevity and stability of the microprocessor.

Bit Size: 32

A 32-bit architecture allows for efficient processing of data in larger chunks, enhancing overall performance.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures the microprocessor can function in various environments without any issues.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture provides efficient execution of instructions, leading to faster processing speeds and improved performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Technical Specifications

Microprocessors AM3357BZCZA30 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT MIN 0.912 V

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

300 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3357BZCZA30 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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