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MPC860TVR66D4

NXP Semiconductors

MPC860TVR66D4 by NXP Semiconductors

The NXP Semiconductors MPC860TVR66D4 is a 32-bit microprocessor with integrated cache and a max clock frequency of 50 MHz. It is commonly used in applications requiring low power mode, such as embedded systems and industrial automation.

Median Price

$78.400

Lifecycle Status

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In-Stock Inventory

1k+

MPC860TVR66D4 by NXP Semiconductors
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Arrow

USA . 34 parts In-Stock

1+ parts

$71.750

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34

$71.750

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Verical

USA . 34 parts In-Stock

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$71.750

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34

$71.750

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Chip1Stop

Japan . 34 parts In-Stock

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$78.400

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34

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Rochester

USA . 249 parts In-Stock

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$207.450

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$195.000

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$182.560

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249

$207.450

$195.000

$182.560

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DigiKey

USA . 249 parts In-Stock

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$259.310

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249

$259.310

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Digiode

USA . 1,832 parts In-Stock

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$68.162

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1,832

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Nova Conductors

Japan . 10 parts In-Stock

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$101.977

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10

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Vyrian

USA . 6,385 parts In-Stock

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Anansix

USA . 2,877 parts In-Stock

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Flip Electronics

USA . 113 parts In-Stock

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Bristol Electronics

USA . 55 parts In-Stock

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DigiKey Marketplace

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AZTECH Wire

Italy . 616 parts In-Stock

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$19.691

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616

$19.691

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Ampacity Inc.

Singapore . 56 parts In-Stock

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$60.990

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Corphita

USA . 3,813 parts In-Stock

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$64.575

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Component Stockers USA

USA . 61 parts In-Stock

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$84.490

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61

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Vigor

Singapore . 377 parts In-Stock

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$101.200

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377

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Continental Prestige Electronics

USA . 3,088 parts In-Stock

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$101.977

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$99.938

3,088

$101.977

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$99.938

Microchip USA

USA . 2,263 parts In-Stock

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$270.060

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2,263

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UNI Independent Distributors

Spain . 5,674 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,618 parts In-Stock

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5,618

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Argo Parts USA

USA . 4,421 parts In-Stock

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Perfect Parts

USA . 99 parts In-Stock

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ChipstoGo Electronic ltd

UK . 6 parts In-Stock

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Kepictronics

USA . 5 parts In-Stock

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Overview

Looking to enhance your electronic devices with a high-quality microprocessor? Look no further than the MPC860TVR66D4 by NXP Semiconductors. With its advanced technology and exceptional performance, this microprocessor is perfect for a wide range of applications. Not only does it offer reliable power and speed, but it also comes in a compact package that makes installation a breeze. With NXP Semiconductors' reputation for excellence, you can trust that the MPC860TVR66D4 will deliver the value, benefits, and advantages you need to take your projects to the next level. Upgrade your devices today and experience the difference!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the microprocessor, making it a reliable choice for long-term use.

Integrated Cache:

YES - With integrated cache, this microprocessor is able to store frequently accessed data, improving overall performance and speed.

Surface Mount:

YES - The surface mount feature allows for easy installation and connection to other components, making it convenient for various applications.

Maximum Supply Voltage:

3.465 V - With a high maximum supply voltage, this microprocessor can handle demanding operations and ensure stable performance.

Address Bus Width:

32 - A wide address bus width of 32 enables efficient and extensive data transfer, making it suitable for complex computing tasks.

Package Shape:

SQUARE - The square package shape offers a compact design, allowing for space-saving integration in devices with size constraints.

Bit Size:

32 - With a bit size of 32, this microprocessor can process and handle a large amount of data, ensuring smooth and efficient operation.

Power Supplies (V):

3.3 - Operating at 3.3 volts, this microprocessor offers sufficient power for consistent performance without excessive energy consumption.

No. of Terminals:

357 - The high number of terminals allows for versatile connectivity options, facilitating integration with various peripherals.

Package Style (Meter):

GRID ARRAY - The grid array package style offers a secure and reliable connection interface, ensuring stable electrical performance.

Minimum Supply Voltage:

3.135 V - With a low minimum supply voltage, this microprocessor optimizes power efficiency and reduces energy consumption.

Terminal Finish:

TIN SILVER COPPER - The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

Terminal Position:

BOTTOM - The bottom terminal position simplifies the mounting process and facilitates smooth integration within the system.

Maximum Seated Height:

2.52 mm - With a low seated height, this microprocessor can be easily accommodated in devices with constrained spatial requirements.

Width:

25 mm - The compact width of 25 mm enables this microprocessor's compatibility with a wide range of device designs.

Boundary Scan:

YES - The boundary scan feature allows for efficient testing and fault diagnosis of the microprocessor, improving overall reliability and maintenance.

External Data Bus Width:

32 - An external data bus width of 32 ensures efficient data transfer between the microprocessor and external devices, enhancing overall performance.

Maximum Clock Frequency:

50 MHz - The high maximum clock frequency enables quick and responsive data processing, making it suitable for time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s):

30 - With a maximum time of 30 seconds at peak reflow temperature, this microprocessor can undergo soldering processes efficiently and reliably.

Peak Reflow Temperature °C:

245 - The high peak reflow temperature of 245°C ensures proper soldering and reliable connections for enhanced durability.

Length:

25 mm - The compact length of 25 mm makes this microprocessor suitable for use in devices with limited space available.

Peripheral IC Type:

MICROPROCESSOR, RISC - This microprocessor is designed specifically as a Reduced Instruction Set Computing (RISC) processor, offering optimized performance for specific computing tasks.

Technology:

CMOS - Utilizing complementary metal-oxide-semiconductor (CMOS) technology, this microprocessor provides low power consumption and improved performance efficiency.

Terminal Form:

BALL - The ball terminal form ensures reliable connections and easier installation, making it a practical choice for integration within devices.

Nominal Supply Voltage:

3.3 V - Operating at a nominal supply voltage of 3.3 volts, this microprocessor delivers consistent performance while minimizing power consumption.

Terminal Pitch:

1.27 mm - With a narrow terminal pitch of 1.27 mm, this microprocessor can be easily mounted and connected to other components, optimizing space utilization.

Format:

FIXED POINT - The fixed-point format allows for precise numerical calculations, making this microprocessor suitable for applications requiring high computational accuracy.

Moisture Sensitivity Level (MSL):

3 - With a moisture sensitivity level of 3, this microprocessor is adequately protected against moisture damage during manufacturing and storage.

Speed:

66 rpm - Operating at high speeds of 66 revolutions per minute, this microprocessor ensures rapid data processing and efficient performance.

Low Power Mode:

YES - With a low power mode feature, this microprocessor offers energy-saving capabilities, making it an environmentally friendly and cost-effective choice.

Technical Specifications

Microprocessors MPC860TVR66D4 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B357

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

357

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA357,19X19,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.52 mm

Speed:

66 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

MPC860TVR66D4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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