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XAM5718AABCXEA

Texas Instruments

XAM5718AABCXEA by Texas Instruments

XAM5718AABCXEA by Texas Instruments is a microprocessor with 32-bit external data bus width, 16-bit address bus width, and max clock frequency of 38.4 MHz. It is used in industrial applications requiring low power mode and features a CMOS technology with terminal finish of Tin Silver Copper.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,009 parts In-Stock

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8,009

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Digiode

USA . 1,342 parts In-Stock

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1,342

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Rebound Electronics

UK . 23 parts In-Stock

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23

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 465 parts In-Stock

1+ parts

$6.000

100+ parts

$5.850

1k+ parts

$5.820

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465

$6.000

$5.850

$5.820

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AZTECH Wire

Italy . 633 parts In-Stock

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$11.027

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633

$11.027

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Ampacity Inc.

Singapore . 519 parts In-Stock

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$28.000

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519

$28.000

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One Stop Electronics

USA . 1,275 parts In-Stock

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$29.000

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$29.000

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Parana Technologies

USA . 1,539 parts In-Stock

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$57.829

100+ parts

$5,370.266

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$52.046

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1,539

$57.829

$5,370.266

$52.046

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DigiPath Technology Company

USA . 1,241 parts In-Stock

1+ parts

$63.676

100+ parts

$58.582

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1,241

$63.676

$58.582

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ChromeModa Solutions

Germany . 280 parts In-Stock

1+ parts

$64.976

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$53.280

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280

$64.976

$53.280

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IDEA Electronic Components Group

UK . 55 parts In-Stock

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$64.976

100+ parts

$61.727

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$58.478

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55

$64.976

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$58.478

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Continental Prestige Electronics

USA . 5,060 parts In-Stock

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Argo Parts USA

USA . 4,540 parts In-Stock

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Corphita

USA . 776 parts In-Stock

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776

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Unlock the power of innovation with the XAM5718AABCXEA by Texas Instruments, a high-quality microprocessor designed to revolutionize your electronic devices. With cutting-edge technology and superior performance, Texas Instruments is known for delivering top-notch products that exceed expectations. Ideal for a wide range of applications, this microprocessor offers unmatched value, efficiency, and reliability. Experience seamless operation and enhanced functionality with the XAM5718AABCXEA, setting new standards in the industry. Elevate your projects with Texas Instruments and discover endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable devices.

Maximum Supply Voltage: 1.2 V

Efficient power management with a maximum supply voltage of 1.2V for optimal performance.

Package Shape: SQUARE

Square shape allows for easier placement and layout on circuit boards, optimizing space usage.

Maximum Operating Temperature: 105 °C

Can withstand high operating temperatures, suitable for industrial environments with varying temperature conditions.

External Data Bus Width: 32

Wide external data bus width of 32 bits enables fast data transfer and processing capabilities.

Speed: 1500 rpm

High speed of 1500 rpm ensures efficient performance and quick response times.

Technical Specifications

Microprocessors XAM5718AABCXEA attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.96 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

XAM5718AABCXEA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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