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CP3BT26Y98ADK/NOPB

Texas Instruments

CP3BT26Y98ADK/NOPB by Texas Instruments

CP3BT26Y98ADK/NOPB by Texas Instruments is a 16-bit microprocessor with 23-bit address bus width, operating at 2.25-2.75V. Ideal for industrial applications, it features ROM words of 262144, RAM bytes of 32768, and operates in low power mode at a speed of 24 rpm.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,421 parts In-Stock

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Vyrian

USA . 3,261 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,330 parts In-Stock

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$4.000

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1,330

$4.000

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AZTECH Wire

Italy . 261 parts In-Stock

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$6.942

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261

$6.942

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One Stop Electronics

USA . 1,117 parts In-Stock

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$28.000

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1,117

$28.000

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Corohmni

South Africa . 27 parts In-Stock

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$42.593

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27

$42.593

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Parana Technologies

USA . 744 parts In-Stock

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$69.532

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744

$69.532

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DigiPath Technology Company

USA . 1,777 parts In-Stock

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$76.563

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$70.438

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$70.438

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IDEA Electronic Components Group

UK . 2,182 parts In-Stock

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$78.126

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$74.220

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$70.313

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2,182

$78.126

$74.220

$70.313

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ChromeModa Solutions

Germany . 1,466 parts In-Stock

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$78.126

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$64.063

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$78.126

$64.063

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Continental Prestige Electronics

USA . 6,184 parts In-Stock

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Corphita

USA . 2,008 parts In-Stock

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Argo Parts USA

USA . 1,361 parts In-Stock

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Microchip USA

USA . 431 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Experience the power of innovation with the CP3BT26Y98ADK/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microprocessors that are versatile and reliable. Ideal for a wide range of applications, this microprocessor offers unmatched value with its advanced technology and efficient performance. Unlock new possibilities and enhance your projects with the CP3BT26Y98ADK/NOPB from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this microprocessor lightweight and cost-effective.

Surface Mount: YES

Being surface mountable makes it easier to integrate this microprocessor into electronic components, reducing assembly time and effort.

Maximum Supply Voltage: 2.75V

Operating at a maximum supply voltage of 2.75V ensures energy efficiency and helps in prolonging the lifespan of the microprocessor.

Address Bus Width: 23

With a wide address bus width of 23, this microprocessor can access a larger memory space efficiently, enabling faster data processing.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy placement within electronic devices.

Bit Size: 16

The 16-bit size of this microprocessor allows for handling a larger amount of data at once, increasing processing speed.

Power Supplies (V): 2.5, 2.5/3.3

Supporting multiple power supply options gives flexibility in choosing the appropriate voltage for different applications, making it versatile.

No. of Terminals: 144

Having 144 terminals provides a sufficient number of connection points for interfacing with other components, enhancing the microprocessor's usability.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The variety of package styles offers options for different mounting preferences, ensuring compatibility with various circuit board designs.

Minimum Supply Voltage: 2.25V

Operating at a minimum supply voltage of 2.25V ensures reliable performance even under low power conditions, making it suitable for battery-powered devices.

Maximum Operating Temperature: 85°C

With a high maximum operating temperature of 85°C, this microprocessor can withstand harsh environmental conditions without compromising performance.

CPU Family: CR16C

Being part of the CR16C CPU family ensures compatibility and support for specific applications designed for this family, enhancing functionality.

Minimum Operating Temperature: -40°C

Operating at a minimum temperature of -40°C allows this microprocessor to function in cold environments without any issues, increasing its applicability.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and improved solderability, ensuring long-term reliability of the connections.

Terminal Position: QUAD

The quad terminal position offers a stable and secure connection, preventing signal loss and ensuring consistent performance.

ROM Words: 262144

With a ROM capacity of 262144 words, this microprocessor can store a large amount of program data, enabling complex operations and applications.

Maximum Seated Height: 1.6mm

Having a maximum seated height of 1.6mm allows for a compact and slim design, suitable for space-constrained electronic devices.

Width: 20mm

With a width of 20mm, this microprocessor is compact and can be easily integrated into various device designs without taking up too much space.

Boundary Scan: YES

Supporting boundary scan functionality enables easy testing and debugging of the microprocessor, simplifying the development and maintenance process.

External Data Bus Width: 16

Having an external data bus width of 16 allows for high-speed data transfer between the microprocessor and external components, enhancing performance.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering during the manufacturing process, leading to reliable connections.

Peak Reflow Temperature °C: 260°C

The high peak reflow temperature of 260°C enables the microprocessor to withstand the soldering process without damage, ensuring product quality.

Length: 20mm

With a length of 20mm, this microprocessor has a compact form factor, making it suitable for various small-sized electronic devices.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature conditions ensures reliable operation in challenging environments, making it suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor with various peripheral ICs enhances the processing power and capabilities of the overall system.

RAM Bytes: 32768

With 32768 bytes of RAM, this microprocessor can efficiently handle data storage and retrieval tasks, enhancing overall system performance.

Technology: CMOS

Using CMOS technology allows for low power consumption and high noise immunity, making this microprocessor energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering, ensuring reliable connections in various operating conditions.

Maximum Supply Current: 20mA

With a maximum supply current of 20mA, this microprocessor operates efficiently without consuming excessive power, suitable for portable devices.

Nominal Supply Voltage: 2.5V

Having a nominal supply voltage of 2.5V ensures stable operation and compatibility with standard power sources, making it easy to integrate into existing systems.

ROM Programmability: FLASH

Using flash ROM programmability allows for easy firmware updates and customization, enhancing the flexibility and adaptability of the microprocessor.

Terminal Pitch: 0.5mm

The 0.5mm terminal pitch facilitates high-density mounting and makes it suitable for small footprint applications, maximizing board space utilization.

Format: FIXED POINT

Operating in a fixed-point format simplifies arithmetic operations and ensures predictable behavior, making this microprocessor ideal for real-time applications.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates moderate sensitivity to moisture, requiring standard handling procedures during assembly and storage.

Speed: 24rpm

Operating at a speed of 24rpm allows for quick data processing and efficient execution of instructions, improving overall system performance.

Low Power Mode: YES

Supporting a low power mode enables energy-saving operation when processing requirements are reduced, prolonging battery life and reducing power consumption.

Technical Specifications

Microprocessors CP3BT26Y98ADK/NOPB attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

16

Boundary Scan:

YES

CPU Family:

CR16C

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

CP3BT26Y98ADK/NOPB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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