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CP3BT10G38

Texas Instruments

CP3BT10G38 by Texas Instruments

CP3BT10G38 by Texas Instruments is a 16-bit microprocessor with 22-bit address bus width. It operates b/w -40 to 85 °C and has low power mode, suitable for industrial applications. The package style is flatpack, low profile, fine pitch with gull wing terminal form and boundary scan feature.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,848 parts In-Stock

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Digiode

USA . 840 parts In-Stock

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Anansix

USA . 228 parts In-Stock

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Northwest PG Solutions

USA . 2,206 parts In-Stock

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$2.396

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AZTECH Wire

Italy . 481 parts In-Stock

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$19.497

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One Stop Electronics

USA . 143 parts In-Stock

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Parana Technologies

USA . 541 parts In-Stock

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DigiPath Technology Company

USA . 1,205 parts In-Stock

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ChromeModa Solutions

Germany . 3,258 parts In-Stock

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$73.008

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$59.867

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IDEA Electronic Components Group

UK . 2,150 parts In-Stock

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$73.008

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$69.358

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$65.707

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Corphita

USA . 5,025 parts In-Stock

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Microchip USA

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Native Components

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Overview

Enhance your electronic devices with the CP3BT10G38 by Texas Instruments, a top-tier microprocessor designed to deliver exceptional performance and reliability. From its durable plastic/epoxy construction to its advanced CMOS technology, this processor is built to last. Ideal for a wide range of applications, this microprocessor offers impressive speed and low power consumption, making it a smart choice for any project. Trust in Texas Instruments' reputation for quality and innovation, and experience the difference that the CP3BT10G38 can bring to your technology solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on a circuit board.

Maximum Supply Voltage: 2.75 V

The high maximum supply voltage ensures stable operation in a variety of conditions.

Address Bus Width: 22

The wide address bus width allows for efficient memory access and data manipulation.

Package Shape: SQUARE

The square package shape makes the product easy to handle and integrate into a system.

Bit Size: 16

The 16-bit size enables processing of data in chunks, increasing efficiency.

No. of Terminals: 100

The large number of terminals provide ample connectivity options for various input and output devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style ensures space-saving installation and efficient heat dissipation.

Minimum Supply Voltage: 2.25 V

The low minimum supply voltage allows for power-efficient operation and prolongs battery life.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function in cold environments without issues.

Terminal Position: QUAD

The quad terminal position facilitates easy connection to peripheral devices and ensures a secure electrical connection.

Maximum Seated Height: 1.6 mm

The low maximum seated height saves space and allows for compact system design.

Width: 14 mm

The compact width of 14mm enables the product to fit into tight spaces on a circuit board.

Boundary Scan: YES

The boundary scan feature allows for efficient testing and debugging of the product during the manufacturing process.

External Data Bus Width: 16

The 16-bit external data bus width enables fast data transfer between the microprocessor and external memory devices.

Length: 14 mm

The short length of 14mm again contributes to space-saving and compact system design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can operate reliably in industrial settings with varying temperature conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

The use of RISC microprocessor technology enables high-performance computing and efficient use of resources.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull wing terminal form provides secure mechanical and electrical connections, reducing the risk of signal interference.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V provides a stable operating voltage for the microprocessor, ensuring consistent performance.

Terminal Pitch: 0.5 mm

The tight terminal pitch of 0.5mm allows for high-density packaging and efficient use of space on a circuit board.

Format: FIXED POINT

The fixed-point format simplifies mathematical calculations and improves processing speed for integer operations.

Speed: 24 rpm

The speed of 24 rpm signifies the processing capabilities of the microprocessor, enabling quick execution of instructions and tasks.

Low Power Mode: YES

The low power mode feature helps in reducing power consumption during idle or low activity periods, increasing energy efficiency.

Technical Specifications

Microprocessors CP3BT10G38 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

22

Bit Size:

16

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

CP3BT10G38 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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