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MCF5275CVM166

NXP Semiconductors

MCF5275CVM166 by NXP Semiconductors

The NXP Semiconductors MCF5275CVM166 microprocessor features a 32-bit architecture, integrated cache, and operates at a max clock frequency of 83 MHz. Ideal for industrial applications requiring low power consumption, it has an address bus width of 24 bits and supports boundary scan testing.

Median Price

$49.550

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 31 parts In-Stock

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$49.550

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31

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Flip Electronics (Authorized)

USA . 450 parts In-Stock

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450

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EBV Elektronik

Germany . 270 parts In-Stock

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270

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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$37.745

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50

$37.745

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Digiode

USA . 2,951 parts In-Stock

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$47.072

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Anansix

USA . 2,614 parts In-Stock

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Chip Stock

USA . 958 parts In-Stock

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958

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Flip Electronics

USA . 450 parts In-Stock

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450

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Vyrian

USA . 241 parts In-Stock

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J & M Industries LLC

USA . 12 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3 parts In-Stock

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Bristol Electronics

USA . 3 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 311 parts In-Stock

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$16.936

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$16.936

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Vigor

Singapore . 885 parts In-Stock

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$27.600

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885

$27.600

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Bastille Electronics

Australia . 600 parts In-Stock

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$37.740

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$35.853

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$33.589

600

$37.740

$35.853

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$33.589

Continental Prestige Electronics

USA . 6,003 parts In-Stock

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$37.745

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$36.990

6,003

$37.745

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$36.990

Ampacity Inc.

Singapore . 241 parts In-Stock

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$42.120

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241

$42.120

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Corphita

USA . 3,277 parts In-Stock

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$44.595

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$44.595

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Microchip USA

USA . 2,133 parts In-Stock

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$90.152

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A-Z Elektronik GmbH

Germany . 7,413 parts In-Stock

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Argo Parts USA

USA . 3,520 parts In-Stock

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UNI Independent Distributors

Spain . 2,819 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Perfect Parts

USA . 302 parts In-Stock

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Overview

Unleash the power of innovation with the MCF5275CVM166 by NXP Semiconductors. Designed to deliver unmatched performance and reliability, this microprocessor is the perfect solution for a wide range of applications. With advanced features and cutting-edge technology, it provides customers with exceptional value and benefits. Whether you're looking to enhance your industrial automation systems or boost the efficiency of your embedded devices, the MCF5275CVM166 has you covered. Trust NXP Semiconductors to bring you quality and excellence in every product they offer. Elevate your projects to new heights with the MCF5275CVM166 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the microprocessor lightweight and durable, making it easy to handle and resistant to damage.

Integrated Cache: YES

Having integrated cache enhances the performance of the microprocessor by reducing the access time for frequently used data, resulting in faster processing speeds.

Surface Mount: YES

The surface mount capability allows for easy installation and space-saving on printed circuit boards, making it suitable for compact electronic devices.

Maximum Supply Voltage: 1.6 V

Operating within a safe voltage range of 1.4V to 1.6V ensures the stable performance and longevity of the microprocessor.

Address Bus Width: 24

A wider address bus width of 24 increases the memory capacity and data transfer efficiency, improving the overall processing capabilities.

Package Shape: SQUARE

The square package shape allows for easy placement and alignment on circuit boards, optimizing space utilization and enabling efficient heat dissipation.

Bit Size: 32

With a bit size of 32, the microprocessor can handle larger data sizes and perform complex calculations, making it suitable for demanding computational tasks.

No. of Terminals: 256

Having 256 terminals provides ample connectivity options for interfacing with other components, enhancing the versatility and compatibility of the microprocessor.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array low-profile package style offers a compact design with efficient heat dissipation, making it ideal for space-constrained applications while maintaining optimal thermal management.

Minimum Supply Voltage: 1.4 V

The low minimum supply voltage of 1.4V enables energy-efficient operation and reduces power consumption, contributing to overall system efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the microprocessor can withstand elevated temperature conditions without compromising performance, ensuring reliability in various environments.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature from -40°C allows the microprocessor to function effectively in extreme cold conditions, making it suitable for diverse applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides robust protection against corrosion and oxidation, ensuring long-term connectivity and signal integrity.

Terminal Position: BOTTOM

Having terminals positioned at the bottom allows for easy mounting and soldering on PCBs, facilitating efficient assembly and maintenance.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6mm enables a slim profile design, making the microprocessor suitable for slim and compact electronic devices.

Width: 17 mm

With a width of 17mm, the microprocessor is compact and can be easily integrated into various electronic devices without occupying excessive space.

Boundary Scan: YES

The presence of boundary scan feature allows for efficient testing and debugging of the microprocessor during manufacturing and operation, ensuring quality and reliability.

External Data Bus Width: 32

A wider external data bus width of 32 facilitates high-speed data transfer between the microprocessor and external devices, enhancing overall system performance.

Maximum Clock Frequency: 83 MHz

Operating at a maximum clock frequency of 83MHz enables rapid execution of instructions and high-speed processing, making the microprocessor suitable for tasks requiring fast computation.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures proper soldering and reliability during manufacturing processes, maintaining the electrical connections.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the microprocessor can withstand high-temperature soldering processes without damage, ensuring robust solder connections.

Length: 17 mm

The length of 17mm contributes to the compact form factor of the microprocessor, allowing for easy integration into various electronic devices while maintaining a space-efficient design.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures reliable performance and stability in harsh operating environments, making the microprocessor suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Featuring a RISC architecture for the peripheral IC type enhances the processing efficiency and speed of the microprocessor, making it ideal for computing-intensive tasks.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high speed, and noise immunity, making the microprocessor energy-efficient and reliable for a wide range of applications.

Terminal Form: BALL

Having a ball terminal form simplifies the soldering and mounting process, ensuring secure connections and ease of installation on PCBs.

Nominal Supply Voltage: 1.5 V

Operating at a nominal supply voltage of 1.5V strikes a balance between performance and power efficiency, making the microprocessor suitable for various electronic applications.

Terminal Pitch: 1 mm

The small terminal pitch of 1mm allows for high-density mounting and compact PCB designs, enabling efficient use of space in electronic devices.

Format: FIXED POINT

The fixed-point format simplifies arithmetic calculations and data processing, ensuring accuracy and efficiency in mathematical operations performed by the microprocessor.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the microprocessor can withstand moderate exposure to moisture during storage and handling, ensuring reliability and longevity.

Speed: 166 rpm

Operating at a speed of 166 rpm, the microprocessor delivers high-performance computing capabilities for efficient data processing and task execution.

Low Power Mode: YES

The availability of a low-power mode enhances energy efficiency and extends battery life, making the microprocessor suitable for mobile and battery-operated devices.

Technical Specifications

Microprocessors MCF5275CVM166 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

83 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Speed:

166 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Trade Compliance

MCF5275CVM166 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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