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XPC860SRZP50C1

Motorola

XPC860SRZP50C1 by Motorola

XPC860SRZP50C1 by Motorola is a 32-bit RISC microprocessor with a clock frequency of 50 MHz. It operates at a supply voltage range of 3.135V to 3.465V, making it suitable for high-speed computing applications requiring low power consumption in compact devices. With a grid array package style and ball terminal form, this processor is ideal for surface mount designs with limited space constraints.

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Overview

Experience the pinnacle of performance with the XPC860SRZP50C1 by Motorola. Crafted with precision and expertise, this microprocessor offers unparalleled speed and efficiency for a wide range of applications. From industrial automation to communication systems, this cutting-edge technology delivers seamless operation and reliability. Trust in Motorola's legacy of innovation and quality to elevate your projects to new heights. Unlock the potential of advanced processing power with the XPC860SRZP50C1 and witness the difference it can make in your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microprocessors, providing good insulation and protection for the internal components.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.465 V

Higher maximum supply voltage provides flexibility in power requirements for different applications.

Address Bus Width: 32

A wider address bus allows for larger memory capacity and more efficient data processing.

Package Shape: SQUARE

Square package shape facilitates easier placement and alignment on circuit boards.

Bit Size: 32

32-bit architecture allows for faster and more efficient data processing compared to lower bit sizes.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures consistent performance and reliability of the microprocessor.

No. of Terminals: 357

Higher number of terminals allows for more connections and functionality with external components.

Package Style (Meter): GRID ARRAY

Grid array package style offers better thermal performance and mechanical strength for the microprocessor.

Minimum Supply Voltage: 3.135 V

Low minimum supply voltage helps in conserving power and reducing energy consumption.

Minimum Operating Temperature: 0 °C

Ability to operate at 0°C ensures reliable performance in various environmental conditions.

Terminal Finish: TIN LEAD

Tin lead finish on terminals provides good solderability and long-term durability for the connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easier and more secure mounting on circuit boards.

Maximum Seated Height: 2.05 mm

Low maximum seated height enables compact and slim design for space-constrained applications.

Width: 25 mm

Standard width of 25mm for easy integration into various electronic devices and systems.

External Data Bus Width: 32

Matching external data bus width of 32 for efficient data transfer between the microprocessor and external components.

Maximum Clock Frequency: 50 MHz

High maximum clock frequency of 50 MHz ensures fast processing speed and response time for real-time applications.

Length: 25 mm

Standard length of 25mm for compatibility with industry-standard mounting and spacing requirements.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture in microprocessors enables efficient and streamlined data processing for improved performance.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable operation for the microprocessor.

Terminal Form: BALL

Ball terminal form provides good electrical contact and thermal performance for the connections.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent and reliable performance of the microprocessor.

Terminal Pitch: 1.27 mm

Standard terminal pitch of 1.27mm for compatibility with industry-standard circuit board designs and layouts.

Speed: 50 rpm

Operating speed of 50 rotations per minute allows for efficient data processing and quick response times.

Technical Specifications

Microprocessors XPC860SRZP50C1 attributes and parameters. Explore more Microprocessors devices from Motorola

Specs

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B357

JESD-609 Code:

e0

Length:

25 mm

No. of Terminals:

357

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA357,19X19,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Speed:

50 rpm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

25 mm

Peripheral IC Type:

Trade Compliance

XPC860SRZP50C1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Motorola

Motorola Solutions, Inc., is an American video equipment, telecommunications equipment, software, systems and services provider that succeeded Motorola, Inc., following the spinoff of the mobile phone division into Motorola Mobility in 2011. The company is headquartered in Chicago, Illinois.

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