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MC9328MXSVP10R2

NXP Semiconductors

MC9328MXSVP10R2 by NXP Semiconductors

MC9328MXSVP10R2 by NXP Semiconductors is a 32-bit microprocessor with 225 terminals, operating at a max frequency of 16 MHz. It features an address bus width of 25 bits and supports low power mode, making it ideal for commercial applications requiring high-speed processing in a compact form factor.

Median Price

$9.810

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 1,845 parts In-Stock

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1,845

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Distributors (In-Stock)

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Nova Conductors

Japan . 45 parts In-Stock

1+ parts

$9.810

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45

$9.810

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Digiode

USA . 4,595 parts In-Stock

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4,595

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Flip Electronics

USA . 2,266 parts In-Stock

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Vyrian

USA . 1,483 parts In-Stock

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Anansix

USA . 315 parts In-Stock

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315

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Distributors (Availability)

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Continental Prestige Electronics

USA . 3,548 parts In-Stock

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$9.810

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$9.614

3,548

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$9.614

Netroflash

USA . 500 parts In-Stock

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$9.810

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500

$9.810

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Semicontronic

India . 1,587 parts In-Stock

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$19.000

100+ parts

$18.525

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$18.430

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1,587

$19.000

$18.525

$18.430

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Ampacity Inc.

Singapore . 1,616 parts In-Stock

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$20.000

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One Stop Electronics

USA . 1,661 parts In-Stock

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$32.000

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Aztec Data Supply Inc.

USA . 120 parts In-Stock

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$42.542

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120

$42.542

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$44.439

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$40.439

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$36.440

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500

$44.439

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$36.440

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Corohmni

South Africa . 440 parts In-Stock

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$74.466

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Component Stockers USA

USA . 312 parts In-Stock

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$99.990

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Microchip USA

USA . 227 parts In-Stock

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$108.705

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227

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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UNI Independent Distributors

Spain . 2,468 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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Argo Parts USA

USA . 1,322 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Corphita

USA . 546 parts In-Stock

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546

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A-Z Elektronik GmbH

Germany . 374 parts In-Stock

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374

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Overview

Experience the power of cutting-edge technology with the MC9328MXSVP10R2 by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality microprocessors that are versatile and reliable. Ideal for a wide range of applications, this product offers unparalleled performance and efficiency. With features like low power mode and high clock frequency, customers can expect seamless operation and superior functionality. Trust NXP Semiconductors to provide innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the MC9328MXSVP10R2 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and protection for the microprocessor, ensuring reliability in various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.9 V

Operating within a maximum supply voltage of 1.9V ensures compatibility with a wide range of power sources, making it versatile and adaptable for different applications.

Address Bus Width: 25

Having a wide address bus width of 25 bits enables the microprocessor to access a large memory space, improving performance and data processing capabilities.

Package Shape: SQUARE

The square package shape is space-efficient and facilitates uniform heat dissipation, enhancing the overall reliability and longevity of the microprocessor.

Bit Size: 32

With a 32-bit architecture, the microprocessor can handle larger chunks of data at once, leading to faster processing speeds and improved performance.

No. of Terminals: 225

Having a high number of terminals allows for increased connectivity and functionality, making the microprocessor suitable for complex computing tasks.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The combination of grid array, low profile, and fine pitch package styles offers high density and reliability in a compact form factor, making it ideal for space-constrained applications.

Minimum Supply Voltage: 1.7 V

Operating within a minimum supply voltage of 1.7V ensures energy efficiency and reduces power consumption, making the microprocessor suitable for low-power applications.

Maximum Operating Temperature: 70 °C

Being able to operate at a maximum temperature of 70°C allows the microprocessor to function reliably in various environments without overheating issues.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, the microprocessor can operate effectively even in cold conditions, ensuring consistent performance.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring stable connections and long-term reliability.

Terminal Position: BOTTOM

Having terminals positioned at the bottom of the package facilitates easy and secure board mounting, enhancing the overall robustness and stability of the microprocessor.

Maximum Seated Height: 1.6 mm

Having a low maximum seated height of 1.6mm allows for compact integration and minimal profile design, making the microprocessor suitable for thin devices and space-constrained applications.

Width: 13 mm

With a width of 13mm, the microprocessor offers a balance between compact size and ease of handling, making it versatile for a range of electronic designs.

Boundary Scan: YES

Incorporating boundary scan capability allows for enhanced testing and debugging of the microprocessor during production, ensuring high quality and reliability.

External Data Bus Width: 32

Having a wide external data bus width of 32 bits allows for efficient data transfer between the microprocessor and external memory devices, enhancing overall system performance.

Maximum Clock Frequency: 16 MHz

Operating at a maximum clock frequency of 16 MHz enables the microprocessor to handle data processing tasks at high speeds, ideal for applications requiring real-time responsiveness.

Maximum Time At Peak Reflow Temperature (s): 40

The ability to withstand peak reflow temperatures for up to 40 seconds ensures reliable soldering during manufacturing processes, leading to high-quality assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the microprocessor can undergo soldering processes without damage, ensuring robust connections and long-term reliability.

Length: 13 mm

Having a length of 13mm offers a compact form factor that is suitable for various electronic applications, providing flexibility in design and integration.

Temperature Grade: COMMERCIAL

Operating within commercial temperature grades ensures compatibility with standard operating environments, making the microprocessor suitable for a wide range of commercial applications.

Peripheral IC Type: MICROPROCESSOR

Being a microprocessor, the product offers advanced processing capabilities and versatility for a range of computing tasks, making it a powerful and flexible solution.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high-speed operation, making the microprocessor energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

Having a ball terminal form provides reliable connections and ease of soldering, ensuring secure mounting and robust performance in various operating conditions.

Nominal Supply Voltage: 1.8 V

Operating at a nominal supply voltage of 1.8V ensures stable and efficient performance, making the microprocessor suitable for a wide range of electronic applications.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, the microprocessor offers precise and compact interconnection, enabling high-density PCB designs and efficient signal routing.

Format: FIXED POINT

Utilizing fixed-point format enables accurate and efficient numerical calculations, making the microprocessor suitable for a variety of computational tasks in real-time applications.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the microprocessor can withstand moderate exposure to moisture during handling and assembly, ensuring reliability in various environments.

Speed: 100 rpm

Operating at a speed of 100 rpm allows the microprocessor to handle data processing tasks quickly and efficiently, making it suitable for applications requiring high-speed performance.

Low Power Mode: YES

Featuring a low power mode enables the microprocessor to conserve energy and extend battery life in portable devices, making it a suitable choice for power-efficient applications.

Technical Specifications

Microprocessors MC9328MXSVP10R2 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

25

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

16 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B225

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

225

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

13 mm

Peripheral IC Type:

Trade Compliance

MC9328MXSVP10R2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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