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CP3BT26G18AWMX/NOPB

Texas Instruments

CP3BT26G18AWMX/NOPB by Texas Instruments

CP3BT26G18AWMX/NOPB by Texas Instruments is a 16-bit microprocessor with 23-bit address bus width, operating at 2.25-2.75V. Ideal for industrial applications, it features ROM words of 262144, RAM of 32768 bytes, and operates in low power mode at speeds up to 24 rpm.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,176 parts In-Stock

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4,176

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Vyrian

USA . 3,946 parts In-Stock

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3,946

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Anansix

USA . 2,687 parts In-Stock

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2,687

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Distributors (Availability)

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AZTECH Wire

Italy . 729 parts In-Stock

1+ parts

$5.300

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729

$5.300

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One Stop Electronics

USA . 1,072 parts In-Stock

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$26.000

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1,072

$26.000

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Parana Technologies

USA . 656 parts In-Stock

1+ parts

$71.064

100+ parts

$6,599.355

1k+ parts

$63.957

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656

$71.064

$6,599.355

$63.957

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DigiPath Technology Company

USA . 822 parts In-Stock

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$78.250

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822

$78.250

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IDEA Electronic Components Group

UK . 2,196 parts In-Stock

1+ parts

$79.847

100+ parts

$75.855

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$71.862

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2,196

$79.847

$75.855

$71.862

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ChromeModa Solutions

Germany . 278 parts In-Stock

1+ parts

$79.847

100+ parts

$65.475

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278

$79.847

$65.475

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Native Components

USA . 578 parts In-Stock

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$113.540

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$108.998

578

$113.540

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$108.998

Northwest PG Solutions

USA . 610 parts In-Stock

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$124.894

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610

$124.894

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Corphita

USA . 4,653 parts In-Stock

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Microchip USA

USA . 370 parts In-Stock

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370

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Overview

Enhance your electronic projects with the CP3BT26G18AWMX/NOPB by Texas Instruments. As a leader in microprocessor technology, Texas Instruments delivers top-quality products that excel in various applications. Whether you're designing advanced consumer electronics or industrial automation systems, this microprocessor offers unmatched value, reliability, and performance. With its innovative features and cutting-edge technology, the CP3BT26G18AWMX/NOPB is the perfect choice for your next project. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing production costs.

Maximum Supply Voltage: 2.75 V

The 2.75V maximum supply voltage ensures compatibility with a wide range of power sources, providing flexibility in design.

Address Bus Width: 23

A wider address bus width of 23 allows for more memory addresses, improving the performance and capacity of the microprocessor.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to integrate the microprocessor into various electronic devices, optimizing space utilization.

Bit Size: 16

The 16-bit size allows for higher processing speed and efficiency, making it suitable for demanding applications.

Power Supplies (V): 2.5,2.5/3.3

The multiple power supply options of 2.5V and 2.5/3.3V provide flexibility in voltage requirements for different applications.

No. of Terminals: 128

With 128 terminals, the microprocessor offers versatile connectivity options for interfacing with other components in a system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The combination of flatpack, low profile, and fine pitch package styles ensures easy integration, minimal footprint, and high density packaging.

Minimum Supply Voltage: 2.25 V

The 2.25V minimum supply voltage ensures reliable operation even under low power conditions, enhancing the product's overall performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the microprocessor can withstand high temperatures, suitable for industrial applications.

CPU Family: CR16C

Part of the CR16C CPU family, known for its efficient and reliable performance in embedded systems and microcontroller applications.

Minimum Operating Temperature: -40 °C

The -40°C minimum operating temperature ensures reliable functionality even in extreme cold environments, expanding the product's range of use.

Terminal Position: QUAD

The quad terminal position offers efficient heat dissipation and ease of soldering, enhancing the overall reliability of the microprocessor.

ROM Words: 262144

With 262144 ROM words, the microprocessor offers ample storage capacity for program instructions and data, suitable for complex applications.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6mm allows for slim and compact designs, ideal for space-constrained applications.

Width: 14 mm

The 14mm width provides a balance between compact size and adequate spacing for connections, making the microprocessor versatile in various layouts.

Boundary Scan: YES

The boundary scan feature enables efficient testing and debugging of the microprocessor during production, ensuring robust quality control.

External Data Bus Width: 16

The 16-bit external data bus width facilitates faster data transfer rates and supports a higher bandwidth, improving overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature of 260°C ensures proper soldering and assembly processes, contributing to product reliability.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable soldering and assembly of the microprocessor onto circuit boards, ensuring stable connections.

Length: 20 mm

The 20mm length offers a compact form factor, suitable for handheld devices, IoT applications, and other space-sensitive designs.

Temperature Grade: INDUSTRIAL

Designed for industrial use, the microprocessor meets stringent temperature and reliability requirements, making it suitable for harsh environments.

Peripheral IC Type: MICROPROCESSOR, RISC

As a RISC-based microprocessor, it offers simplified instruction sets and faster execution speeds, enhancing the overall performance efficiency.

RAM Bytes: 32768

With 32768 RAM bytes, the microprocessor provides sufficient memory for data storage and processing, enabling multitasking and efficient operation.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high-speed operation, and overall reliability, making it ideal for battery-powered devices.

Terminal Form: GULL WING

The gull wing terminal form offers enhanced mechanical strength and easy soldering, ensuring secure connections and robust assembly.

Maximum Supply Current: 20 mA

With a maximum supply current of 20mA, the microprocessor operates efficiently within specified power limits, ensuring reliable performance.

Nominal Supply Voltage: 2.5 V

The 2.5V nominal supply voltage provides stable power delivery for consistent performance, contributing to the overall reliability of the microprocessor.

ROM Programmability: FLASH

The flash ROM programmability allows for easy updating of firmware and software, enabling flexibility and future-proofing of the product.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch offers high-density packaging and facilitates precise connections, making the microprocessor suitable for compact designs.

Format: FIXED POINT

Operating in fixed-point format simplifies numerical calculations and improves computational efficiency, making the microprocessor ideal for real-time applications.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the microprocessor can withstand moderate exposure to moisture during handling and assembly processes, ensuring product reliability.

Speed: 24 rpm

Operating at a speed of 24 rpm, the microprocessor offers fast processing capabilities, suitable for real-time data handling and high-performance tasks.

Low Power Mode: YES

The low power mode feature allows the microprocessor to conserve energy during idle or low-demand periods, prolonging battery life and reducing power consumption.

Technical Specifications

Microprocessors CP3BT26G18AWMX/NOPB attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

16

Boundary Scan:

YES

CPU Family:

CR16C

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PQFP-G128

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

CP3BT26G18AWMX/NOPB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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