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XAM5708ACBDJEA

Texas Instruments

XAM5708ACBDJEA by Texas Instruments

XAM5708ACBDJEA by Texas Instruments is a microprocessor with 32-bit external data bus width, operating at up to 38.4 MHz clock frequency. It features a low power mode and industrial temperature grade, making it suitable for applications requiring high-speed processing in harsh environments. With a package style of grid array and 538 terminals, this CMOS technology-based processor is ideal for compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,738 parts In-Stock

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Digiode

USA . 825 parts In-Stock

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825

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Distributors (Availability)

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AZTECH Wire

Italy . 422 parts In-Stock

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$5.990

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422

$5.990

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One Stop Electronics

USA . 1,323 parts In-Stock

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$19.000

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$19.000

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Parana Technologies

USA . 1,826 parts In-Stock

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$71.219

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DigiPath Technology Company

USA . 1,950 parts In-Stock

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$78.421

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$72.147

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1,950

$78.421

$72.147

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ChromeModa Solutions

Germany . 4,835 parts In-Stock

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$80.021

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$65.617

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4,835

$80.021

$65.617

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IDEA Electronic Components Group

UK . 2,087 parts In-Stock

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$80.021

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$76.020

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$72.019

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2,087

$80.021

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$72.019

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 1,147 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the XAM5708ACBDJEA by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge microprocessors that are ideal for a wide range of applications. With a low profile design and advanced technology, this microprocessor offers customers value, efficiency, and versatility like never before. Upgrade your systems with the XAM5708ACBDJEA and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making it ideal for portable devices or products that require frequent handling.

Surface Mount: YES

Surface mount technology allows for efficient assembly and compact designs, making the product suitable for small form factor applications.

Maximum Supply Voltage: 1.2 V

A low maximum supply voltage helps reduce power consumption and heat dissipation, making the product energy-efficient.

Address Bus Width: 16

A wider address bus allows for larger memory capacity and faster data transfer, enhancing the performance of the microprocessor.

Package Shape: SQUARE

A square package shape provides uniformity in design and allows for efficient use of space on circuit boards.

No. of Terminals: 538

A higher number of terminals enable more connections and functionalities, increasing the versatility of the microprocessor.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high density and reliability in interconnections, ensuring stable performance in challenging environments.

Minimum Supply Voltage: 1.11 V

A low minimum supply voltage allows the microprocessor to operate efficiently even at lower power levels, extending battery life in portable devices.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the microprocessor can withstand extreme conditions without sacrificing performance or reliability.

Minimum Operating Temperature: -40 °C

The microprocessor can function reliably in cold environments, making it suitable for a wide range of applications and operating conditions.

Terminal Position: BOTTOM

Bottom terminal position simplifies assembly and installation processes, allowing for easier integration into circuit designs.

Maximum Seated Height: 1.298 mm

A low seated height profile enables compact and slim device designs, making the product ideal for space-constrained applications.

Width: 17 mm

A compact width dimension allows for efficient placement on circuit boards, optimizing layout and enhancing overall system performance.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging of the microprocessor, ensuring a higher level of quality and reliability in the final product.

External Data Bus Width: 32

A wider external data bus facilitates faster data transfer rates between the microprocessor and external peripherals, improving overall system performance.

Maximum Clock Frequency: 38.4 MHz

A high maximum clock frequency allows for rapid data processing and improved responsiveness in real-time applications, making the product suitable for high-speed computing tasks.

Length: 17 mm

A compact length dimension helps in minimizing board space requirements, enabling more efficient use of space in device designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments, making the microprocessor suitable for industrial applications with demanding temperature conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture enhances processing speed and efficiency, making the microprocessor suitable for tasks requiring high computational performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable in various operating conditions.

Terminal Form: BALL

Ball terminal form simplifies soldering and connection processes, ensuring reliable electrical contact and ease of assembly in circuit designs.

Nominal Supply Voltage: 1.15 V

A stable nominal supply voltage ensures consistent performance and reliability of the microprocessor, making it suitable for critical applications.

Terminal Pitch: 0.65 mm

A fine terminal pitch allows for compact and high-density integration of the microprocessor on circuit boards, optimizing space utilization in device designs.

Format: FLOATING POINT

Floating-point format supports complex mathematical calculations and enhances precision in numerical operations, making the microprocessor suitable for scientific and computational applications.

Speed: 1000 rpm

A high speed rating indicates the microprocessor's capability to process instructions quickly, ensuring fast response times and efficient multitasking in computing tasks.

Low Power Mode: YES

The low power mode feature enables the microprocessor to operate efficiently at reduced power levels, conserving energy and extending battery life in portable devices.

Technical Specifications

Microprocessors XAM5708ACBDJEA attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B538

Length:

17 mm

Low Power Mode:

YES

No. of Terminals:

538

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.298 mm

Speed:

1000 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

XAM5708ACBDJEA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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