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CP3BT10K38Y

Texas Instruments

CP3BT10K38Y by Texas Instruments

CP3BT10K38Y by Texas Instruments is a 16-bit microprocessor with 22-bit address bus width. Operating at speeds up to 24 rpm, it features low power mode and boundary scan capabilities. Ideal for industrial applications requiring high-speed processing in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,053 parts In-Stock

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Digiode

USA . 3,974 parts In-Stock

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Anansix

USA . 2,130 parts In-Stock

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2,130

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Distributors (Availability)

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Northwest PG Solutions

USA . 1,147 parts In-Stock

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$2.717

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$2.717

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AZTECH Wire

Italy . 400 parts In-Stock

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$6.202

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400

$6.202

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One Stop Electronics

USA . 1,514 parts In-Stock

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$16.000

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$16.000

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Parana Technologies

USA . 553 parts In-Stock

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$18.233

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$18.368

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553

$18.233

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$18.368

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DigiPath Technology Company

USA . 1,977 parts In-Stock

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$20.076

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$20.076

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ChromeModa Solutions

Germany . 3,213 parts In-Stock

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$20.486

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$16.799

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$16.799

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IDEA Electronic Components Group

UK . 2,025 parts In-Stock

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$20.486

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$19.462

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$18.437

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$18.437

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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Corphita

USA . 1,922 parts In-Stock

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Native Components

USA . 81 parts In-Stock

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$2.396

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81

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Overview

Experience next-level performance with the CP3BT10K38Y by Texas Instruments. Known for their top-quality microprocessors, Texas Instruments delivers cutting-edge technology that exceeds expectations. Perfect for a wide range of applications, this chip carrier microprocessor offers unparalleled value, benefits, and advantages to customers. Whether you're looking for reliability, efficiency, or innovation, the CP3BT10K38Y has you covered. Upgrade your projects today with Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and reliability in various electronic devices.

Maximum Supply Voltage: 2.75 V

The high maximum supply voltage ensures stability and performance under optimal operating conditions.

Address Bus Width: 22

A wider address bus width allows for efficient data handling and processing capabilities.

Package Shape: SQUARE

The square package shape provides optimal space utilization and compatibility with different mounting configurations.

Bit Size: 16

A 16-bit size offers a good balance between performance and power efficiency for various applications.

No. of Terminals: 48

With 48 terminals, this microprocessor can accommodate multiple connections and interfaces for enhanced functionality.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides durability and thermal efficiency for reliable operation in industrial environments.

Minimum Supply Voltage: 2.25 V

The low minimum supply voltage ensures compatibility with different power sources and energy-saving capabilities.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microprocessor can operate efficiently in various environmental conditions.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature allows for consistent performance in extreme cold environments.

Terminal Position: QUAD

The quad terminal position enables easy connection and compatibility with standard mounting configurations.

Maximum Seated Height: 1.1 mm

The low maximum seated height ensures compatibility with thin form factors and compact electronic devices.

Width: 7 mm

The compact width of 7 mm allows for easy integration and space-saving design options in various applications.

Boundary Scan: YES

Boundary scan capability enhances testing and debugging processes during product development and manufacturing.

External Data Bus Width: 16

A 16-bit external data bus width enables efficient data transfer and communication between different components.

Length: 7 mm

The short length of 7 mm provides flexibility in placement and installation options in electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh operating conditions and extended temperature ranges.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture of this microprocessor offers high-speed processing and efficiency for complex computational tasks.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption and high noise immunity for improved performance.

Terminal Form: NO LEAD

The no lead terminal form offers easy soldering and robust connections for long-term reliability.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V ensures stable and efficient operation under standard operating conditions.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for compact layout design and precise connectivity in electronic circuits.

Format: FIXED POINT

A fixed-point format provides accuracy and efficiency in numerical calculations and data processing tasks.

Speed: 24 rpm

With a speed of 24 rpm, this microprocessor offers fast processing capabilities for time-sensitive applications.

Low Power Mode: YES

The low power mode feature enhances energy efficiency and prolongs battery life in portable electronic devices.

Technical Specifications

Microprocessors CP3BT10K38Y attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

22

Bit Size:

16

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Low Power Mode:

YES

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

1.1 mm

Speed:

24 rpm

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

CP3BT10K38Y Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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