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MC9328MX1DVM20R2

NXP Semiconductors

MC9328MX1DVM20R2 by NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;

Median Price

$24.520

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 3,421 parts In-Stock

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Verical

USA . 1,250 parts In-Stock

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$22.512

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$22.512

Rochester

USA . 358 parts In-Stock

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$24.520

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$21.940

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$20.650

358

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$24.520

$21.940

$20.650

Farnell

UK . 358 parts In-Stock

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$25.570

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358

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$25.570

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Distributors (In-Stock)

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Vyrian

USA . 4,573 parts In-Stock

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$19.510

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Digiode

USA . 3,577 parts In-Stock

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$25.954

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Flip Electronics

USA . 3,251 parts In-Stock

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Anansix

USA . 384 parts In-Stock

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384

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Distributors (Availability)

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Corphita

USA . 154 parts In-Stock

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$24.588

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154

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One Stop Electronics

USA . 1,270 parts In-Stock

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$47.300

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$47.300

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Microchip USA

USA . 4,723 parts In-Stock

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Vigor

Singapore . 3,161 parts In-Stock

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UNI Independent Distributors

Spain . 2,518 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Technical Specifications

Microprocessors MC9328MX1DVM20R2 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

25

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

16 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,1.8/3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER OVER NICKEL

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MC9328MX1DVM20R2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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