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ATSAMA5D225C-D1M-CU

Microchip Technology

ATSAMA5D225C-D1M-CU by Microchip Technology

ATSAMA5D225C-D1M-CU by Microchip Technology is a microprocessor with integrated cache and a max clock frequency of 24 MHz. It is used in industrial applications, has a temperature range of -40 to 85 °C, and features low power mode for energy efficiency.

Median Price

$12.630

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 5,524 parts In-Stock

1+ parts

$12.630

100+ parts

$9.560

1k+ parts

$8.560

10k+ parts

$8.300

5,524

$12.630

$9.560

$8.560

$8.300

DigiKey

USA . 143 parts In-Stock

1+ parts

$12.630

100+ parts

$10.162

1k+ parts

-

10k+ parts

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143

$12.630

$10.162

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Mouser Electronics

USA . 99 parts In-Stock

1+ parts

$12.630

100+ parts

$10.170

1k+ parts

$10.160

10k+ parts

-

99

$12.630

$10.170

$10.160

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 5,104 parts In-Stock

1+ parts

$11.960

100+ parts

$10.840

1k+ parts

$9.910

10k+ parts

-

5,104

$11.960

$10.840

$9.910

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$12.250

100+ parts

-

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300

$12.250

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-

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Vyrian

USA . 5,536 parts In-Stock

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5,536

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VNN

France . 250 parts In-Stock

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250

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,423 parts In-Stock

1+ parts

$9.240

100+ parts

-

1k+ parts

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10k+ parts

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2,423

$9.240

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-

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Ampacity Inc.

Singapore . 4,329 parts In-Stock

1+ parts

$10.230

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-

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10k+ parts

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4,329

$10.230

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-

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Semicontronic

India . 2,684 parts In-Stock

1+ parts

$10.230

100+ parts

$9.974

1k+ parts

$9.923

10k+ parts

-

2,684

$10.230

$9.974

$9.923

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Continental Prestige Electronics

USA . 6,585 parts In-Stock

1+ parts

$12.250

100+ parts

-

1k+ parts

-

10k+ parts

$12.005

6,585

$12.250

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-

$12.005

Aztec Data Supply Inc.

USA . 795 parts In-Stock

1+ parts

$21.440

100+ parts

-

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795

$21.440

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Microchip USA

USA . 1,514 parts In-Stock

1+ parts

$37.632

100+ parts

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1k+ parts

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10k+ parts

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1,514

$37.632

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$50.355

100+ parts

$47.837

1k+ parts

$47.837

10k+ parts

-

5,000

$50.355

$47.837

$47.837

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Corohmni

South Africa . 228 parts In-Stock

1+ parts

$76.176

100+ parts

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228

$76.176

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Lixinc

USA . 13,694 parts In-Stock

1+ parts

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13,694

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Argo Parts USA

USA . 4,577 parts In-Stock

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4,577

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West Coast Incorporated

USA . 864 parts In-Stock

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864

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Overview

Discover the power of innovation with Microchip Technology's ATSAMA5D225C-D1M-CU microprocessor. As a leading manufacturer, Microchip Technology delivers exceptional quality and reliability, ensuring that every product meets the highest standards. This microprocessor offers unparalleled performance and versatility, making it ideal for a wide range of applications. With its integrated cache and low power mode, you can expect efficient and seamless operation. From industrial automation to embedded systems, this microprocessor is designed to exceed your expectations. Upgrade your projects with the ATSAMA5D225C-D1M-CU and experience the value, benefits, and advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protects the internal components of the microprocessor, making it a reliable and long-lasting choice.

Integrated Cache: YES

With integrated cache, this microprocessor can efficiently store frequently accessed data, resulting in improved performance and faster processing speeds.

Surface Mount: YES

The surface mount feature simplifies the installation process and allows for easy integration onto printed circuit boards, making it a convenient choice for manufacturers.

Maximum Supply Voltage: 1.3 V

The higher maximum supply voltage of 1.3V provides ample power for the microprocessor to handle demanding tasks, ensuring smooth and efficient operation.

On Chip Data RAM Width: 16

The wide 16-bit on-chip data RAM width enables the microprocessor to handle and process larger amounts of data simultaneously, enhancing its overall performance capabilities.

Package Shape: SQUARE

The square package shape offers a compact form factor, minimizing space requirements and allowing for easy integration into various electronic devices.

Bit Size: 16

With a bit size of 16, this microprocessor can handle and process data in larger chunks, resulting in enhanced computational capabilities and improved efficiency.

No. of Terminals: 196

The large number of terminals provides sufficient connectivity options, allowing for seamless integration with other components and peripherals for versatile functionality.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch enables high density mounting and facilitates efficient heat dissipation, making it an ideal choice for space-constrained applications.

Minimum Supply Voltage: 1.14 V

The lower minimum supply voltage of 1.14V ensures energy efficiency and enables the microprocessor to operate with minimal power consumption, making it suitable for mobile and battery-powered devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability under demanding environments, making this microprocessor a suitable choice for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the microprocessor can operate reliably in extreme cold conditions, broadening its range of use in various environments.

Terminal Finish: TIN SILVER COPPER NICKEL

The terminal finish consisting of tin, silver, copper, and nickel provides excellent durability, corrosion resistance, and efficient electrical conductivity, ensuring reliable performance over an extended lifespan.

Terminal Position: BOTTOM

The bottom terminal position simplifies the installation process and allows for easy connectivity with other components, enhancing ease of use and convenience.

Maximum Seated Height: 1.2 mm

The maximum seated height of 1.2 mm ensures compatibility with different mounting configurations, making this microprocessor suitable for various space-constrained applications.

RAM Words: 65536

With a large number of RAM words (65536), this microprocessor can effectively handle and store substantial amounts of data, enabling efficient multitasking and complex computations.

Width: 11 mm

The width of 11 mm allows for easy integration into compact electronic devices, providing flexibility in design and reducing space constraints.

Boundary Scan: YES

The presence of boundary scan capability simplifies production testing and debugging processes, ensuring easier identification and resolution of potential issues, making this microprocessor a convenient choice for manufacturers.

Maximum Clock Frequency: 24 MHz

With a high maximum clock frequency of 24 MHz, this microprocessor can execute instructions at a rapid rate, resulting in faster data processing and improved overall performance.

Length: 11 mm

The length of 11 mm ensures compatibility with various mounting configurations, allowing for seamless integration into electronic devices with limited space.

Temperature Grade: INDUSTRIAL

The INDUSTRIAL temperature grade ensures reliable performance in harsh operating conditions typically encountered in industrial settings, making it a robust choice for industrial applications.

Peripheral IC Type: MICROPROCESSOR, RISC

The microprocessor's RISC architecture enables efficient instruction execution, lower power consumption, and faster data processing, making it a suitable choice for applications demanding high performance.

Technology: CMOS

The use of CMOS technology results in low power consumption, reduced heat generation, and improved efficiency, making this microprocessor an energy-efficient and eco-friendly choice.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections, simplifies installation, and allows for efficient heat dissipation, making this microprocessor a reliable and user-friendly option.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2V ensures stable and consistent power delivery, supporting reliable operation and efficient performance.

No. of DMA Channels: 51

The generous number of DMA channels (51) allows for efficient data transfer without burdening the microprocessor, enabling improved multitasking capabilities and enhanced system performance.

No. of Serial I/Os: 1

The presence of one serial I/O (Input/Output) interface facilitates seamless communication with external devices, enhancing connectivity options and enabling versatile applications.

Terminal Pitch: 0.75 mm

The small terminal pitch of 0.75 mm enables high-density mounting and helps reduce overall PCB size, making this microprocessor suitable for compact and space-constrained designs.

Format: FIXED POINT

The fixed-point format supports precise and efficient numerical calculations, making the microprocessor an ideal choice for applications requiring accurate mathematical operations.

Speed: 500 rpm

With a high speed of 500 revolutions per minute (rpm), this microprocessor can efficiently execute tasks that require rapid data processing, contributing to improved system performance.

Low Power Mode: YES

The availability of a low power mode allows the microprocessor to reduce power consumption during idle or low-demand periods, enhancing energy efficiency and prolonging battery life.

Technical Specifications

Microprocessors ATSAMA5D225C-D1M-CU attributes and parameters. Explore more Microprocessors devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

24 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e2

Length:

11 mm

Low Power Mode:

YES

No. of DMA Channels:

51

No. of Serial I/Os:

1

No. of Terminals:

196

On Chip Data RAM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA196,14X14,30

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

65536

Maximum Seated Height:

1.2 mm

Speed:

500 rpm

Maximum Supply Voltage:

1.3 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER NICKEL

Terminal Form:

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Width:

11 mm

Peripheral IC Type:

Trade Compliance

ATSAMA5D225C-D1M-CU Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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