Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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XAM5708ACBDJEA by Texas Instruments is a microprocessor with 32-bit external data bus width, operating at up to 38.4 MHz clock frequency. It features a low power mode and industrial temperature grade, making it suitable for applications requiring high-speed processing in harsh environments. With a package style of grid array and 538 terminals, this CMOS technology-based processor is ideal for compact electronic devices.
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Corphita
This material is lightweight, durable, and cost-effective, making it ideal for portable devices or products that require frequent handling.
Surface mount technology allows for efficient assembly and compact designs, making the product suitable for small form factor applications.
A low maximum supply voltage helps reduce power consumption and heat dissipation, making the product energy-efficient.
A wider address bus allows for larger memory capacity and faster data transfer, enhancing the performance of the microprocessor.
A square package shape provides uniformity in design and allows for efficient use of space on circuit boards.
A higher number of terminals enable more connections and functionalities, increasing the versatility of the microprocessor.
This package style offers high density and reliability in interconnections, ensuring stable performance in challenging environments.
A low minimum supply voltage allows the microprocessor to operate efficiently even at lower power levels, extending battery life in portable devices.
With a high maximum operating temperature, the microprocessor can withstand extreme conditions without sacrificing performance or reliability.
The microprocessor can function reliably in cold environments, making it suitable for a wide range of applications and operating conditions.
Bottom terminal position simplifies assembly and installation processes, allowing for easier integration into circuit designs.
A low seated height profile enables compact and slim device designs, making the product ideal for space-constrained applications.
A compact width dimension allows for efficient placement on circuit boards, optimizing layout and enhancing overall system performance.
Boundary scan capability facilitates testing and debugging of the microprocessor, ensuring a higher level of quality and reliability in the final product.
A wider external data bus facilitates faster data transfer rates between the microprocessor and external peripherals, improving overall system performance.
A high maximum clock frequency allows for rapid data processing and improved responsiveness in real-time applications, making the product suitable for high-speed computing tasks.
A compact length dimension helps in minimizing board space requirements, enabling more efficient use of space in device designs.
The industrial temperature grade ensures reliable operation in harsh environments, making the microprocessor suitable for industrial applications with demanding temperature conditions.
The RISC architecture enhances processing speed and efficiency, making the microprocessor suitable for tasks requiring high computational performance.
CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable in various operating conditions.
Ball terminal form simplifies soldering and connection processes, ensuring reliable electrical contact and ease of assembly in circuit designs.
A stable nominal supply voltage ensures consistent performance and reliability of the microprocessor, making it suitable for critical applications.
A fine terminal pitch allows for compact and high-density integration of the microprocessor on circuit boards, optimizing space utilization in device designs.
Floating-point format supports complex mathematical calculations and enhances precision in numerical operations, making the microprocessor suitable for scientific and computational applications.
A high speed rating indicates the microprocessor's capability to process instructions quickly, ensuring fast response times and efficient multitasking in computing tasks.
The low power mode feature enables the microprocessor to operate efficiently at reduced power levels, conserving energy and extending battery life in portable devices.
Microprocessors XAM5708ACBDJEA attributes and parameters. Explore more Microprocessors devices from Texas Instruments
Address Bus Width:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
Length:
Low Power Mode:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
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XAM5708ACBDJEA Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
1N4148WT
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V; Terminal Finish: Tin/Lead (Sn/Pb);
BAV99
Panasonic
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
NE555D
Philips Semiconductors
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
MMBT2222ALT1G
Rochester Electronics
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .3 W; Maximum Collector Current (IC): .6 A;
Capar Components
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Forward Voltage (VF): 1 V; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Output Current: .15 A;
RC0603JR-070RL
Yageo
Yageo's RC0603JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. Its metal glaze/thick film technology and 0.1 W power dissipation make it ideal for jumper applications in various electronic devices.
SS14
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Surge Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LD1117S33CTR
STMicroelectronics
STMicroelectronics LD1117S33CTR is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 1.3A. It operates within an input voltage range of 4.75V to 15V, making it suitable for various applications requiring stable voltage regulation in compact designs. The device features low dropout voltage of 1.3V, high temperature operation up to 125°C, and small outline package style for space-constrained PCB layouts.
BSS138-TP
Micro Commercial Components
BSS138-TP by Micro Commercial Components is a N-channel small signal FET with a min DS breakdown voltage of 50V and max drain current of 0.22A. It is commonly used in applications requiring enhancement mode operation, such as power management and switching circuits.
2N7002
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Operating Mode: ENHANCEMENT MODE; Transistor Application: SWITCHING;
FT232RL-TUBE
FTDI
FTDI's FT232RL-TUBE is a bus controller with 28 terminals, operating at 3.3-5.25V. It supports USB, VBUS, and UART interfaces with a data transfer rate of 60MBps. Ideal for industrial applications requiring RS232/RS422/RS485 compatibility in compact designs due to its small outline package style.
LM7805CT
Silicon Group
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Package Body Material: PLASTIC/EPOXY; Maximum Load Regulation: .05 %;
CR0805-FX-10R0ELF
Bourns
Bourns CR0805-FX-10R0ELF is a SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for applications requiring a temperature range of -55 to 155 °C, such as automotive electronics and industrial control systems.
M39029/58-360
Tri-star Electronics International
CONNECTOR ACCESSORY; Material: COPPER ALLOY; MIL Conformity: YES; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; MIL-Connector Accessory Name: CONTACT; Terminal Type: CRIMP;
Gec Plessey Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain Current (ID): .115 A; Operating Mode: ENHANCEMENT MODE;
BSS138
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Terminals: 3; Maximum Drain Current (ID): .2 A; Operating Mode: ENHANCEMENT MODE;
MPC8270VVUPEA
The NXP Semiconductors MPC8270VVUPEA microprocessor features a 32-bit address bus width, 64-bit external data bus width, and max clock frequency of 100 MHz. Ideal for commercial applications requiring high-speed processing capabilities in a compact package with boundary scan support.
MCIMX6X1EVK10AB
Freescale Semiconductor
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6S1AVM08AB
MCIMX6S1AVM08AB by NXP Semiconductors is a 64-bit microprocessor with 32-bit external data bus width, operating at a max clock frequency of 24 MHz. Ideal for automotive applications, it features low power mode and integrated cache, with a temperature range from -40 to 125 °C.
MPC8280CZUUPEA
The NXP Semiconductors MPC8280CZUUPEA is a 32-bit microprocessor with integrated cache and 64-bit external data bus width. It operates at a max clock frequency of 100 MHz, suitable for commercial-grade applications requiring high-speed processing. The package style is grid array, low profile, making it ideal for compact electronic devices.
MCIMX537CVV8CR2
MCIMX537CVV8CR2 by NXP Semiconductors is a 32-bit microprocessor with integrated cache and 16-bit address bus width. Ideal for automotive applications, it operates at speeds up to 27 MHz with low power mode support. The package style is grid array, featuring a max supply voltage of 1.15 V and operating temperature range from -40 to 125 °C.
MCF53721CVM240
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: BGA; Package Shape: SQUARE;
MCIMX6S4AVM08AB
MCIMX6S4AVM08AB by NXP Semiconductors is a 64-bit microprocessor with 32-bit external data bus width, operating at up to 24 MHz. Ideal for automotive applications, it features integrated cache, low power mode, and boundary scan capabilities.
MIMXRT1021DAG5A
NXP Semiconductors' MIMXRT1021DAG5A microprocessor features 32-bit architecture, 262144 RAM words, and 24 MHz clock frequency. Ideal for applications requiring low power mode, it offers 96 I/O lines and integrated ADC and PWM channels for versatile usage in various embedded systems.
MC7455ARX933LG
Motorola
Motorola MC7455ARX933LG is a 32-bit microprocessor with integrated cache, operating at 933 rpm. It features a 64-bit external data bus width and runs on CMOS technology. Ideal for applications requiring high processing speeds and low power consumption in compact devices.
MPC860TCZQ66D4
NXP Semiconductors' MPC860TCZQ66D4 microprocessor features 32-bit address and external data bus width, with a max clock frequency of 50 MHz. Ideal for low power applications, it operates at a speed of 66 rpm and supports integrated cache memory. Suitable for various embedded systems requiring high processing capabilities.
STM32MP135FAG7
STM32MP135FAG7 by STMicroelectronics is a 32-bit microprocessor with 172032 RAM words, 48 MHz clock frequency, and 56 DMA channels. It is used in applications requiring high-speed processing, low power consumption, and integrated cache memory.
14305R-500
Echelon
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
SPC5200CVR400BR2
NXP Semiconductors' SPC5200CVR400BR2 microprocessor features 32-bit address and external data bus width, with a max clock frequency of 66 MHz. Suitable for industrial applications, it operates b/w -40 to 85 °C, with low power mode and integrated cache for efficient performance.
MC9328MX1CVM15R2
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;
N80C188-12
Advanced Micro Devices
MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE;
SAM9X60D6KT-I/4GB
Microchip Technology
SAM9X60D6KT-I/4GB by Microchip features 16 DMA channels, 50MHz clock frequency, and 1.8V nominal voltage. Ideal for industrial applications requiring a low power mode, this microprocessor with integrated cache and 16-bit external data bus width is designed for high-speed processing in compact systems.
MPC5200CVR400B
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE;
MCF5272VM66
NXP Semiconductors' MCF5272VM66 microprocessor features 32-bit architecture, 23-bit address bus width, and integrated cache. Ideal for commercial applications, it operates at a max clock frequency of 66 MHz with low power mode support.
AM3354BZCZ60
Texas Instruments
AM3354BZCZ60 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 16-bit external data bus width, and max clock frequency of 26 MHz. It is ideal for applications requiring low power mode, such as embedded systems and IoT devices.
AM6412BSCGGAALV
AM6412BSCGGAALV by Texas Instruments is a 64-bit microprocessor with integrated cache and 16-bit on-chip data RAM. It operates at a max clock frequency of 25 MHz, making it suitable for high-speed computing applications. The package style is grid array, fine pitch, with a terminal pitch of 0.8 mm, ideal for compact designs requiring low power consumption.
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TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
XAM5718AABCXEA
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 760; Package Code: FBGA; Package Shape: SQUARE;
XAM5728BABCXE
XAM5728BABCXE by Texas Instruments is a microprocessor with 32-bit external data bus width, 16-bit address bus width, and max clock frequency of 38.4 MHz. It is used in applications requiring low power mode, such as embedded systems and IoT devices.
XAM5749ABZXEA
XAM5749ABZXEA by Texas Instruments is a microprocessor with integrated cache and a max clock frequency of 38.4 MHz. It has a square package, with 760 terminals and a low profile design. This microprocessor is commonly used in industrial applications due to its temperature grade and CMOS technology.
XAM5706ACBDJEA
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 538; Package Code: LFBGA; Package Shape: SQUARE;
XAM5708BCBDJEA
XAM5718ABCXE
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 760; Package Code: FBGA; Package Shape: SQUARE;
XAM5728AABCXE
XAM5746ABZXEA
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 760; Package Code: BGA; Package Shape: SQUARE;
XAM5748ABZXEA
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