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P3041NXN7PNC

NXP Semiconductors

P3041NXN7PNC by NXP Semiconductors

The NXP Semiconductors P3041NXN7PNC microprocessor features integrated cache, operates at a max clock frequency of 133 MHz, and has low power mode. It is used in applications requiring high-speed processing with a nominal voltage of 1 V and CMOS technology.

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In-Stock Inventory

1k+

P3041NXN7PNC by NXP Semiconductors
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Verical

USA . 558 parts In-Stock

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Flip Electronics (Authorized)

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Vyrian

USA . 8,643 parts In-Stock

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Digiode

USA . 2,130 parts In-Stock

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Anansix

USA . 1,652 parts In-Stock

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Flip Electronics

USA . 558 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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One Stop Electronics

USA . 13 parts In-Stock

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$16.000

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Ampacity Inc.

Singapore . 100 parts In-Stock

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$21.000

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$26.561

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$24.171

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$21.780

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Corohmni

South Africa . 108 parts In-Stock

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$81.445

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Microchip USA

USA . 248 parts In-Stock

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$488.773

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UNI Independent Distributors

Spain . 5,462 parts In-Stock

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Corphita

USA . 4,655 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Aranea Global

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Overview

Unleash the power of innovation with the P3041NXN7PNC microprocessor by NXP Semiconductors. Designed for cutting-edge applications, this high-quality component offers integrated cache and low power mode, ensuring optimal performance while minimizing energy consumption. With a maximum clock frequency of 133 MHz, this processor delivers lightning-fast processing speeds, making it ideal for a wide range of industries. Trust NXP Semiconductors to provide you with top-of-the-line technology that exceeds expectations and unlocks endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the microprocessor, making it suitable for a variety of applications.

Integrated Cache: YES

Having integrated cache helps improve processing speed and efficiency, making the microprocessor a high-performing option.

Surface Mount: YES

Surface mount technology allows for easy installation and replacement of the microprocessor, making it convenient for users.

Maximum Supply Voltage: 1.04 V

The maximum supply voltage of 1.04 V ensures efficient power usage and helps prevent damage to the microprocessor.

No. of Terminals: 1295

With a high number of terminals, this microprocessor can handle a large amount of data and connections, making it versatile for various tasks.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact and efficient design for the microprocessor, allowing for space-saving installation.

Maximum Clock Frequency: 133 MHz

This high clock frequency enables fast data processing and multitasking capabilities, making the microprocessor ideal for demanding applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making the microprocessor energy-efficient and reliable.

Technical Specifications

Microprocessors P3041NXN7PNC attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

0

Boundary Scan:

YES

Maximum Clock Frequency:

133 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1295

JESD-609 Code:

e1

Length:

37.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.53 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.04 V

Minimum Supply Voltage:

.96 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

37.5 mm

Peripheral IC Type:

Trade Compliance

P3041NXN7PNC Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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