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STM32MP157AAA3

STMicroelectronics

STM32MP157AAA3 by STMicroelectronics

STM32MP157AAA3 by STMicroelectronics is a 32-bit microprocessor with a max clock frequency of 64 MHz. It has 724992 RAM words and operates in an industrial temperature grade range (-40 to 125 °C). This microprocessor is commonly used in applications requiring high-speed processing and reliable performance.

Median Price

$15.242

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 150 parts In-Stock

1+ parts

$9.233

100+ parts

-

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-

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150

$9.233

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-

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Arrow

USA . 535 parts In-Stock

1+ parts

$10.976

100+ parts

$9.073

1k+ parts

$8.983

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-

535

$10.976

$9.073

$8.983

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Chip1Stop

Japan . 635 parts In-Stock

1+ parts

$15.242

100+ parts

$10.500

1k+ parts

-

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635

$15.242

$10.500

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-

DigiKey

USA . 84 parts In-Stock

1+ parts

$17.190

100+ parts

$11.877

1k+ parts

$11.025

10k+ parts

-

84

$17.190

$11.877

$11.025

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Mouser Electronics

USA . 258 parts In-Stock

1+ parts

$19.120

100+ parts

$13.050

1k+ parts

$11.610

10k+ parts

-

258

$19.120

$13.050

$11.610

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Future Electronics

Canada . 420 parts In-Stock

1+ parts

-

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$8.210

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420

-

-

$8.210

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RS (Exports)

UK . 420 parts In-Stock

1+ parts

-

100+ parts

$22.992

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-

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420

-

$22.992

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EBV Elektronik

Germany . 252 parts In-Stock

1+ parts

-

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-

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252

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Distributors (In-Stock)

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Digiode

USA . 3,012 parts In-Stock

1+ parts

$14.480

100+ parts

-

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3,012

$14.480

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-

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Nova Conductors

Japan . 48 parts In-Stock

1+ parts

$20.220

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-

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48

$20.220

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Flip Electronics

USA . 260,000 parts In-Stock

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-

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260,000

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Chip Stock

USA . 38,000 parts In-Stock

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38,000

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Vyrian

USA . 4,040 parts In-Stock

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4,040

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Anansix

USA . 2,751 parts In-Stock

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2,751

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Fibra_Brandt Electronic GMBH

Germany . 1,008 parts In-Stock

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1,008

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-

-

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TME

Poland . 252 parts In-Stock

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-

100+ parts

$11.920

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-

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252

-

$11.920

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 424 parts In-Stock

1+ parts

$7.490

100+ parts

$7.303

1k+ parts

$7.265

10k+ parts

-

424

$7.490

$7.303

$7.265

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Corphita

USA . 146 parts In-Stock

1+ parts

$13.718

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-

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146

$13.718

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Ampacity Inc.

Singapore . 199 parts In-Stock

1+ parts

$16.300

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199

$16.300

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Continental Prestige Electronics

USA . 63 parts In-Stock

1+ parts

$18.990

100+ parts

-

1k+ parts

-

10k+ parts

$18.610

63

$18.990

-

-

$18.610

Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

$20.220

100+ parts

$19.209

1k+ parts

-

10k+ parts

$17.996

100

$20.220

$19.209

-

$17.996

Vigor

Singapore . 369 parts In-Stock

1+ parts

$22.060

100+ parts

-

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-

10k+ parts

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369

$22.060

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-

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Modulus Dynamics

Lithuania . 98 parts In-Stock

1+ parts

$22.444

100+ parts

$22.220

1k+ parts

$21.546

10k+ parts

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98

$22.444

$22.220

$21.546

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Corohmni

South Africa . 73 parts In-Stock

1+ parts

$51.212

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73

$51.212

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IDEA Electronic Components Group

UK . 1,467 parts In-Stock

1+ parts

$70.497

100+ parts

-

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$63.447

10k+ parts

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1,467

$70.497

-

$63.447

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Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$73.809

100+ parts

$70.118

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$70.118

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600

$73.809

$70.118

$70.118

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Aztec Data Supply Inc.

USA . 1,388 parts In-Stock

1+ parts

$82.780

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1,388

$82.780

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MKK Technologies

India . 2,171 parts In-Stock

1+ parts

$132.565

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2,171

$132.565

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DigiPath Technology Company

USA . 2,171 parts In-Stock

1+ parts

$132.565

100+ parts

-

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2,171

$132.565

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GreenTree Electronics

Israel . 256,620 parts In-Stock

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256,620

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Perfect Parts

USA . 203,213 parts In-Stock

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203,213

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Authorized Procurement Solutions

USA . 100,147 parts In-Stock

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100,147

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Lixinc

USA . 5,742 parts In-Stock

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5,742

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Argo Parts USA

USA . 4,441 parts In-Stock

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4,441

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-

-

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Parana Technologies

USA . 2,282 parts In-Stock

1+ parts

-

100+ parts

$84.290

1k+ parts

-

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2,282

-

$84.290

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Robosynatics

Brazil . 250 parts In-Stock

1+ parts

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-

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250

-

-

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Lucentia Tech

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$0.077

1k+ parts

$0.077

10k+ parts

$0.077

250

-

$0.077

$0.077

$0.077

Glotronic Ltd.

UK . 176 parts In-Stock

1+ parts

-

100+ parts

-

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176

-

-

-

-

Overview

Experience the power of the STM32MP157AAA3 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics brings you the highest quality microprocessors for all your needs. Whether you're looking to design cutting-edge IoT devices or develop advanced industrial applications, this product offers unparalleled value and benefits. With its integrated cache and low power mode, the STM32MP157AAA3 delivers exceptional performance while optimizing energy efficiency. Its wide range of applications, combined with its compact package shape and surface mount capability, make it the perfect choice for any project. Trust STMicroelectronics and unlock endless possibilities with the STM32MP157AAA3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for its durability and ability to withstand high temperatures, making it a reliable choice for electronic components.

Integrated Cache: YES

Having integrated cache helps in improving the performance of the microprocessor by reducing the access time to frequently used data.

Surface Mount: YES

Surface mount technology allows for easy and compact installation of the microprocessor on a circuit board, saving space and enabling efficient assembly.

Maximum Supply Voltage: 1.25 V

The maximum supply voltage of 1.25 V ensures safe operation of the microprocessor within specified limits, preventing damage due to overvoltage.

On Chip Data RAM Width: 8

Having a wider on-chip data RAM width of 8 allows for faster data transfers and processing, enhancing the overall performance of the microprocessor.

Address Bus Width: 26

A wider address bus width of 26 enables the microprocessor to access a larger memory space, allowing for more efficient data storage and retrieval.

Package Shape: SQUARE

The square package shape helps in optimizing space utilization on the circuit board, allowing for a more compact and organized layout.

Bit Size: 32

With a bit size of 32, this microprocessor is capable of processing 32 bits of data at a time, enhancing its computational capabilities and efficiency.

No. of Terminals: 448

Having a high number of terminals provides more connectivity options and flexibility in system design, allowing for seamless integration into various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact and lightweight design, making it suitable for space-constrained applications while ensuring efficient heat dissipation and signal integrity.

Minimum Supply Voltage: 0.85 V

The minimum supply voltage of 0.85 V ensures that the microprocessor can operate at lower power consumption levels, improving energy efficiency and reducing heat generation.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C allows the microprocessor to function reliably in harsh environmental conditions without risking performance degradation or damage.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures that the microprocessor can operate effectively in cold environments without compromising its performance.

Terminal Position: BOTTOM

Having the terminal position at the bottom simplifies the installation process and enables easy connection to other components on the circuit board, streamlining the assembly process.

Maximum Seated Height: 1.32 mm

The low maximum seated height of 1.32 mm allows for a slim profile and compact design, making it suitable for applications with limited space constraints.

RAM Words: 724992

With a high number of RAM words, this microprocessor can store and process a large amount of data simultaneously, enhancing its multitasking capabilities and overall performance.

Width: 18 mm

The moderate width of 18 mm ensures compatibility with standard mounting configurations and allows for easy integration into various electronic systems.

Boundary Scan: YES

Having boundary scan capability enhances the testability and debuggability of the microprocessor, enabling efficient fault detection and diagnosis during manufacturing and operation.

Maximum Clock Frequency: 64 MHz

The high maximum clock frequency of 64 MHz allows the microprocessor to execute instructions at a faster rate, improving overall system performance and responsiveness.

Length: 18 mm

The moderate length of 18 mm ensures a balanced form factor and facilitates easy integration into various electronic devices and systems.

Temperature Grade: INDUSTRIAL

Being designed for industrial temperature ranges, this microprocessor can withstand harsh operating conditions and ensure reliable performance in demanding environments.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor, it offers simplified instruction sets, efficient data processing, and reduced power consumption, making it ideal for high-performance computing applications.

Technology: CMOS

Utilizing CMOS technology allows for low power consumption, high speed, and enhanced reliability, making this microprocessor suitable for a wide range of battery-powered and portable devices.

Terminal Form: BALL

Having ball terminal form simplifies the soldering and mounting process, ensuring reliable electrical connections and facilitating efficient heat dissipation.

Maximum Supply Current: 1000 mA

The high maximum supply current of 1000 mA ensures stable and consistent power delivery to the microprocessor, supporting its optimum performance under varying load conditions.

Nominal Supply Voltage: 0.9 V

The nominal supply voltage of 0.9 V ensures efficient power consumption and stable operation of the microprocessor within specified voltage limits, enhancing its reliability and longevity.

No. of DMA Channels: 48

Having a high number of DMA channels provides efficient data transfer and processing capabilities, enabling seamless communication between peripherals and the microprocessor for high-speed operation.

Terminal Pitch: 0.8 mm

The narrow terminal pitch of 0.8 mm allows for compact and space-saving mounting configurations, facilitating easy integration into densely packed electronic systems.

Format: FLOATING POINT

Supporting floating-point operations enhances the microprocessor's computational capabilities and enables more precise and efficient numerical calculations required in scientific and engineering applications.

Speed: 650 rpm

The high speed of 650 rpm enables fast data processing and execution of instructions, ensuring quick response times and smooth operation of the microprocessor in demanding applications.

Low Power Mode: YES

The low power mode feature allows the microprocessor to operate in a power-efficient state when not performing intensive tasks, reducing energy consumption and heat dissipation for improved efficiency.

Technical Specifications

Microprocessors STM32MP157AAA3 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

64 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B448

Length:

18 mm

Low Power Mode:

YES

No. of DMA Channels:

48

No. of Terminals:

448

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA448,22X22,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Words:

724992

Maximum Seated Height:

1.32 mm

Speed:

650 rpm

Maximum Supply Current:

1000 mA

Maximum Supply Voltage:

1.25 V

Minimum Supply Voltage:

.85 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

18 mm

Peripheral IC Type:

Trade Compliance

STM32MP157AAA3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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