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AM6411BSCGGAALV

Texas Instruments

AM6411BSCGGAALV by Texas Instruments

AM6411BSCGGAALV by Texas Instruments is a 64-bit microprocessor with integrated cache and 16-bit on-chip data RAM. It operates at a max clock frequency of 25 MHz, suitable for low power mode applications. This CMOS technology processor has 441 terminals in a grid array package style, making it ideal for high-speed computing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,499 parts In-Stock

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Digiode

USA . 4,981 parts In-Stock

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VNN

France . 1,064 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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One Stop Electronics

USA . 444 parts In-Stock

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$9.000

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444

$9.000

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AZTECH Wire

Italy . 497 parts In-Stock

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$15.953

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Semicontronic

India . 683 parts In-Stock

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$16.000

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$15.600

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$15.520

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683

$16.000

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$15.520

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Ampacity Inc.

Singapore . 384 parts In-Stock

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$25.000

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384

$25.000

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Parana Technologies

USA . 1,662 parts In-Stock

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$42.533

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Corohmni

South Africa . 204 parts In-Stock

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$42.550

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DigiPath Technology Company

USA . 619 parts In-Stock

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$46.834

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$43.087

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619

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ChromeModa Solutions

Germany . 3,890 parts In-Stock

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$47.790

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$39.188

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IDEA Electronic Components Group

UK . 977 parts In-Stock

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$47.790

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$45.400

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$43.011

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977

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Argo Parts USA

USA . 4,483 parts In-Stock

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Corphita

USA . 3,564 parts In-Stock

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Continental Prestige Electronics

USA . 269 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Experience unparalleled processing power and efficiency with the AM6411BSCGGAALV by Texas Instruments. As a leader in microprocessor technology, Texas Instruments delivers top-notch quality and reliability in every product. This microprocessor is perfect for a wide range of applications, from industrial automation to consumer electronics. With integrated cache and advanced features, this microprocessor offers customers exceptional value, superior performance, and endless possibilities for innovation. Upgrade your projects today with the AM6411BSCGGAALV and unleash the full potential of your designs.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy material makes the microprocessor lightweight and durable.

Integrated Cache:

YES - Having integrated cache helps in improving the performance and efficiency of the microprocessor.

Surface Mount:

YES - Surface mount capability makes it easy to install and replace the microprocessor on a circuit board.

Maximum Supply Voltage:

0.79 V - Operating at a maximum supply voltage of 0.79 V ensures energy efficiency and lower power consumption.

On Chip Data RAM Width:

16 - Having a 16-bit on-chip data RAM width allows for faster data processing and storage capabilities.

Address Bus Width:

14 - A wider address bus width of 14 enables the microprocessor to handle larger memory capacities.

Package Shape:

SQUARE - The square package shape allows for efficient use of space on a circuit board.

Bit Size:

64 - With a 64-bit size, the microprocessor can handle a wide range of data processing tasks efficiently.

No. of Terminals:

441 - The high number of terminals provides flexibility and connectivity options for various applications.

Package Style (Meter):

GRID ARRAY, FINE PITCH - The grid array, fine pitch package style offers high density and improved signal integrity.

Minimum Supply Voltage:

0.715 V - Operating at a minimum supply voltage of 0.715 V ensures energy efficiency and longer battery life.

Maximum Operating Temperature:

105 °C - The high maximum operating temperature of 105°C allows for reliable performance in harsh environments.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature of -40°C ensures the microprocessor can function in extreme cold conditions.

Terminal Position:

BOTTOM - The terminal position at the bottom simplifies the installation and connection process on a circuit board.

Maximum Seated Height:

2.652 mm - The low maximum seated height of 2.652 mm saves space and allows for compact designs.

RAM Words:

2359296 - The large number of RAM words provides ample memory capacity for storing and processing data.

Width:

17.2 mm - The compact width of 17.2 mm makes the microprocessor suitable for space-constrained applications.

Boundary Scan:

YES - The presence of boundary scan feature helps in testing and debugging the microprocessor more efficiently.

External Data Bus Width:

16 - The wide 16-bit external data bus width allows for faster data transfer between the microprocessor and external devices.

Maximum Clock Frequency:

25 MHz - Operating at a maximum clock frequency of 25 MHz enables high-speed data processing and computation.

Length:

17.2 mm - The compact length of 17.2 mm makes the microprocessor suitable for small form factor devices.

Peripheral IC Type:

MICROPROCESSOR, RISC - Being a RISC microprocessor with peripheral IC type offers enhanced performance and efficiency for specific tasks.

Technology:

CMOS - The CMOS technology used in the microprocessor provides low power consumption and high noise immunity.

Terminal Form:

BALL - The ball terminal form offers reliable connections and minimizes signal losses on a circuit board.

Nominal Supply Voltage:

0.75 V - The nominal supply voltage of 0.75 V ensures stable and efficient operation of the microprocessor.

No. of Serial I/Os:

7 - Having 7 serial I/Os provides flexibility and connectivity options for interfacing with external devices.

Terminal Pitch:

0.8 mm - The small terminal pitch of 0.8 mm allows for high-density packaging of the microprocessor on a circuit board.

Format:

FIXED POINT - The fixed-point format allows for precise arithmetic calculations and data processing.

Speed:

1000 rpm - The high speed of 1000 rpm enables fast data processing and computation tasks.

Low Power Mode:

YES - The availability of a low power mode helps in reducing energy consumption and extending battery life for mobile devices.

Technical Specifications

Microprocessors AM6411BSCGGAALV attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

Address Bus Width:

14

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

Low Power Mode:

YES

No. of External Interrupts:

1

No. of Serial I/Os:

7

No. of Terminals:

441

On Chip Data RAM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

RAM Words:

2359296

Maximum Seated Height:

2.652 mm

Speed:

1000 rpm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17.2 mm

Peripheral IC Type:

Trade Compliance

AM6411BSCGGAALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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